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    1076WA

    Abstract: g631m Compound 6600cs Compound g631 IA186ES-PQF100I-03 FRM-72-04-1 1076 molding IA186ES
    Contextual Info: Product Change Notice Product Change Notification Number: IA186XX-D Title: Additional Molding Compound and Epoxy for Assembly flexibility Date of Notification: 9/22/2010 Samples Available: 10/22/10 Effective Date: 10/22/2010 This Change Affects Innovasic Part # IA186ES-PQF100I-03 only


    Original     		ia186xx-dia186es-pqf100i-036600csg631m+81076waia186esfrm-72-04-1compound 6600cscompoundg6311076molding PDF

    IA186EB

    Abstract: copper bond wire G631M 1076WA copper bonding wire FRM-72-04-1
    Contextual Info: Product Change Notice Product Change Notification Number: IA18XEB-D Title: Product Enhancement for the IA186 PQFP version of 16-Bit Microcontroller Date of Notification: 5/20/2013 Samples Available: immediately Effective Date: TBD This Change Affects Innovasic Part Numbers


    Original     		ia18xeb-dia18616-bitia186eb-pqf80i-r-00+8compound83-5263x-122frm-72-04-1ia186ebcopper bond wireg631m1076wacopper bonding wire PDF