FR4 SUBSTRATE HEIGHT AND THICKNESS 1.2 Search Results

FR4 substrate height and thickness

Abstract: FR4 0.8mm thickness FR4 substrate height and thickness 1.2 FR4 height thickness substrate ltcc chip distance ring ltcc fr4 substrate
Contextual Info: NETWORKS Hybrid IC MULTI CHIP MODULE • SYSTEM iN PACKAGE MCM CONSTRUCTION SMD SMD Bonding Wire Bonding Wire Solder BallBall Solder Bare Chip Bare Chip Substrate Substrate Several semiconductors in one package offers downsized system with high performance and standardization

powerso-36 and pcb footprint

Abstract: powerso-20 and pcb footprint ST Microelectronics, mold compound MO-166 POWERSO36 shape outline of the heat slug for JEDEC AN668 POWERSO20 PSO-36 powerso-20
Contextual Info: AN668 APPLICATION NOTE A New High Power IC Surface Mount Package Family: PowerSO-20 & PowerSO-36 Power IC Packaging from Insertion to Surface Mount ing by P. Casati & C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and

IPC-SM-780

Abstract: VN20NSP VN20N VN20SP
Contextual Info: APPLICATION NOTE  PowerSO-10TM: A NEW SURFACE MOUNT POWER PACKAGE by A. Ehnert, V. Sukumar and J. Diot ABSTRACT A new surface mount power package is introduced in this paper. Todaythere is a great need for a true high power surface mount package. This power package was designed

Avago 9886

Abstract: XFRV NE3210 FR4 substrate height and thickness rogers fll120 SKD-ONS-ST23-001 BFP949 Rohm Diodes
Contextual Info: M O DE L I T HI CS EXEMPLAR LIBRARY LIBRARY USER MANUAL V11 For Agilent Technologies Advanced Design System MODELITHICS EXEMPLAR LIBRARY CONTENTS CONTENTS . 2 INSTALLATION INSTRUCTIONS . 8

INCOMING PACKAGING MATERIAL INSPECTION form

Abstract: MIL-STD-105C underfill 45X45mm motherboard major problems & solutions Low viscosity underfill for flip chip
Contextual Info: FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou Fujitsu San Jose, CA USA Takashi Ozawa Fujitsu Kawasaki, JAPAN Dev Malladi, Chris Furman, Mary Krebser, Steve Boyle, Mohsen Saneinejad Sun Microsystems Palo Alto, CA USA

uhf pcb antenna

Abstract: UHF rfid antenna RFID loop antenna design nxp proximity antenna design NXP UCODE G2XM Types of Radar Antenna UHF RFID pcb antenna chip antenna rfid UHF FR4 substrate with dielectric constant 4.4 nxp rfid uhf transponder
Contextual Info: AN 1715 UHF RFID PCB antenna design Rev. 3.0 – January 21 2010 Application note Document information Info Content Keywords UCODE EPC G2, G2XM, G2XL, Reference Design, Antenna Design, PCB Abstract This application note provides basic antenna knowledge, which is

transistor a226

Abstract: A226 transistor PHILIPS capacitors 0402 GJM1555C1H5R6CB01 0402 footprint balun sma GRM1555C1H4R7CB01 ATR2406-DEV-BOARD ATR2406-DEV-KIT 1p5 sot 23
Contextual Info: Features • Close to production PCB-Layout • Small Footprint FR4 2-Layer Module • Integrated Antenna & SMA-Antenna Connector • Printed Transmit/Receive Filters • Few Low Cost External Components • High Receiver Sensitivity of up to –91 dBm at Antenna-Port

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

eh 11757

Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin
Contextual Info: Daisy Chain Samples Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

Asp1251

Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
Contextual Info: Manual Handling recommendation These capacitors are designed to be mounted with a standard pick and place machine, with reflow. In case of manual handling, please follow below recommendations: x Minimize mechanical pressure on the capacitors use of a vacuum nozzle is recommended .

915 MHz RFID

Abstract: HSMS-286A METAL DETECTOR circuit for make IC RFID 2.45 GHz 2.45 GHz single chip transmitter HSMS-2850 HSMS-286C 100A101MCA50 "zero-bias schottky diode" mark code t4 diode
Contextual Info: Surface Mount Microwave Schottky Detector Diodes in SOT-323 SC-70 Technical Data HSMS-285A Series HSMS-286A Series Features • Surface Mount SOT-323 Package • High Detection Sensitivity: Up to 50 mV/µW at 915 MHz Up to 35 mV/µW at 2.45 GHz Up to 25 mV/µW at 5.80 GHz

dycostrate

Abstract: CH-2074 without underfill
Contextual Info: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP

868mhz chip antenna

Abstract: FR4 dielectric constant 2.45GHz pcb yagi antenna RF pcb antenna 868 ltcc antenna ANT-868-CHP-x antenna 868MHZ PCB FR4 substrate with dielectric constant 4 ANT-245-CHP-X ltcc chip
Contextual Info: ANT- 2.4-CHP-x ANT-868-CHP-x ANT-916-CHP-x ULTRA COMPACT CHIP ANTENNAS DATA GUIDE DESCRIPTION PHYSICAL DIMENSIONS The exciting ANT-*-CHP family is among the world’s smallest high-performance Chip Antennas. They are ideal for embedding in wireless products including Bluetooth,

