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    FORM OF TC 5029 Search Results

    FORM OF TC 5029 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLP223GA
    		Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 400 V/0.12 A, 5000 Vrms, DIP4 Datasheet
    TLP4590A
    		Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-b), 60 V/1.2 A, 5000 Vrms, DIP6 Datasheet
    TLP170GM
    		Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 350 V/0.11 A, 3750 Vrms, 4pin SO6 Datasheet
    TLP3122A
    		Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 60 V/1.4 A, 3750 Vrms, 4pin SO6 Datasheet
    TLP3412SRHA4
    		Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 60 V/0.25 A, 300 Vrms, S-VSON16T Datasheet

    FORM OF TC 5029 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SHD626160

    Abstract: form of tc 5029 pdf form of tc 5029 SHD626160P
    Contextual Info: SHD626160 SHD626160P SHD626160N SHD626160D SENSITRON SEMICONDUCTOR TECHNICAL DATA DATA SHEET 5029, REV. - HERMETIC SILICON CARBIDE RECTIFIER DESCRIPTION/FEATURES: A 300-VOLT, 40 AMP, POWER SILICON CARBIDE RECTIFIER IN A HERMETIC TO-257 PACKAGE AVAILABLE SCREENED TO ANY REQUIRED LEVEL


    Original     		SHD626160 SHD626160P SHD626160N SHD626160D 300-VOLT, O-257 SHD626160 form of tc 5029 pdf form of tc 5029 SHD626160P PDF

    AN4506

    Contextual Info: AN4506 Application Note TGD-1X AN4506 Calculation Of Junction Temperature Application Note Replaces September 2000 version, AN4506-4.0 There are a number of ways of calculating the junction temperature of a device. These involve various levels of complexity from a quick hand calculation to a full three


    Original     		AN4506 AN4506 AN4506-4 PDF

    RHODORSIL

    Abstract: unial BICC BX13 AN4505 AN4505-5 RHODORSIL COMPOUND 5 oil bicc
    Contextual Info: AN4505 Application Note AN4505 Heatsink Issues For IGBT Modules Application Note Replaces March 2001 version, AN4505-5.0 AN4505-5.1 July 2002 The maximum permissible junction temperature Tjmax of an IGBT is fixed and a suitable heatsink must be selected to keep


    Original     		AN4505 AN4505 AN4505-5 RHODORSIL unial BICC BX13 RHODORSIL COMPOUND 5 oil bicc PDF

    the calculation of the power dissipation for the igbt and the inverse diode in circuits

    Abstract: AN4505 AN4506 Calculation of major IGBT operating parameters
    Contextual Info: AN4504 Application Note AN4504 IGBT Ratings And Characteristics Application Note Replaces September 2000 version, AN4504-3.0 Load AN4504-3.1 July 2002 PNP VD applications this diode acts as a free-wheeling diode or as a protection diode. Fig. 2 illustrates the packages used by Dynex


    Original     		AN4504 AN4504 AN4504-3 the calculation of the power dissipation for the igbt and the inverse diode in circuits AN4505 AN4506 Calculation of major IGBT operating parameters PDF

    DFM300WXS12-A000

    Contextual Info: DFM300WXS12-A000 Fast Recovery Diode Module PDS5795-1.3 October 2007 LN25579 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Voltage Drop KEY PARAMETERS VRRM VF (typ) IF (max) IFM (max) 1200V 2.0 V 300A 600A Isolated Base APPLICATIONS


    Original     		DFM300WXS12-A000 PDS5795-1 LN25579) DFM300WXS12-A000 PDF

    DFM600BXS12-A000

    Contextual Info: DFM600BXS12-A000 Fast Recovery Diode Module PDS5725-1.3 October 2007 LN25580 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Voltage Drop KEY PARAMETERS VRRM VF (typ) IF (max) IFM (max) 1200V 2.0 V 600A 1200A Isolated Base APPLICATIONS


    Original     		DFM600BXS12-A000 PDS5725-1 LN25580) DFM600BXS12-A000 PDF

    DFM300BXS12-A000

    Abstract: LN25576
    Contextual Info: DFM300BXS12-A000 Fast Recovery Diode Module PDS5724-1.3 October 2007 LN25576 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Voltage Drop KEY PARAMETERS VRRM VF (typ) IF (max) IFM (max) 1200V 2.0 V 300A 600A Isolated Base APPLICATIONS


    Original     		DFM300BXS12-A000 PDS5724-1 LN25576) DFM300BXS12-A000 LN25576 PDF

    DFM300BXS17-A000

    Abstract: fuse switch
    Contextual Info: DFM300BXS17-A000 Fast Recovery Diode Module PDS5796-1.2 October 2007 LN25577 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Voltage Drop KEY PARAMETERS VRRM VF (typ) IF (max) IFM (max) 1700V 2.0 V 300A 600A Isolated Base APPLICATIONS


    Original     		DFM300BXS17-A000 PDS5796-1 LN25577) DFM300BXS17-A000 fuse switch PDF

    DFM300WXS17-A000

    Contextual Info: DFM300WXS17-A000 Fast Recovery Diode Module PDS5797-1.2 October 2007 LN25578 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Voltage Drop KEY PARAMETERS VRRM VF (typ) IF (max) IFM (max) 1700V 2.0 V 300A 600A Isolated Base APPLICATIONS


