FR4 SUBSTRATE WITH DIELECTRIC CONSTANT 4 Search Results

"10 watt led"

Abstract: 10 watt led 10 watt L.E.D FR4 dielectric constant vs temperature parameters of FR4 substrate with dielectric BERGQUIST XB900 imst m/L.E.D Moving Display Board
Contextual Info: Modeling Results - Infinite Heat Sink Thermal Clad MP FR-4 Temperature °C Thermal Clad LTI Temperature (°C) Temperature (°C) > 63.654 > 63.7 > 63.7 53.991 54.025 54.025 44.327 44.35 44.35 34.664 34.675 34.675 < 25 < 25 < 25 FIGURE 6 PACKAGING CONCLUSION

FR4 dielectric constant vs temperature

Abstract: FR4 substrate with dielectric constant 4
Contextual Info: THERMAL MANAGEMENT OF SURFACE MOUNT POWER DEVICES Prepared by Herb Fick Bergquist Reprinted with permission of POWERCONVERSION & INTELLIGENT MOTION August 1987 issue. 1987 Intertech Communications, Inc. All Rights Reserved. MOTOROLA Semiconductor Products Inc.

IPC-4562

Abstract: BERGQUIST mp-06503 ZPMV UL746E RD2018 HT-04503 HT-09009 Bergquist - Thermal Clad HPL Dielectric CML11-006 ASTM 5470 GAP FILLER
Contextual Info: TCDG_Cover_09.09.qxp 9/8/2009 1:43 PM Page 3 Thermal Solutions For Surface Mount Power Applications ThermalClad S E L E C T I O N G U I D E TCDG_Cover_09.09.qxp 9/8/2009 September 2009 1:43 PM Page 4 Thermal Clad®: U.S. Patent 4,810,563 and others. All statements, technical information and recommendations herein are based on tests we believe to be reliable, and

HSMP-3892

Abstract: HT2 material HSMP3890 HSMP-3890 HSMP-4890 loss tangent of FR4 FR4 dielectric constant 4.3 MTT-18 Optotek velocity of propagation of FR4
Contextual Info: An SPDT PIN Diode T/R Switch for PCN Applications Application Note 1067 Introduction The PCN Personal Communications Network market has shown dramatic growth in the past several years, and promises to expand even more rapidly before the end of the decade. Hand held

in5411

Abstract: MTT-18 loss tangent of FR4 HSMP-3892 HSMP-4890 HT2 material HSMP-3890 anadigics fr-4 laminate properties Optotek
Contextual Info: An SPDT PIN Diode T/R Switch for PCN Applications Application Note 1067 Introduction The PCN Personal Communications Network market has shown dramatic growth in the past several years, and promises to expand even more rapidly before the end of the decade. Hand held terminals providing voice

FR4 epoxy dielectric constant 4.4

Abstract: FR4 substrate epoxy dielectric constant 4.4 Rogers 4350B Nelco 4000-13 FR4 epoxy dielectric constant 3.2 FR4 substrate with dielectric constant 4.4 Rogers 4350B substrate Nelco-4000 FR4 substrate fiberglass n6000-21-si
Contextual Info: PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing Application Note 528 May 2008, v1.0 Introduction As data rates increase, designers are increasingly moving away from wide parallel buses to serial buses with differential signaling. Differential

Nelco 4000-13

Abstract: Nelco 4000-6
Contextual Info: PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing AN-528-1.1 Application Note As data rates increase, designers are increasingly moving away from wide parallel buses to serial buses with differential signaling. Differential signaling uses two output

FR4 epoxy dielectric constant 4.4

Abstract: FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003
Contextual Info: HF Transmission Introduction This document deals with HF Transmission issues in high-speed and broadband applications using Atmel ADCs and DACs. It stresses the hardware choices to be made to reach an optimum tradeoff between high-speed, broadband performances and system

K612

Abstract: underfill FR4 epoxy dielectric constant 3.2 Dielectric Constant Silicon Nitride K810 FR4 substrate height and thickness ltcc chip fine line bga thermal cycling reliability
Contextual Info: Bourns Microelectronic Modules Packaging Solutions Device Mounting Technology Surface Mount Technology Surface mounting is still the most common and economical approach for many applications. Bourns® Microelectronic Module products offer the latest in surface mount technology:

Avago 9886

Abstract: XFRV NE3210 FR4 substrate height and thickness rogers fll120 SKD-ONS-ST23-001 BFP949 Rohm Diodes
Contextual Info: M O DE L I T HI CS EXEMPLAR LIBRARY LIBRARY USER MANUAL V11 For Agilent Technologies Advanced Design System MODELITHICS EXEMPLAR LIBRARY CONTENTS CONTENTS . 2 INSTALLATION INSTRUCTIONS . 8

142-0701-801

Abstract: HSMP-3892 Optotek 511np FR4 substrate antenna
Contextual Info: What H EW L E T T mLUMPA CK A R D An SPDT PIN Diode T/R Switch for PCN Applications Application Note 1067 Introduction The PCN Personal Communica­ tions Netw ork market has shown dram atic growth in the past several years, and prom ises to expand even more rapidly before

fbga Substrate design guidelines

Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
Contextual Info: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

