GP302 Search Results

p1100 led

Abstract: BP1601 k4 heatsink GP1501-9R BP130
Contextual Info: P Series Data Sheet 90 - 194 Watt DC-DC Converters Features • RoHS lead-free-solder and lead-solder-exempted products available • Wide input voltage ranges up to 150 VDC • 1, 2, 3, or 4 isolated outputs up to 96 V • Class I equipment • Very high efficiency

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

48 VOLT 20AMP battery charger

Abstract: lm1785 BP1601 ZY2105 qts48t46096 PSR53-7 HBD060ZGE-A MPB150 40IMX35D05D15-8 FXP7000-48-S
Contextual Info: Z-One Digital Power Analog POL Isolated DC-DC Front Ends Chassis Mount PoE Ruggedized CompactPCI Renewable Energy Network Power Systems Intelligent Controls 2010 Online Product Update Table of Contents Point-Of-Load Conversion & Management Bus Programmable Digital POL Solutions

Contextual Info: P Series Data Sheet 90 – 194 Watt DC-DC Converters Features • RoHS lead-free-solder and lead-solder-exempted products available • Wide input voltage ranges up to 150 VDC • 1, 2, 3 or 4 isolated outputs up to 96 V • Class I equipment • Very high efficiency up to 90%

BP3020

Abstract: DP2540 BP1601
Contextual Info: P Series Data Sheet 90 – 194 Watt DC-DC Converters Features • RoHS lead-free-solder and lead-solder-exempted products available • Wide input voltage ranges up to 150 VDC • 1, 2, 3, or 4 isolated outputs up to 96 V • Class I equipment • Very high efficiency

LWN2880-6

Contextual Info: Z-One Digital Power Analog POL Isolated DC-DC Front Ends Chassis Mount Modular Products 2010 ONLINE AC-DC & DC-DC POWER SOLUTIONS PRODUCT UPDATE PoE CompactPCI Ruggedized Table of Contents Point-Of-Load Conversion & Management Bus Programmable Digital POL Solutions

BP1601

Abstract: XP2020 BP1601-9R BP3020-9R bp16019r BP1501-9R EP4660-9R diode p1000 P1000 diode Battery Chargers planar Transformer circuit
Contextual Info: P Series Data Sheet 100 - 194 Watt DC-DC Converters Features 1, 2, 3, or 4 isolated outputs up to 96 V Class I equipment Wide input voltage range • RoHS lead-solder exemption compliant • Very high efficiency • Extremely low inrush current, hot swappable

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Contextual Info: P Series Data Sheet 90 – 195 Watt DC-DC Converters Features • RoHS lead-free-solder and lead-solder-exempted products available • Wide input voltage ranges up to 150 VDC • 1, 2, 3 or 4 isolated outputs up to 96 V • Class I equipment • Compliant with EN 50155, EN 50121-3-2, EN 45545

GP301

Abstract: IN5401 GP303 GP302 IN5402 GP605 IN 5408 IN5403 GP305 GP304
Contextual Info: 3-3. allt -T-o \ - o \ 3 Amperes - Plastic Rectifiers/D0*201 A D Package PIV Peak Inverse Voltage +175°C MAX AVG Rectify Current @ HalfWave Res Load 60 Hz MAX FWD Peak Suroe Current 1 - 60 Hz Superimposed fi> OPERATING AND STORAGE TEMPERATURE -6 5 ° C

"RCMM" protocol

Abstract: philips RC-MM xtal 24mhz RCMM Philips TSIP5201 ir transmitter H11A 3.3v xtal 12MHz RC5 Infrared protocol philips PDIUSBD11
Contextual Info: Philips Semiconductors 1 Oct 98 AN10012-01 previous filename: USB-IR_DONGLE.pdf Implementing a USB-to-Infrared (Philips RCMM) Dongle - USB IR HID Device (OVU1000, Reference Design Ver 1.1) - USB Compound Hub with IR HID Device Author: Wim, Lemay Edited by: Wei Leong, Chui

"RCMM" protocol

Abstract: xtal 12MHz ir receiver transistor H11A 3.3v diagram receiver and transmitter for microcontroller RC5 Infrared transmitter philips usb gamepad controller ir receiver 36khz P80C652 Force Sensitive Resistor
Contextual Info: Philips Semiconductors 1 Oct 98 AN10011-01 previous filename: USB-IR DONGLE.pdf Implementing a USB-to-Infrared (Philips RCMM) Dongle - USB IR HID Device (OVU1000, Reference Design Ver 1.1) - USB Compound Hub with IR HID Device Author: Wim, Lemay Edited by: Wei Leong, Chui

BP3020

Abstract: BP3020-7R
Contextual Info: P Series Data Sheet 100 - 194 Watt DC-DC Converters Features 1, 2, 3, or 4 isolated outputs up to 96 V Class I equipment Wide input voltage range • RoHS lead-solder exemption compliant • Very high efficiency • Extremely low inrush current, hot swappable

"RCMM" protocol

Abstract: RCMM Philips ir receiver philips ir receiver transistor H11A 3.3v philips ir demodulator usb transmitter schematic diagram TSOP RECEIVER philips ir receiver IR receiver
Contextual Info: Philips Semiconductors 1 Oct 98 Implementing a USB-to-Infrared Philips RCMM Dongle - USB IR HID Device (OVU1000, Reference Design Ver 1.1) - USB Compound Hub with IR HID Device Author: Wim, Lemay Edited by: Wei Leong, Chui Interconnectivity 1 Oct 98 Page 3