GS8672T3 Search Results

Contextual Info: Preliminary GS8672T19/37BE-400/375/333/300 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–300 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER • 2.0 Clock Latency

Contextual Info: GS8672T19/37BE-450/400/375/333/300 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 450 MHz–300 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER • 2.0 Clock Latency

Contextual Info: Preliminary GS8672T19/37BE-400/375/333/300 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–300 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER • 2.0 Clock Latency

Contextual Info: Preliminary GS8672T19/37BE-400/375/333/300 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–300 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER • 2.0 Clock Latency

Contextual Info: Preliminary GS8672T18/36BE-333/300/250/200 72Mb SigmaDDR-II Burst of 2 ECCRAM™ 165-Bump BGA Commercial Temp Industrial Temp Features • On-Chip ECC with virtually zero SER • Simultaneous Read and Write SigmaDDR™ Interface • Common I/O bus • JEDEC-standard pinout and package

Contextual Info: Preliminary GS8672T18/36BE-333/300/250/200 72Mb SigmaDDR-II Burst of 2 ECCRAM™ 165-Bump BGA Commercial Temp Industrial Temp Features • On-Chip ECC with virtually zero SER • Simultaneous Read and Write SigmaDDR™ Interface • Common I/O bus • JEDEC-standard pinout and package

Contextual Info: Preliminary GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T18/36BE-333/300/250/200 72Mb SigmaDDR-II Burst of 2 ECCRAM™ 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 1.8 V VDD 1.8 V and 1.5 VDDQ Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T18/36AE-333/300/250/200 72Mb SigmaDDR-II Burst of 2 ECCRAM™ 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 1.8 V VDD 1.8 V and 1.5 VDDQ Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T18/36BE-333/300/250/200 72Mb SigmaDDR-II Burst of 2 ECCRAM™ 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 1.8 V VDD 1.8 V and 1.5 VDDQ Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER

Contextual Info: GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T19/37BE-400/375/333/300 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–300 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER • 2.0 Clock Latency

Contextual Info: GS8672T18/36BE-400/333/300/250/200 72Mb SigmaDDR-II Burst of 2 ECCRAM™ 165-Bump BGA Commercial Temp Industrial Temp Features • On-Chip ECC with virtually zero SER • Simultaneous Read and Write SigmaDDR™ Interface • Common I/O bus • JEDEC-standard pinout and package

Contextual Info: GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

AN1019

Contextual Info: AN1019 SigmaQuad-II+ and SigmaDDR-II+ On-Die Termination ODT Introduction When an electrical signal is transmitted along a transmission line, it is reflected back when it reaches the end of the line. That reflection induces noise which adversely affects the quality of the signal, thereby making it more difficult for the receiving device

Contextual Info: Preliminary GS8672T18/36BE-333/300/250/200 72Mb SigmaDDR-II Burst of 2 ECCRAM™ 165-Bump BGA Commercial Temp Industrial Temp Features • On-Chip ECC with virtually zero SER • Simultaneous Read and Write SigmaDDR™ Interface • Common I/O bus • JEDEC-standard pinout and package

GS8672T3

Contextual Info: GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T19/37AE-400/375/333/300 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–300 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T20/38BE-550/500/450/400 72Mb SigmaDDR-II+ Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 550 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER

Contextual Info: Preliminary GS8672T19/37BE-400/375/333/300 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–300 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • On-Chip ECC with virtually zero SER • 2.0 Clock Latency

Contextual Info: Preliminary GS8672T20/38BE-633/550/500/450/400 72Mb SigmaDDR-II+TM Burst of 2 ECCRAMTM 165-Bump BGA Commercial Temp Industrial Temp 633 MHz–400 MHz 1.8 V VDD 1.5 V I/O Features Clocking and Addressing Schemes • 2.5 Clock Latency • On-Chip ECC with virtually zero SER