FR4 substrate with dielectric constant 4

Contextual Info: Camarillo, California • Tel 805.389.1166 • Fax 805.389.1821 • www.johansontechnology.com SIMULATING THE EFFECT OF MOUNTING ON SRF AND S-PARAMETERS FOR HIGH FREQUENCY MULTI-LAYER CEARMIC CAPACITORS May 9, 2000 The S-parameters reported by Johanson Technology’s MLCSoft software are analytically

sma connector footprint

Abstract: 142-0761-881 SMA End Launch connectors ro4003* substrate midwest microwave Rogers RO4003* characteristic impedance 50 ohm SMA terminators hf combiners RO4003C IPC-4552
Contextual Info: Johnson High Frequency End Launch Connectors Emerson Network Power Connectivity Solutions E M E R S O N. C O N S I D E R I T S O LV E D . High Frequency SMA End Launch Connectors Applications High Frequency SMA End Launch Connectors for Microwave PC Board Substrates

uhf pcb antenna

Abstract: UHF rfid antenna RFID loop antenna design nxp proximity antenna design NXP UCODE G2XM Types of Radar Antenna UHF RFID pcb antenna chip antenna rfid UHF FR4 substrate with dielectric constant 4.4 nxp rfid uhf transponder
Contextual Info: AN 1715 UHF RFID PCB antenna design Rev. 3.0 – January 21 2010 Application note Document information Info Content Keywords UCODE EPC G2, G2XM, G2XL, Reference Design, Antenna Design, PCB Abstract This application note provides basic antenna knowledge, which is

ltcc

Abstract: ltcc antenna FR4 substrate with dielectric constant 4 LTCCAAB62 parameters of FR4 substrate with dielectric LTCCJHB62 ltcc chip ltcc filter ltcc antenna 9GHZ KYOCERA vco
Contextual Info: LTCC Low Temperature Co-fired Ceramics With increasing demands for high density and miniature modules, Kyocera LTCC featuring thick film printing and multi-layer technologies offers the best fit solutions for those market demands. This LTCC is especially suited for telecom devices such as RF power amplifier, antenna

motorola MN transistor

Abstract: FR4 dielectric constant vs temperature AR338
Contextual Info: AR338 METAL-BACKED BOARDS IMPROVE THERMAL PERFORMANCE OF POWER By PCIM Staff With Contributions by Herb Fick/Bergquist Company Al Pshaenich and Dave Hollander/Motorola Semiconductor Scott LindblomTexas Instruments Reprinted from Powerconversion & Intelligent Motion,

TN-46-06

Abstract: FR4 substrate with dielectric constant 4.4 transmission lines in signal integrity TN4606 micron power resistor FR4 substrate with dielectric constant 4 MICRON 63 micron resistor Signal Integrity transmission line theory
Contextual Info: TN-46-06 TERMINATON FOR POINT-TO-POINT SYSTEMS TECHNICAL NOTE TERMINATION FOR POINTTO-POINT SYSTEMS INTRODUCTION TRANSMISSION LINE THEORY Because digital signal rates in computing systems are increasing at an astonishing rate, signal integrity issues have become far more important to designers. At higher

Nordmende

Abstract: Funkamateur Kathrein Antennas ECC85 TBA810 AMPLIFIER TBA810 Kathrein LFPAK package 5 ferrite rod antenna SiC PIN diode Pspice model
Contextual Info: Appendix RF Manual 7th edition November 2005 date of release: November 2005 document order number: 9397 750 15371 Contents 1. Thermal design considerations for SMD discretes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Contextual Info: 3 Bonding Film AF111 for Electronics Applications Technical Data Product Description March, 2004 3M Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials epoxy and phenolic .

loss tangent of FR4

Abstract: FR4 dielectric constant 4.9 FR4 4.9 dielectric constant FR4 substrate epoxy dielectric constant 4.5 velocity of propagation of FR4 hyperlynx FR4 microstrip stub loss tangent of teflon AN-905 AN-971
Contextual Info: National Semiconductor Application Note 1035 Syed B. Huq August 1996 INTRODUCTION Technology advances has generated devices operating at clock speeds exceeding 100 MHz. With higher clock rates and pico seconds edge rate devices, PCB interconnects act as transmission lines and should be treated as such. Reflections due to mismatched impedance, cross-talk, die-electric

velocity of propagation of FR4

Abstract: loss tangent of FR4 loss tangent of teflon FR4 epoxy dielectric constant 3.2 FR4 substrate with dielectric constant 4 hyperlynx AN-905 AN-971 C1996 loss factor of teflon
Contextual Info: National Semiconductor Application Note 1035 Syed B Huq August 1996 INTRODUCTION Technology advances has generated devices operating at clock speeds exceeding 100 MHz With higher clock rates and pico seconds edge rate devices PCB interconnects act as transmission lines and should be treated as such Reflections due to mismatched impedance cross-talk die-electric

loss tangent of FR4

Abstract: velocity of propagation of FR4 loss tangent of teflon FR4 microstrip stub AN-905 AN-971 C1996 hyperlynx FR4 epoxy dielectric constant 3.2
Contextual Info: National Semiconductor Application Note 1035 Syed B Huq January 1996 INTRODUCTION Technology advances has generated devices operating at clock speeds exceeding 100 MHz With higher clock rates and pico seconds edge rate devices PCB interconnects act as transmission lines and should be treated as such Reflections due to mismatched impedance cross-talk die-electric

UHF rfid antenna hfss

Abstract: loop antenna hfss NXP antenna design guide NXP g2xl uhf 860 960 mhz hfss TAP0604F 225 400 MHz transmitting antenna FF98-4 chip antenna rfid UHF hfss
Contextual Info: AN 0969 Far Field Reference Antenna Design for the UCODE G2XM / G2XL IC Rev. 1.7 — 4th June 2009 Application note Document information Info Content Keywords UCODE EPC G2, G2XM, G2XL, Reference Design, Antenna Design, Far Field, Broadband, Aluminum Abstract