GLASS SEAL PGA Search Results

ADV9614

Abstract: Glass Seal PGA
Contextual Info: CUSTOMER ADVISORY GLASS SEAL PGA Overview In 1993 Altera converted its 68-, 84-, and 100-pin solder-seal Pin Grid Array PGA packages to a glass-sealed PGA package. However, since Altera acquired the Intel product line in 1994 the company has been supporting orders for the solder seal PGA package. Going forward, Altera

fr4 94v0

Contextual Info: ADVANCED Low Insertion Force PGA Sockets INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850 / 401-823-5200 •Fax 401-823-8723 ■Email advintcorp@aol.com • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets

Alumina ceramic AI203

Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Contextual Info: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

gold metal detectors

Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

solid solubility

Abstract: chemical control process block diagram
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

100 series machine screw SOCKET

Contextual Info: 3M PGA Socket Screw Machine 200 Series • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above

gold metal detectors

Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Contextual Info: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of

Contextual Info: 3M PGA Socket Screw Machine 200 Series ED • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above

Ultrasonic Cleaning Transducer

Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Contextual Info: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
Contextual Info: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .

94vo fr4

Contextual Info: Low Insertion Force PGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets .100

94v0 fr4

Abstract: fr4 94v0
Contextual Info: Low Insertion Force PGA Sockets ADVANCED » INTERCONNECTIONS» 5 Energy Way, P.O. Box 1019, West W arwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advlntcorp.com • Internet http://w ww .advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets

94vo fr4

Abstract: C17200 pga socket 64 3m
Contextual Info: cat15 5/22/01 9:40 AM Page 32 Low Insertion Force PGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets

823B

Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
Contextual Info: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP

Datasheet of IC 7432

Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
Contextual Info: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type

Contextual Info: XICOR SHE INC D * m i? 4 3 aaaam? b A D V A N C E D IN FO R M A TIO N Commercial Industrial 64K X28C64 X28C64I 8K x 8 Bit Electrically Erasable PROM T~y¿-/3~Z7 DESCRIPTION FEATURES • LOW Power CMOS —60 mA Active Current Max. —200 /aA Standby Current Max.

KC700

Abstract: KC-700 Cypress CROSS
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 98369 VERSION 1.1 October, 2000 Ceramic Window Lid 68-lead, 84-lead and 100-lead Pin Grid Arrays Alphatec, Thailand Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

x2864a

Abstract: X2864B
Contextual Info: i m C/1kr 64K Commercial X2864B moo v a Rit Industrial_ X2864BI_ 8 19 2x 8B lt Electrically Erasable PROM _ DESCRIPTION TYPICAL FEATURES • 120 ns Access Time • High Perform ance Scaled NMOS Technology • Fast W rite Cycle Times

*26C64

Abstract: X2864B X28C64G x28c64 X23c64 INS250 X2864A x2864a ordering X2HC64 x26c
Contextual Info: ADVANCED INFORMATION Commercial X28C64 m* Industrial_X28C64I_ 8K x 8 Blt RA1£ 64K Electrically Erasable PROM FEATURES • LOW Power CMOS — 60 mA Active Current Max. —200 jliA Standby Current Max. • Fast Write Cycle Times

X2864BP

Abstract: x2864 x2864bd X2864B x2864bd-15 x2864BDI X2864BD-18 X2864BJ X2864BJI-18 Xicor
Contextual Info: ü a r Commercial X2864B m oovftB i* Industrial_ X2864BI_ 8192x8 Bit 64K Electrically Erasable PROM TYPICAL FEATURES • 120 ns Access Time • High Performance Scaled NMOS Technology • Fast Write Cycle Times —32-Byte Page Write Operation

AS400

Abstract: S390 ES9000 S390-G5 CMOS-6S S390G ibm semi
Contextual Info: THIN FILM PGA ON S390-G5 MAINFRAME HIGH DENSITY MCMS A. K. Malhotra*, D. C. McHerron, R. Shields, B. Ghosal, G. Martin, D. Scheider, J. R. Pennacchia IBM Microelectronics Division, Rt. 52, Hopewell Junction, New York 12533 * Tel.: 914 894-3326; Email: malhotra@us.ibm.com

smd transistor M7A

Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
Contextual Info: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages

JM7000

Abstract: ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond
Contextual Info: Custom Product Capabilities Micross Components formerly Austin Semiconductor has loyally served the Military & Hi-Rel custom assembly and test marketplace for over 22 years. Custom support has been the company foundation since its inception, with the philosophy that if it can be defined by the customer, Micross will support the

Contextual Info: 256K Military X28C256M 32Kx8Bit _ Electrically Erasable PROM_ FEATURES • LOW Power CMOS — 60 mA Active Current Max. —200 juA Standby Current Max. • Fast Write Cycle Times