    Original     		DFM300WXS17-A000 PDS5797-1 LN25578) DFM300WXS17-A000 PDF

    12v to 1000v inverters circuit diagrams

    Abstract: DIM1200FSM17-A000
    Contextual Info: DIM1200FSM17-A000 DIM1200FSM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5456-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5456-2.1 May 2002


    Original     		DIM1200FSM17-A000 DS5456-2 2400y 12v to 1000v inverters circuit diagrams DIM1200FSM17-A000 PDF

    DIM800DDM17-A000

    Abstract: DIM800DDM17
    Contextual Info: DIM800DDM17-A000 DIM800DDM17-A000 Dual Switch IGBT Module Replaces May 2001, version DS5433-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5433-3.0 March 2002


    Original     		DIM800DDM17-A000 DS5433-2 DS5433-3 DIM800DDM17-A000 DIM800DDM17 PDF

    DIM400DDM12-A000

    Contextual Info: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Preliminary Information DS5532-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS


    Original     		DIM400DDM12-A000 DS5532-1 DIM400DDM12-A000 PDF

    DIM800DCM12-A000

    Contextual Info: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module DS5548-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES typ VCE(sat) *


    Original     		DIM800DCM12-A000 DS5548-1 DIM800DCM12-A000 PDF

    bi-directional switches IGBT

    Abstract: DIM200MBS12-A000 7404* 15v
    Contextual Info: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Preliminary Information DS5545-1.3 May 2002 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon KEY PARAMETERS VDRM typ VT (max) IC (max) IC(PK) ±1200V 4.3V 200A 400A


    Original     		DIM200MBS12-A000 DS5545-1 DIM200MBS12-A000 bi-directional switches IGBT 7404* 15v PDF

    not gate ic 7404

    Abstract: DIM200MHS17-A000 7404* 15v
    Contextual Info: DIM200MHS17-A000 DIM200MHS17-A000 Half Bridge IGBT Module Replaces issue February 2002, version DS5459-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base DS5459-4.0 March 2002 KEY PARAMETERS VCES typ VCE(sat) *


    Original     		DIM200MHS17-A000 DS5459-3 DS5459-4 not gate ic 7404 DIM200MHS17-A000 7404* 15v PDF

    DIM1800ESM12-A000

    Contextual Info: DIM1800ESM12-A000 DIM1800ESM12-A000 Single Switch IGBT Module Preliminary Information DS5529-1.3 April 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM1800ESM12-A000 DS5529-1 DIM1800ESM12-A000 PDF

    DIM1600FSM12-A000

    Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information DS5533-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM1600FSM12-A000 DS5533-1 DIM1600FSM12-A000 PDF

    DS5445-4

    Abstract: DIM800FSS17-A000
    Contextual Info: DIM800FSS17-A000 DIM800FSS17-A000 Single Switch IGBT Module Replaces October 2001 version DS5445-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon DS5445-4.0 March 2002 KEY PARAMETERS VCES typ


    Original     		DIM800FSS17-A000 DS5445-3 DS5445-4 DIM800FSS17-A000 PDF

    DIM200MHS12-A000

    Contextual Info: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Preliminary Information DS5535-1.4 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon KEY PARAMETERS VCES typ VCE(sat)* (max) IC


    Original     		DIM200MHS12-A000 DS5535-1 DIM200MHS12-A000 PDF

    LM 13500

    Abstract: DIM2400ESM12-A000
    Contextual Info: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Preliminary Information DS5529-1.3 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM2400ESM12-A000 DS5529-1 LM 13500 DIM2400ESM12-A000 PDF

    DIM200PHM33-A000

    Contextual Info: DIM200PHM33-A000 DIM200PHM33-A000 Half Bridge IGBT Module Replaces October 2001, version DS5464-4.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates APPLICATIONS


    Original     		DIM200PHM33-A000 DS5464-4 DS5464-5 DIM200PHM33-A000 PDF

    DIM200PHM33-A000

    Contextual Info: DIM200PHM33-A000 DIM200PHM33-A000 Half Bridge IGBT Module Preliminary Information Replaces August 2001, version DS5464-3.0 FEATURES DS5464-4.0 October 2001 KEY PARAMETERS • 10µs Short Circuit Withstand VCES ■ High Thermal Cycling Capability VCE sat (typ)


    Original     		DIM200PHM33-A000 DS5464-3 DS5464-4 DIM200PHM33-A000 PDF

    DIM1200FSM17-A000

    Contextual Info: DIM1200FSM17-A000 DIM1200FSM17-A000 Single Switch IGBT Module Replaces May 2001, version DS5456-1.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5456-2.0 March 2002


    Original     		DIM1200FSM17-A000 DS5456-1 DS5456-2 2400y DIM1200FSM17-A000 PDF

    DIM400LSS12-A000

    Contextual Info: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Preliminary Information DS5534-1.4 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon KEY PARAMETERS VCES typ VCE(sat)* (max) IC


    Original     		DIM400LSS12-A000 DS5534-1 DIM400LSS12-A000 PDF