HSMS-285C

Abstract: Microwave detector diodes 285L AN1124 HSMS2850 HSMS-2850 HSMS285B marking code e6 sot363 HSMS-285x model
Contextual Info: Surface Mount Zero Bias Schottky Detector Diodes Technical Data HSMS-2850 Series Features • Surface Mount SOT-23/ SOT-143 Packages SOT-23/SOT-143 Package Lead Code Identification top view • Miniature SOT-323 and SOT-363 Packages SINGLE 3 SERIES 3 1 1

915 MHz RFID

Abstract: marking code e6 sot363 Marking Code ABC marking code PB surface mount diode marking code tc sot 363 METAL DETECTOR circuit for make SCHOTTKY DIODE SOT-143 HSMS2850 HSMS285B HSMS-285C
Contextual Info: Surface Mount Zero Bias Schottky Detector Diodes Technical Data HSMS-285x Series Features • Surface Mount SOT-23/ SOT-143 Packages SOT-23/SOT-143 Package Lead Code Identification top view • Miniature SOT-323 and SOT-363 Packages SINGLE 3 SERIES 3 1 1

HSMS-285B

Abstract: Diode Schottky Switch frequency 10 GHz 2.45 GHz single chip transmitter
Contextual Info: Surface Mount Microwave Schottky Detector Diodes in SOT-323 SC-70 Technical Data HSMS-285A Series HSMS-286A Series Features • Surface Mount SOT-323 Package • High Detection Sensitivity: Up to 50 mV/µW at 915 MHz Up to 35 mV/µW at 2.45 GHz Up to 25 mV/µW at 5.80 GHz

Contextual Info: W hü1 H E W L E T T mLttM P A C K A R D Surface Mount RF Schottky Detector Diodes in SOT-363 SC-70, 6 Lead Technical Data Features • Surface Mount SOT-363 Package • High Detection Sensitivity: Up to 50 mV/nW at 915 MHz Up to 35 mV/nW at 2.45 GHz Up to 25 mV/nW at 5.80 GHz

AOZ8105CI

Abstract: Protected Lines HDMI TO VGA MONITOR PINOUT HDMI to vga pinout marking Z1 SOT23-6 VGA TO HDMI PINOUT marking z1 sot-23-6 relative permittivity of fr4 permittivity FR 4 PCB hdmi 1.4 pcb layout
Contextual Info: AOZ8105 Ultra-Low Capacitance TVS Diode Array General Description Features The AOZ8105 is a transient voltage suppressor array designed to protect high speed data lines such as HDMI and Gigabit Ethernet from damaging ESD events. ● ESD protection for high-speed data lines:

82424TX

Contextual Info: PDM4M6124 PDM4M6125 PDM4M6126 Paradigm 128KB/256KB/512KB Second Level Cache Modules for the Intel i486 CPU/82420TX PCI Set Features: Description: n Available in 128KB/256KB/512KB configurations P Ideal for use with Intel i486 based systems, especially those using Intel's 82420TX Saturn

HSMS-2860 equivalent

Abstract: HSMS-286 HSMS-286K k 2865 MARKING CODE E6 sot363 marking code e5 sot363 DIODE RF DETECTOR
Contextual Info: Surface Mount RF Schottky Detector Diodes in SOT-363 SC-70, 6 Lead Technical Data HSMS-285L/P HSMS-286K/L/P/R Features • Unique configurations in surface mount SOT-363 package – increase flexibility – save board space – reduce cost • Excellent sensitivity for

chip t4 3570

Abstract: T4 3570 antenna F 868MHZ PCB RF pcb antenna 868 printed antenna 868 FR4 substrate antenna 868mhz chip antenna FR4 dielectric constant at 2.4ghz antenna microstrip antenna
Contextual Info: ANT-2.4-CHP-x ANT-868-CHP-x ANT-916-CHP-x ULTRA COMPACT CHIP ANTENNA DATA GUIDE DESCRIPTION PHYSICAL DIMENSIONS The exciting ANT-*-CHP family is among the world’s smallest highperformance chip antennas. They are ideal for embedding in wireless products

AN1124

Abstract: HSMS-286x Series METAL DETECTOR circuit for make HSMS-286x IC RFID 2.45 GHz mark code t4 diode SCHOTTKY DIODE SOT-143 Microwave detector diodes chip diode 047 diode SMA marking code PB
Contextual Info: Surface Mount Microwave Schottky Detector Diodes Technical Data HSMS-286x Series Features • Surface Mount SOT-23/ SOT-143 Packages SOT-23/SOT-143 Package Lead Code Identification top view • Miniature SOT-323 and SOT-363 Packages SINGLE 3 SERIES 3 • High Detection Sensitivity:

balun differential to single

Abstract: BD2425N100ATI CC2531 voice over rf4ce CC2530 MLK1005S cc2530 application note ANN-2004 ceramic capacitor footprint 0201 dimension connecting rf transceiver to 8051
Contextual Info: 0404 Balun App. Note 0404 Balun Application note ANN-2004 Rev A Page 1 of 12 Anaren 0404 (BD2425N100ATI) balun optimized for Texas Instruments CC2530 Transceiver Nithya R Subramanian – RF Engineer Chong Mei – Senior RF Engineer Febraury 2nd, 2010 Introduction

100A101MCA50

Contextual Info: That H E W L E T T ' mLfim P A C K A R D Surface Mount Microwave Schottky D etector D iodes in SOT-323 SC -70 Technical Data HSMS-285A Series HSMS-286A Series F eatures Package Lead Code Identification (Top View) • S u rface M ount SOT-323 P ackage • H igh D e te c tio n S en sitiv ity :