GS88136A Search Results

GS88118A

Abstract: GS88118AT-250 GS88136A
Contextual Info: GS88118A T/D /GS88132A(D)/GS88136A(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply

Contextual Info: GS88118/36AT-250/225/200/166/150/133 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply

Contextual Info: Preliminary GS88118/36AT-250/225/200/166/150/133 512K x 18, 256K x 36 8Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • On-chip read parity checking; even or odd selectable • 2.5 V or 3.3 V +10%/–5% core power supply

GS881E18AD-133

Abstract: GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
Contextual Info: Revision: 9/26/02 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS88118AD-133

Abstract: GS88118AD-150 GS88118AD-166 GS88118AD-200 GS88118AD-225 GS88118AD-250
Contextual Info: Revision: 9/26/02 GS88118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS88118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS88118A

Abstract: GS88118AT-250 GS88136A
Contextual Info: Preliminary GS88118/36AT-250/225/200/166/150/133 512K x 18, 256K x 36 9Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply

GS881Z18AT-133

Abstract: GS881Z18AD-133 GS881Z18AD-150 GS881Z18AD-166 GS881Z18AD-200 GS881Z18AD-225 GS881Z18AD-250
Contextual Info: Revision: 9/26/02 GS881Z18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881Z18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS881E18AD-133

Abstract: GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
Contextual Info: Revision: 2/3/05 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS88118A

Abstract: GS88118AD-166 GS88118AD-200 GS88118AD-225 GS88118AD-250
Contextual Info: Revision: 4/26/02 GS88118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS88118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS88118AD-133

Abstract: GS88118AD-150 GS88118AD-166 GS88118AD-200 GS88118AD-225 GS88118AD-250
Contextual Info: Revision: 2/3/05 GS88118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS88118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only