HB26 Search Results

l1048

Abstract: 216000-1 cutout covers 216000-2
Contextual Info: ! DO NOT SC ALE M E T R IC DIMENSIONS IN m m 6.5Î0,35 0,00 THIRD A N ö lx PROJECTION 'C p ' — - -— NOTES: J \_ A M M M 19,2 BARREL TERMINALS WILL ACCEPT ONE OR TWO WIRES OF THE SAME SIZE PER TERMINAL. WIRE SIZE FOR SOLID AND STRANDED WIRES: 0 ,1 2 m m 2 2 6 A W G -0 ,3 5 m m 2 (2 2 AWG).

Contextual Info: M ITEL MP03 XX 260 Series Dual Diode Modules SEMICONDUCTOR Supersedes April 1993 version, 1.0 DS5104-2.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint

HB26

Contextual Info: DO NOT SC ALE M E T R IC DIMENSIONS IN m m 6 ,5 :°0.00 '35 THIRD ANGLE PROJECTION NOTES: r\_ A BARREL TERMINALS WILL ACCEPT ONE OR TWO WIRES OF THE SAME SIZE PER TERM INAL. WIRE SIZE FOR SOLID AND STRANDED WIRES: 0 ,1 2 m m ? 2 6 A W G -0 ,3 5 m m ? (2 2 AWG).

MP03A

Contextual Info: M ITEL MP03 XX 260 Series Dual Diode Modules SEMICONDUCTOR Supersedes April 1993 version, 1.0 DS5104-2.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina non-toxic Isolation Medium

MP03

Abstract: MP023 DS5104-3 ds5104
Contextual Info: MP03 XX 260 Series MP03 XX 260 Series Dual Diode Modules Replaces December 1998 version, DS5104-2.0 DS5104-3.0 January 2000 FEATURES KEY PARAMETERS VRRM 1600V IFSM 8100A 267A IF AV (per arm) Visol 2500V • Dual Device Module ■ Electrically Isolated Package

Contextual Info: MAX2309EGI Rev. A RELIABILITY REPORT FOR MAX2309EGI PLASTIC ENCAPSULATED DEVICES August 3, 2001 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl

yd 803 ic

Abstract: yd 803 ou equivalent ula 1u h692l transistor h331 H711 H224 CHN 708
Contextual Info: Order this data sheet by ETL/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA MCA750ETL MCA3200ETL MCA6200ETL Advance Information MCA3 ETL SERIES MACROCELL ARRAYS This specification establishes design and perform ance requirem ents fo r the M CA3 ETL Series M acrocell Arrays with mixed ECL, PECL, and TTL

H331 transistor

Abstract: transistor h331 HB26 HE02 ht33 transistor H375 L322 L817 L713 750ETL
Contextual Info: | y | Q jQ p Q | ^ Order this data sheet by ETL/D SEMICONDUCTOR TECHNICAL DATA MCA750ETL MCA3200ETL MCA6200ETL Advance Information MCA3 ETL SERIES MACROCELL ARRAYS This sp ecification establishes design and perform ance requirem ents fo r the M CA3 ETL Series M acrocell Arrays w ith mixed ECL, PECL, and TTL

ML35

Abstract: ML35PT ML31PT S7-200 SMC MARKING S6 SM4003S MARKING S6 smB SOD-123S USM2 s7 200
Contextual Info: SURFACE MOUNT DEVICES FOR HYBRID APPLICATIONS TYPE Marking Maximum Maximum Maximum Maximum Average Forward Peak Reverse Peak Rectified Current Surge Current Current Reverse @Half-Wave @ 25°C @ 8.3mS Voltage Resistive Load Superimposed TA IR IO PRV IFM Surge

G260-16

Abstract: MP02
Contextual Info: MP02 XX 260 Series MP02 XX 260 Series Dual Diode Modules Replaces December 1998 version, DS5102-3.0 DS5102-4.0 January 2000 FEATURES KEY PARAMETERS VRRM 1600V IFSM 8100A 267A IF AV (per arm) Visol 2500V • Dual Device Module ■ Electrically Isolated Package

2n3773 power Amplifier circuit diagrams

Abstract: SCR Handbook, rca HC2000H rca transistor npn a13 B0241C npn transistor RCA 467 40659 triac t6440m RCa T2850D DIAC D3202U
Contextual Info: RCA Power Devices This DATABOOK contains com­ plete technical information on the full line o f RCA solid-state power devices: power transistors, rf power transistors, power hybrid circuits, triacs, SCR’s, diacs, silicon rectifiers, and rectifier assemblies. A complete

st178

Abstract: diode E1110 CK705 ecg semiconductor replacement guide CS1237 ME1120 TE1088 1N942 1N733A Delco DTG-110B transistor
Contextual Info: S Y L V A N IA ECG S e m ic o n d u c to r L in eREPLACES OVER 35,000 TYPES introduction The ECG line of semiconductors is designed to minimize replacement parts inventory for the tech­ nician and yet economically meet replacement needs of the wide variety of entertainment equipment