H025 Search Results

Contextual Info: DATE REVISED: 1 2 /1 4 /0 9 CATALOG NUMBER H025— D32— 01 MATERIAL AND FINISH SNAP MOUNT AND PLUG HOUSING: CENTER CONTACT AND REAR HOUSING: DIELECTRICS: SPRING: RETAINING RING: CRES 3 0 3 ; PASSIVATED BeCu; GOLD PLATE 7 5 MICROINCHES TYPICAL OVER NICKEL PLATE 100 MICROINCHES TYPICAL

TK11280C

Abstract: tk11233c H025H TK11220C TK11260c TK11236C TK11245C TK11242C
Contextual Info: TK112xxCM/U アプリケーションマニュアル スイッチ付きLDO GC3-H025H レギュレータICのご紹介 TK112xxCM/U Page 1 TK112xxCM/U 特 長 ・PNP パワートランジスタ使用の為電池使用の場合には入出力電圧差が小さく、電源電圧をぎり

Contextual Info: Issue No. ： 12-SWDW-H025 October 30, 2012 Date of Issue ： Classification ： • New □ Change For General Distribution PRODUCT SPECIFICATION FOR APPROVAL Product Description Customers Part Number Product Part Number Country of Origin

h032

Contextual Info: BetaTHERM Sensors Custom and Standard Industrial Probes Style: H025 National Pipe Thread NPT Probes: Applications: ¥ Dialysis equipment liquid sensor. ¥ Hydraulic oil temperature sensing. ¥ Industrial liquid processing equipment for dairy and food industry.

Contextual Info: DATE REVISED: 9 /1 0 / 7 CATALOG NUMBER H025— D 11-01 MATERIAL AND FINISH FLANGE: CENTER CONTACT AND HOUSING: SNAP RING: DIELECTRICS: CRES 3 0 3 ; PASSIVATED BeCu; GOLD PLATE 5 0 - 1 0 0 MICROINCHES OVER NICKEL PLATE 5 0 MICROINCHES MIN. BeCu; NICKEL PLATE

MOM-15P

Abstract: 2s227 unc-28 H027
Contextual Info: Micro-D Metal Shell - .050" C o n tact Spacing MDM MDM connectors are used in applications requiring highly reliable, extremely small, lightweight connec­ tors with higher density contact configurations than available in traditional rectangular connectors. They

Hysol EE4198

Abstract: MIL-C-83513 M83513/5-07 MDM98479-89 MDM98479-86 MDM 9P PCB MIL-C-83513/5 322-9500-000 MDM-PCB MDM-21SBS
Contextual Info: The Micro Line - .050" Contact Spacing The Cannon MICRO Series established the standards for performance and reliability in mircominiature interconnects. Exceptionally versatile, MICRO connectors are available in rectangular, circular, and strip configurations, with 3 amp MICROPIN /

nec tokin oe 128

Abstract: MS-17171 MCP51M NEC Tokin od 108 c113 pc 100 3p3 nvidia c51mv PC017 MS17171 Athlon Neo X2 CM1616
Contextual Info: 5 4 3 MS-17171 Ver : 2.0 2 Processor 1 DDR2 Sodimm 0 AMD S1 638 pin uFCPGA 638 socket Battery Charger Page 6 DDR2 400 / 533 / 667 MHz Page 31 DDR2 Sodimm 1 Page 2,3,4,5 Battery select Page 6 Page 32 D D 16 X 16 Bit HyperTransport Link DRAM Power Page 33 North Bridge

MDM15S

Abstract: asd 2627 MDM 100 pin
Contextual Info: The heart of the Cannon MICROPIN/MICROSOCK­ ET contact system is a multi-element Twist Pin Contact recessed within an insulating housing. The rugged, cylindrical sockets are mounted in the exposed half of the connector. When connector halves are mated, the chamfered sockets are first

ADDS-2191-EZLITE

Abstract: JTAG ADSP-21XX AD1803 AD1885 ADSP2191 ADSP-2191
Contextual Info: ADSP-2191.qxd 2/25/02 4:51 PM Page 1 EZ-KIT Lite for Analog Devices ADSP-219x DSP Family. Key Featur es Attributes • ADSP-2191 DSP • AD1885 48 kHz AC’97 SoundMax codec • AD1803 low power modem codec • Telephony interface • 4 Mbits of FLASH memory

capacitor Y5S 022

Abstract: capacitors TPC Thomson csf ceramic capacitor THOMSON ELECTRONIQUES TUBES kyocera 433 k G WA03H-68 HD40-1000 ceramic disc capacitors stacks AVX BAR code ON THE label Thomson csf "high voltage ceramic capacitor"
Contextual Info: A KYOCERA GROUP COMPANY TPC Power Ceramic Capacitors TPC Introduction TPC, a subsidiary of THOMSON CSF, is a worldwide electronic component manufacturer, with over 40 years experience in ceramic capacitors and offers a complete package covering design, manufacture, just-in-time delivery

mt 1117

Contextual Info: Microminiature Strip - .100/.050" Contact Spacing MT Printed Circuit Board and Card Mounting Frame Applications. Contacts on .050 1.27 centers. mounting with high strength epoxy adhesive. In lengths over 2" (50.80) guides, rails or other systems should be used to assure alignment.

