GS88136 Search Results

Contextual Info: GS88118C T/D /GS88132C(T/D)/GS88136C(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

GS88136C

Abstract: GS88136
Contextual Info: GS88118C T/D /GS88132C(T/D)/GS88136C(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

GS88118B

Abstract: GS88118BT-250 GS88118BT-300 GS88118BT-333 GS88132B GS88136B GS88132BT-200
Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

GS88118A

Abstract: GS88118AT-250 GS88136A
Contextual Info: GS88118A T/D /GS88132A(D)/GS88136A(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply

GS88118B

Abstract: GS88118BT-250 GS88136B
Contextual Info: GS88118B T/D /GS88132B(D)/GS88136B(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply

GS88118B

Abstract: GS88118BT-250 GS88118BT-300 GS88118BT-333 GS88132B GS88136B GS88118BGD GS88136BGD GS88136
Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply

Contextual Info: Preliminary GS88118C T/D /GS88132C(T/D)/GS88136C(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs 88118CFeatures • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

GS88118B

Abstract: GS88118BT-250 GS88118BT-300 GS88118BT-333 GS88132B GS88136B
Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

GS88118B

Abstract: GS88118BT-250 GS88118BT-300 GS88118BT-333 GS88132B GS88136B
Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Functional Description n es ig Byte Write and Global Write Byte write operation is performed by using Byte Write enable

Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

GS88118BT-150V

Abstract: GS88118BT-200V GS88118BT-250V GS88132BT-150V GS88132BT-200V
Contextual Info: GS88118/32/36B T/D -xxxV 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V +10%/–10% core power supply

Contextual Info: GS88118/36AT-250/225/200/166/150/133 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply

Contextual Info: GS88118/32/36B T/D -xxxV 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Functional Description n es ig SCD Pipelined Reads The GS88118/32/36B(T/D)-xxxV is a SCD (Single Cycle Deselect) pipelined synchronous SRAM. DCD (Dual Cycle

Contextual Info: GS88118/32/36C T/D -xxxV 100-pin TQFP & 165-bump BGA Commercial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V +10%/–10% core power supply • 1.8 V or 2.5 V I/O supply

Contextual Info: GS88118/32/36B T/D -xxxV 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V +10%/–10% core power supply

Contextual Info: Preliminary GS88118/36AT-250/225/200/166/150/133 512K x 18, 256K x 36 8Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • On-chip read parity checking; even or odd selectable • 2.5 V or 3.3 V +10%/–5% core power supply

Contextual Info: GS88118/32/36C T/D -xxxIV 100-pin TQFP & 165-bump BGA Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V +10%/–10% core power supply • 1.8 V or 2.5 V I/O supply

GS881E18AD-133

Abstract: GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
Contextual Info: Revision: 9/26/02 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS88118AD-133

Abstract: GS88118AD-150 GS88118AD-166 GS88118AD-200 GS88118AD-225 GS88118AD-250
Contextual Info: Revision: 9/26/02 GS88118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS88118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

IS61LF51232-8

Abstract: IS61LV25616AL-8TL IS61LF51232 IS61LV5128L-10T GS71116AU-10E 167ML IS61NLP25636A-200TQL IS61QDB22M36 IS61LPS51236-150B IS61LV5128L-12T
Contextual Info: ISSI * - Tie down extra four I/Os with resistor + - Tie down extra two I/Os with resistor # - Connect pin 14 FT pin to Vss IS61DDB22M36-167M3 IS61DDB22M36-167M3L IS61DDB22M36-167ML IS61DDB22M36-200M IS61DDB22M36-200M3 IS61DDB22M36-200M3L IS61DDB22M36-200ML