FLP PACKAGE Search Results

mn12510

Contextual Info: Microcomputer Peripheral LSIs • Microcomputer Peripheral LSIs Category FLP driver Type No. MN12510 Process CMOS MN1256 LCD driver Voltage detector Supply Voltage V Package No. FLP drive control, Key scan control -3 0 , + 5 SDIP042-P-0600 QFP044-P-1010

FLP-16

Contextual Info: SEMICONDUCTOR FLP-16 L G P D T H PACKAGE DIMENSION 9 1 8 B1 16 B2 A FLP-16 DIM A B1 B2 D G H L P T MILLIMETERS _ 0.2 9.88 + _ 0.2 3.94 + _ 0.3 6.00 + _ 0.1 0.4 + 0.15+0.1/-0.05 _ 0.2 1.63 + _ 0.2 0.65 + 1.27 0.20+0.1/-0.05

FLP-14

Abstract: semiconductor
Contextual Info: SEMICONDUCTOR FLP-14 L G P D T H PACKAGE DIMENSION 8 1 7 B1 14 B2 A FLP-14 DIM A B1 B2 D G H L P T MILLIMETERS _ 0.2 8.66 + _ 0.2 3.94 + _ 0.3 6.00 + _ 0.1 0.4 + 0.15+0.1/-0.05 _ 0.2 1.63 + _ 0.2 0.65 + 1.27 0.20+0.1/-0.05

FLP-20

Abstract: 10B-2
Contextual Info: SEMICONDUCTOR FLP-20 L G P D T H PACKAGE DIMENSION 11 1 10 B1 20 B2 A FLP-20 DIM A B1 B2 D G H L P T MILLIMETERS _ 0.2 12.83 + _ 0.2 7.49 + _ 0.3 10.34 + _ 0.1 0.4 + 0.20+0.1/-0.05 _ 0.2 2.51+ _ 0.2 0.65 + 1.27 0.27+0.1/-0.05

4B-25

Abstract: FLP-8
Contextual Info: SEMICONDUCTOR FLP-8 L G P D T H PACKAGE DIMENSION 5 1 4 B1 8 B2 A FLP-8 DIM A B1 B2 D G H L P T MILLIMETERS _ 0.2 4.85 + _ 0.2 3.94 + _ 0.3 6.02 + _ 0.1 0.4 + 0.15+0.1/-0.05 _ 0.2 1.63 + _ 0.2 0.65 + 1.27 0.20+0.1/-0.05

C3293

Abstract: C3502 c3955 C3953 D1347 D1804 C3467 a1540 D1803 a1538
Contextual Info: SA0YO New Package FLP Full Mold Large P a c k a g e Seri es Sanyo hasdeveloped FLP (Full Mold Large Package) to meet the needs of miniaturization and automatic insertion in the midst of progressingindustrial and consumer electronics. Though it is a large power type with Pc=1.5W, it is achieved that theheight on

KF5N50

Abstract: kf12n60 IC 1N4007 diode 400V 4A TO220IS 1N4007 diode bridge MB6S mje13005 DF06 IC kf13n50
Contextual Info: Package Line-up Outline Name ESM USM TSM SOT-23 FLP-8 DPAK FLP-14 Size[㎣] 1.65x0.85 2.0×1.25 2.9×1.6 2.93×1.3 4.85×3.94×1.6 6.6×6.1 8.66×3.94×1.63 Type No. Package MB6S / M VRRM MBS / M IF Type No. KTC3003 HV 0.5A 600V DF06(S) DF(S) 1N4007(G) DO-41

Contextual Info: SEMICONDUCTOR FLP-8 PACKAGE DIMENSION H T G P D L A 8 5 B1 B2 1 4 DIM A B1 B2 D G H L P T MILLIMETERS _ 0.2 4.85 + _ 0.2 3.94 + _ 0.3 6.02 + _ 0.1 0.4 + 0.15+0.1/-0.05 _ 0.2 1.63 + _ 0.2 0.65 + 1.27 0.20+0.1/-0.05 FLP-8 2007. 3. 9 Revision No : 1 1/1

FLP-8

Abstract: mosfet
Contextual Info: SEMICONDUCTOR FLP-8 PACKAGE DIMENSION MOSFET H G P D T L A 8 5 B1 B 1 4 DIM MILLIMETERS _ 0.1 A 4.9 + _ 0.2 B 6.0 + _ 0.1 B1 3.9 + _ 0.065 D 0.445 + _ 0.075 G 0.175 + _ 0.2 H 1.55 + _ 0.215 L 0.715 + P 1.27 BSC T 0.254 FLP-8 2006. 2. 23 Revision No : 1 1/1

Contextual Info: 30W LED Panel Light QT-Brightek LED Panel Light Series 30W LED Panel Light Part No.: FLP-6060-030-XX XX Color Code = WW/NW/CW Product: FLP-6060-030-XX Date: October 15, 2013 Version# 1.0 Page 1 of 7 30W LED Panel Light Table of Contents: Introduction . 3

C3293

Abstract: D1804 c3807 C3953 C3502 C3467 d1815 B985 B1166 c3950
Contextual Info: SA0YO N e w P a c k a g e FLP Full M o l d L a r ge P a c k a g e S e r i e s Sanyo hasdeveloped FLP (Full Mold Large Package) to meet the needs of miniaturization and automatic insertion in themidst of progressingindustrial and consumer electronics. Though it is a large power type with Pc=1.5ff, it is achieved that

KID65001AF

Abstract: 65001AF FLP-16
Contextual Info: SEMICONDUCTOR KID65001AF MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65001AF 116 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65001AF KID65001AF 3 Lot No.

KID65084AF

Abstract: 65084AF
Contextual Info: SEMICONDUCTOR KID65084AF MARKING SPECIFICATION FLP-20 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65084AF 016 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65084AF KID65084AF 3 Lot No.

KID65783AF

Abstract: 65783AF FLP-20 65783A KID65783
Contextual Info: SEMICONDUCTOR KID65783AF MARKING SPECIFICATION FLP-20 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65783AF 016 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65783AF KID65783AF 3 Lot No.

FLP-16

Abstract: KID65501F
Contextual Info: SEMICONDUCTOR KID65501F MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65501F 816 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65501F KID65501F 3 Lot No. 816

FLP-16

Abstract: KID65506F 65506F
Contextual Info: SEMICONDUCTOR KID65506F MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65506F 816 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65506F KID65506F 3 Lot No. 816

FLP-16

Abstract: KID65502F
Contextual Info: SEMICONDUCTOR KID65502F MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65502F 816 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65502F KID65502F 3 Lot No. 816

65003AF

Abstract: KID65003AF FLP-16 KID65003A kid65003
Contextual Info: SEMICONDUCTOR KID65003AF MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65003AF 816 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65003AF KID65003AF 3 Lot No.

KID65083AF

Contextual Info: SEMICONDUCTOR KID65083AF MARKING SPECIFICATION FLP-20 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65083AF 016 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65083AF KID65083AF 3 Lot No.

FLP-16

Abstract: KID65504F
Contextual Info: SEMICONDUCTOR KID65504F MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65504F 816 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65504F KID65504F 3 Lot No. 816

mn12510

Abstract: MN5502 MN13821M MN5501 Panasonic mn13811 MN13812
Contextual Info: Microcomputer Peripheral LSIs • Microcomputer Peripheral LSIs Category FLi’ driver Type No. Process MN12510 CMOS MN1256 LCI driver MN1258 CMOS MN1259 LCD/CRT interface MN5502 Voltage detector CMOS Supply Voltage V) Package No. 122 FLP drive control. Key scan control

KID65503F

Abstract: 65503F FLP-16 kid65503
Contextual Info: SEMICONDUCTOR KID65503F MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65503F 816 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65503F KID65503F 3 Lot No. 816

FLP-16

Abstract: KID65505F
Contextual Info: SEMICONDUCTOR KID65505F MARKING SPECIFICATION FLP-16 PACKAGE 1. Marking method Laser Marking or Ink Marking 2. Marking KID 65505F 816 No. Item Marking Description 1 Trade Name KID KEC Digital Integrated Circuit 2 Device Name 65505F KID65505F 3 Lot No. 816

mn12510

Abstract: N1380 N-550-2 pdp scan driver n1259 MN13811
Contextual Info: Microcomputer Peripheral LSIs • Microcomputer Peripheral LSIs Category Type No. Process Functions Supply Voltage Package No. V FLP driver MN12510 CMOS M N1256 LCD driver M N1258 CMOS M N1259 LCD/CRT interface Voltage detector Clock (Calendar) M N5502 CMOS