320-9505-006

Abstract: mdm 2000 Hysol HD3561 H023 HD3561 Hysol EE4198 MDM98479-92 951 series circular connector
Contextual Info: The Micro Line - .050" Contact Spacing The Cannon MICRO Series established the standards for performance and reliability in mircominiature interconnects. Exceptionally versatile, MICRO connectors are available in rectangular, circular, and strip configurations, with 3 amp MICROPIN /

Contextual Info: MITSUBISHI LSIs M5M4V4169TP-15,-20 4M 256K-WORD BY 16-BIT CACHED DRAM WITH 16K(1024-WORD BY 16-BIT)SRAM DESCRIPTION The M5M4V4169TP is a 4 M - b it Cached DRAW which integrates input registers, a 262, 1 4 4 - word by 1 6 - bit dynamic memory array and a 1024-w o rd by 1 6 - bit static

Hysol EE4198

Abstract: UNC-2B 2-56 STAINLESS STEEL NUT Hysol ee4215 10P10 MDM98479-86 ee4198 HD3561 Hysol HD3561 MDM97294-377 MDM98479-89
Contextual Info: Micro-D Metal Shell - .050" Contact Spacing MDM connectors are used in applications requiring highly reliable, extremely small, lightweight connectors with higher density contact configurations than available in traditional rectangular connectors. They are available in 8

CDR03 receiver

Abstract: varistor 250v 592 PH 105k 250v ceramic disc Piezoelectric crystal 1mhz ultrasonic FUSE T2A 250v Motorola transistor smd marking codes smps 10w 5V 230 AC to 5V dc smps capacitor type 104z 50v SR 0805 X7R capacitor
Contextual Info: MLC Capacitors Tantalum Capacitors Microwave Capacitors Thin Film Capacitors Glass Capacitors Chip Resistors Networks EMI Filters Bulk Filters Saw Filters Dielectric Filters Resonators Oscillators Thin Film Inductors Thin Film Fuses Voltage Suppressors Acoustical Piezos

h024

Abstract: 1/atmel h024
Contextual Info: LEAD FORMING SPECIFICATIONS Unit: mm Available for bulk packaging only DO-41 DO-15 7.6 5.2 2.7 3.6 B 0.8 B 0.8 A A H01 H02 H02-1 H02-2 H02-3 H02-4 H02-5 H03 H03-1 H03-2 A B 12.5 1.0 10.0 0.5 6.4 0.5 10.0 0.5 5.0 0.5 10.0 0.5 4.5 0.5 10.3 0.5 5.0 0.5 10.0 0.5 10.0 0.5

PC200

Abstract: DQ2880
Contextual Info: . Preliminary IBM16M64644HGA IBM16M32644HGA IBM16M64734HGA IBM16M32734HGA 32/64Mx64/72 1 or 2 Bank Registered DDR SDRAM Module Features • 184-Pin Registered 8-Byte Dual In-Line Memory Module • 32M/64Mx72 and x64 Double Data Rate DDR SDRAM DIMM (32M X 8 SDRAMS)

D SUB connector ITT Cannon

Abstract: MDM-15P Hysol HD3561 WC28 MDM-25P 2-56UNC-2B A141 A172 MIL-C-83513 MDM-100P
Contextual Info: MDM Micro-D M etal Shell - .050" C en ter Spacing P IN /M IC R O SO C K E T™ contacts on .0 50 1.27 centers in a contact density identical to the stan­ dard M ICRO-D connector series, but with these additional features: MDM connectors are used in applications requiring

mt 10p10

Abstract: A106 Micro Capacitor 031-9540-000 MT A 10P10 2DA31P 2DC79P 2DA31S 2DC79S 995-0001-338 Hysol EE4198
Contextual Info: Electronic Components Cannon Microminiature Connectors Customer Support Locations ASIA Tuopandun Industrial Area, Jinda Cheng, Xiner Village, Shajing Town, Baoan District, Shenzhen City, Guangdong, China 518125 Phone: 86 755 2726 7238 Fax: (86) 755 2726 7515

JTAG ADSP-21XX

Abstract: AD1836 AD1852 ADSP-21161N
Contextual Info: ADSP-21161N.qxd 2/25/02 4:57 PM Page 1 EZ-KIT Lite for Analog Devices ADSP-21161N SHARC DSP. Key Featur es Attributes • ADSP-21161N SHARC DSP • 48 Mbit SDRAM • AD1836 96 kHz audio codec • AD1852 96 kHz auxillary DAC • USB version 1.1 compliant interface

Hysol C9-4215

Contextual Info: Microminiature Connectors - The Micro Line MDM connectors are used in applications requiring These connectors are designed to meet the rapidly highly reliable, extrem ely sm all, lightweight connec­ increasing demands for an environm ental, high per­ tors with higher density contact configurations than

MS-10421

Abstract: MCP51M CI055 MOSFET B20 p03 RN00 PC017 pc014 MAX8774GTL Athlon Neo X2 U019C
Contextual Info: 5 4 3 MS-10421 Ver : 0.C 2 Processor 1 DDR2 Sodimm 0 AMD S1 638 pin uFCPGA 638 socket Battery Charger Page 6 DDR2 400 / 533 / 667 MHz Page 31 DDR2 Sodimm 1 Page 2,3,4,5 Battery select Page 6 D Page 32 D 16 X 16 Bit HyperTransport Link DRAM Power Page 33 North Bridge

ssd0323

Abstract: opto 817 pin connections G1A00 Q65110A1670 jungle ic block diagram 96x64 OLED 817 OPTO OLED 96X64 1.2 L1322 OPTO 817 C
Contextual Info: Product Specification 80 Version Date/ Datum Initiated by/ Veranlasser Reason of modification / Grund der Änderung item, section / Position, Absatz 01 2006-10-13 Ghani Wee, Fakhariah (OPD - Oled FE Prod. Dev.) New Specification The document No. Die Unterlage mit der Nr.: