GPP 6 Search Results

SMBJ15A

Abstract: SMBJ50A DO-214AA SMBJ130A SMBJ170A SMBJ17A SMBJ58A SMBJ100A SMBJ64A SMBJ6.5A SMBJ12A
Contextual Info: TVS RECTRON TFMBJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 600 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory certificate Glass passivated chip construction

400J

Contextual Info: MOLDING GPP CHIP GPP DIE CONSTRUCTION SMX CROSS SECTION 202 INTRODUCTION TO GLASS PASSIVATED DIE LEVEL RECTIFIERS General Instrument GPP Type Rectifiers utilize a glass passivation on the chip level to enhance its devices per­ formance. The difference is that the glass is applied to

D0214AA

Abstract: D0-214AB D0214AC D0-214AC D0214AB s2b VR100V D0-214AA RS1J MPG06B MPG06J
Contextual Info: DIE LEVEL GLASS PASSIVATED RECTIFIERS 0.6 TO 3.0 AMPERES 50 VOLTS TO 1000 VOLTS GPP CHIP MOLDING COMPOUND GPP CHIP CHIP MATT-TIN-LEAD PLATED COPPER LEADS GPP DIE CONSTRUCTION P N METALLIZATION Ni/Ni/Au GLASS PASSIVATION SMX CROSS SECTION SMX CROSS SECTION

SMBJ15A

Abstract: SMBJ10 SMBJ10A SMBJ11 TFMBJ170 TFMBJ170CA TFMBJ24A SMBJ130A SMBJ170A SMBJ17A
Contextual Info: TVS RECTRON TFMBJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 600 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

TFMBJ6.0A

Abstract: TFMBJ30 TFMBJ10 TFMBJ10A TFMBJ11 TFMBJ170 TFMBJ170CA
Contextual Info: TVS RECTRON TFMBJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 600 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

P6FMBJ10

Abstract: P6FMBJ100 P6FMBJ10A P6FMBJ11 P6FMBJ11A P6FMBJ400 P6FMBJ400CA
Contextual Info: TVS RECTRON P6FMBJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 600 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

SMBJ15A

Abstract: SMBJ130A SMBJ170A SMBJ17A SMBJ58A SMBJ100A SMBJ64A SMBJ6.5A SMBJ12A SMBJ28A
Contextual Info: TVS RECTRON TFMBJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 600 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

P6FMBJ10

Abstract: P6FMBJ100 P6FMBJ10A P6FMBJ11 P6FMBJ11A P6FMBJ400 P6FMBJ400CA
Contextual Info: TVS RECTRON P6FMBJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 600 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

Contextual Info: TVS RECTRON TFMCJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 1500 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

SMCJ5.0A

Abstract: SMCJ10 SMCJ10A TFMCJ170 TFMCJ170CA
Contextual Info: TVS RECTRON TFMCJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 1500 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

Contextual Info: TVS RECTRON TFMAJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 400 WATT PEAK POWER 1.0 WATT STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory certificate Glass passivated chip construction

Contextual Info: TVS RECTRON TFMCJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 1500 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory certificate Glass passivated chip construction

SMAJ10

Abstract: SMAJ10A SMAJ11 SMAJ11A SMAJ12 TFMAJ170 TFMAJ170CA
Contextual Info: TVS RECTRON TFMAJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 400 WATT PEAK POWER 1.0 WATT STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

5 watt zener

Abstract: TFMCJ10 TFMCJ10A TFMCJ170 TFMCJ170CA
Contextual Info: TVS RECTRON TFMCJ SEMICONDUCTOR TECHNICAL SPECIFICATION SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 1500 WATT PEAK POWER 5.0 WATTS STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction

100MIL

Abstract: 500E
Contextual Info: GDSGA0-500E GDSGA0-700E GDSGA0-900E GDSGA0-B00E RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION STANDARD GPP CHIP - 100MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GDSGA0 SERIES CHIP APPEARANCE 75mil CHIP DIMENSIONS GDSGA0-700E GDSGA0-900E GDSGA0-B00E

500E

Contextual Info: GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION STANDARD GPP CHIP - 70MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GNSG70 SERIES CHIP APPEARANCE 47mil CHIP DIMENSIONS 70mil GNSG70-700E GNSG70-900E

Contextual Info: TVS TFMAJ SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 400 WATT PEAK POWER 1.0 WATT STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction 400 watt surage capability at 1ms Excellent clamping capability

Contextual Info: GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION STANDARD GPP CHIP - 70MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GNSG70 SERIES CHIP DIMENSIONS CHIP APPEARANCE 47mil 70mil GNSG70-700E GNSG70-900E

YS DO-214AC

Abstract: SMAJ10 SMAJ10A SMAJ11 SMAJ11A SMAJ12 SMAJ12A TFMAJ170 TFMAJ170CA
Contextual Info: TVS TFMAJ SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 400 WATT PEAK POWER 1.0 WATT STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction 400 watt surage capability at 1ms Excellent clamping capability

500E

Contextual Info: GNSG50-500E GNSG50-700E GNSG50-900E GNSG50-B00E C RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION STANDARD GPP CHIP - 50MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GNSG50 SERIES CHIP APPEARANCE CHIP DIMENSIONS GNSG50-500E GNSG50-700E C HIP SIZE

Contextual Info: GDSGA0-500E GDSGA0-700E GDSGA0-900E GDSGA0-B00E RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION STANDARD GPP CHIP - 100MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GDSGA0 SERIES CHIP DIMENSIONS CHIP APPEARANCE 75mil GDSGA0-700E GDSGA0-900E GDSGA0-B00E

Contextual Info: TVS TFMAJ SERIES SURFACE MOUNT GPP GPP TRANSIENT VOLTAGE SUPPRESSOR 400 WATT PEAK POWER 1.0 WATT STEADY STATE FEATURES * * * * * * Plastic package has underwriters laboratory Glass passivated chip construction 400 watt surage capability at 1ms Excellent clamping capability

74HCT244D

Abstract: AM26LS32BSC TC3001 R18A1 PHY100 XF10B1Q3 MT41LC256K32D4LG12 AD30 isplsi2064 6qe_r2c8
Contextual Info: A B C CPUEx T2LEDStb~ T2Limit4 T2EnDev~ PolCorQu ForceLinkQu ATMS ATCK ATDI GPP[7:4] GPP[7:4] Int2~ T2LEDStb T2Limit4 T2EnDev~ TPolCorQu TForceLinkQu ATMS ATCK BurstAddr2 BurstAddr1 RdcEn~ CClk W/R~ Blast~ ADS~ RdyRcv~ Int1~ TAUIEn T1LEDStb T1Limit4 T1EnDev~

Contextual Info: 旭昌科技 SHAOXING RISING-SUN TECHNOLOGY CO., LTD. GPP FAST CHIPS 玻璃钝化快速整流二极管芯片 GPP FAST RECOVERY RECTIFIER CHIPS VOLTAGE:50～1000V，CURRENT:1～30A Features ◆ ◆ ◆ ◆ Full glass passivated junction Fast reverse recovery