GREATEK Search Results

HI-3593

Abstract: HI-3717 arinc 825 QR114 QR-1140 HI-3113 HI-8593 HI-6131
Contextual Info: Addition of Greatek Electronic, Taiwan for QFN, TQFP, TSSOP & SOIC Package Assembly Product Change Notice PCN1101 v1.0 December 01, 2011 Overview The purpose of this notification is to announce the addition of Greatek Electronic, Taiwan assembly facility for QFN, TQFP,

MS-6G

Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f
Contextual Info: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :

MXIC 25L

Contextual Info: ISD61S00 ChipCorder Telephony Feature Chip 2008 Nuvoton Technology Corporation America all rights reserved. Important Notice Nuvoton products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane

Contextual Info: Winbond ExpressCard Power Interface Switch W83L351G W83L351G PRELIMINARY W83L351G Data Sheet Revision History 1. PAGES DATES VERSION N.A Mar./06 0.5 VERSION ON WEB N.A. MAIN CONTENTS All versions before 0.5 are for internal use only. Please note that all data and specifications are subject to change without notice. All

W83793

Abstract: w83793g W83793R TD3T opteron 18-HE
Contextual Info: W83793G Winbond H/W Monitor DATE: DECEMBER 11, 2006 REVISION: 1.0 W83793G W83793G DATA SHEET REVISION HISTORY PAGES 1 n.a. 2 n.a. 3 n.a. 4 n.a. 5 n.a. DATES VERSION WEB VERSION MAIN CONTENTS 0.1 n.a. Preliminary 06/06/05 0.2 n.a. Modify pin type for VID pins. Sec4.1 and 5.2

E7H diode

Abstract: 1001XXXX 212OA
Contextual Info: W83L785TS-S Winbond H/W Monitoring IC W83L785TS-S Table of Contents1. 2. 3. 4. 5. 6. GENERAL DESCRIPTION. 1 FEATURES. 1

ablebond 84-3J

Abstract: SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151
Contextual Info: MIL-STD-1553 Bus Transceivers Plastic SOIC Package Transfer Product Change Notice PCN1201 v1.0 January 20, 2012 Overview The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.

CRM-1076DJ-G

Abstract: SUMITOMO g600f G600F sumitomo crm 1076dj greatek SUMITOMO EME G CRM1076DJ 100-Lead-LQFP LQFP Package CRM*1076
Contextual Info: 100-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN1003 (v1.0) April 22, 2010 Overview This notice describes the changes to the 100-Lead Quad Flat Pack (QFP) Package for the HI-8045PQx LCD Display Driver family of devices. Description

he 8050d

Abstract: c 8050d 8050d transistor c8050d W55FXX w55f108 greatek W83972D
Contextual Info: W83791SD/ W83791SG WINBOND H/W MONITORING IC -I- Publication Release Date: April 14, 2005 Revision 2.0 W83791SD/W83791SG Table of Contents1. GENERAL DESCRIPTION . 1

Contextual Info: FT600/FT601 USB 3.0 to FIFO Bridge Version Draft Document No.: FT_001118 Clearance No.: FTDI#424 Future Technology Devices International Ltd. FT600/FT601 USB 3.0 to FIFO Bridge The FT600/FT601 is a USB 3.0 to FIFO interface bridge chip with the following advanced features:

he 8050d

Abstract: c 8050d c8050d W83972D W55FXX W83791SD w55f10 8050D AC97 W83791D
Contextual Info: W83791SD Winbond H/W Monitoring IC W83791SD W83791SD Data Sheet Revision History Pages Dates 1 n.a. 2 n.a. 01/Jan 3 n.a. 02/Apr Version Version on Web Main Contents n.a. All version before 0.50 are for internal use. 0.5 n.a. First publication. 1.0 1.0 Change all version include version on web site

00MGW

Abstract: SX20 SX28 SX48 SX48BD SX48BD-G
Contextual Info: SX48BD Configurable Communications Controllers with EE/Flash Program Memory, In-System Programming Capability and On-Chip Debug 1.0 PRODUCT OVERVIEW 1.1. Introduction The Parallax SX48BD is a member of the SX family of configurable communications controllers fabricated in an

Contextual Info: W8 3 7 92 AD/D W83792AG /G Winbond H/W Monitoring IC CSB Version Date :2005 Nov. Revision: 0.9 W83792AD/AG/D/G PRELIMINARY W83792AD/D Data Sheet Revision History Pages Dates Version Web Version Main Contents 1 Aug-27-2003 N/A Move Low Bit I/II to AEh and AFh

w49v002fap

Abstract: FFBC0100 W49V002FA
Contextual Info: W49V002FA 256K x 8 CMOS FLASH MEMORY WITH FWH INTERFACE GENERAL DESCRIPTION The W49V002FA is a 2-megabit, 3.3-volt only CMOS flash memory organized as 256K × 8 bits. The device can be programmed and erased in-system with a standard 3.3V power supply. A 12-volt VPP is

SX48BD-G

Abstract: parallax gps 4 mhz ceramic resonator 3-pin TQG CRYSTAL SX28AC/SS-G SX48BD OV10630 00MGW SX20 SX28
Contextual Info: SX48BD Configurable Communications Controllers with EE/Flash Program Memory, In-System Programming Capability and On-Chip Debug 1.0 PRODUCT OVERVIEW 1.1. Introduction The Parallax SX48BD is a member of the SX family of configurable communications controllers fabricated in an

Contextual Info: FT240X USB 8-BIT FIFO IC Datasheet Version 1.2 Document No.: FT_000626 Clearance No.: FTDI# 259 Future Technology Devices International Ltd. FT240X USB 8-BIT FIFO IC The FT240X is a USB to parallel FIFO interface with the following advanced features: •

1c 78 adg

Abstract: SB-TSI marking code ADg W83795 W83795G Intel PECI2.0 interface SBI Temperature Sensor Interface SB-TSI W83795ADG Amd 6970 SBI Temperature Sensor Interface SB-TSI Specification,
Contextual Info: W83795G/ADG Nuvoton H/W Monitor Date: Aug/2/2010 Revision: 1.41 W83795G/ADG Table of Content1. 2. 3. 4. 5. 6. 7. 8. GENERAL DESCRIPTION W83795G . 4 GENERAL DESCRIPTION (W83795ADG). 5

W83L785G

Abstract: 2N3904 PNP 2N3904 Transistors
Contextual Info: W83L785R/W83L785G Winbond H/W Monitoring IC W83L785R/W83L785G W83L785R Data Sheet Revision History PAGES DATES VERSION VERSION MAIN CONTENTS ON WEB 1 n.a. n.a. All the version before 0.50 are for internal use. 2 n.a. 8/01 0.6 n.a. First publication. 3 n.a

1111XXXX

Contextual Info: W83L785TS-L Winbond H/W Monitoring IC -I- Publication Release Date:April 18, 2005 Revision A1 W83L785TS-L Table of Contents1. 2. 3. 4. 5. 6. GENERAL DESCRIPTION . 1

W83793

Abstract: W83793G W83793AG LM75 pec 730 DIODE PEC 812 W83793R W83792D Nuvoton AMD VID
Contextual Info: W83793G / W83793AG Nuvoton H/W Monitor DATE: DECEMBER 12, 2008 REVISION: 1.4 W83793G / W83793AG Table of Content1. GENERAL DESCRIPTION . 1 2. FEATURES . 3

he 8050d

Abstract: NPN transistor 8050d 8050d transistor WINBOND APPLICATION NOTE W55F10 transistor 8050d W55FXX W83791SD W83972D 8050D AC97
Contextual Info: W83791SD Winbond H/W Monitoring IC i Publication Release Date: Jun,2001 Revision 0.2 W83791SD W83791SD Data Sheet Revision History Pages 1 n.a. 2 n.a. Dates 01/Jan Version 0.2 Version on Web Main Contents n.a. All version before 0.20 are for internal use.

W83972D

Abstract: W55FXX W83791SD w55f10 greatek 8050D he 8050d
Contextual Info: W83791SD Preliminary 1. GENERAL DESCRIPTION W83791SD is a programmable speech synththesizer with 8-bit current DAC output that can connect to speaker or LINE_OUT by the AC’97 audio codec. It supports 1 CPU present or absent event trap, 5 external event traps, and 127 internal programmable event traps to

W83791

Abstract: NPN transistor 2n 3904 temperature sensor 5VSB fan speed control circuit using lm358
Contextual Info: W83792AD/D W83792AG/G Winbond H/W Monitoring IC CSB Version Date :2006 Apr. Revision: 0.9 W83792AD/AG/D/G W83792AD/D Data Sheet Revision History PAGES DATES VERSION WEB VERSION MAIN CONTENTS 1 Aug-27-2003 N/A Move Low Bit I/II to AEh and AFh 2 Aug-27-2003

Contextual Info: W83L785R WINBOND H/W MONITORING IC FOR NOTEBOOK 1. GENERAL DESCRIPTION W83L785R is a condensed product of W83L785R - Winbond's most popular hardware monitoring IC for notebook. Specifically designed for the graphic cards and notebook systems, W83L785R can be