FLATPACK HERMETIC Search Results

CDFP4-F20

Abstract: K20.A Package k20a
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K20.A MIL-STD-1835 CDFP4-F20 (F-9A, CONFIGURATION B) 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

cdfp3-f28

Abstract: dip 28 dimension
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

CDFP4-F24

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

CDFP3-F14

Abstract: K14.A Package
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

cdfp4-f16

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.B A e 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.070 0.115 1.78 2.92 - b 0.015

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K18.B A e 18 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA SYMBOL -A- D -B- S1 b MIN MILLIMETERS MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 - b 0.015

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K8.A A e 8 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA SYMBOL -A- D -B- S1 b MIN MILLIMETERS MAX MIN MAX NOTES A 0.070 0.115 1.18 2.92 - b 0.015

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack E 1 K42.A TOP BRAZED 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE N e INCHES A A D b E1 S1 L C Q A E2 c1 LEAD FINISH BASE METAL (c) SYMBOL MILLIMETERS MIN MAX MIN MAX

CDFP3-F10

Abstract: k10a
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B) 10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE e A INCHES A -A- D -BPIN NO. 1 ID AREA b E1 0.004 M H A-B S Q D S S1

K18C

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Ceramic Lid Flatpack Packages Flatpack K18.C A e 18 LEAD CERAMIC METAL SEAL CERAMIC LID FLATPACK PACKAGE A PIN NO. 1 ID AREA INCHES -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S C

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack e A K16.D A 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE PIN NO. 1 ID AREA INCHES -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S E -D-H- E2 L E3 SEATING AND

ordering information

Contextual Info: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack

CERAMIC QUAD FLATPACK CQFP 14 pin

Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
Contextual Info: pASIC DEVICE Packaging Specifications HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP.

Lorch

Abstract: vernitron 33710 FC-200RF FC-200LF FC-200ZF FC-201LF FC-201RF FC-201ZF 201rf
Contextual Info: VERNITRON/ LORCH ELEK 33E D • iLORc SMSflbb3 ODDOMÖ1 3 T-nV-ùl-ôi MINIATURE DOUBLE BALANCED MIXERS FLATPACK AND CONNECTOR VERSIONS 10 KHz to 1000 MHz LO POWER +7dBm FLATPACK VERSION FC-2Ö0LF FC-200RF FC-200ZF CONNECTOR VERSION FULL FREQUENCY RANGE MHz

244u

Abstract: 244-Z
Contextual Info: VERNITRON/ LORCH ELEK 33E D • IMSflbfeB OOOOMfl^ Ö * L O R C ULTRA LOW DISTORTION DOUBLE BALANCED MIXERS PC, FLATPACK AND CONNECTOR VERSIONS 1.0 MHz to 700 MHz FC-244Y FC-244YF LO POWER +27dBm FC-244R FC-244RF PC VERSION FC-244Z FC-244U FLATPACK VERSION

Contextual Info: PRECISION BULK " ' ' METAL — — — - FOIL — TECHNOLOGY • — — “ a c o m p a n y of V I S H A Y VISHAY VISHAY MODEL 1490 RESISTORS 14 Pin Flatpack Hermetic Resistor Network The 14 pi n 0.420 square flatpack is a compact metal package providing excellent heat transfer for power dissipation require­

Lorch

Abstract: vernitron N2801 FC-201YL FC-200 FC-200YL FC-200Y lorch fc 201 r lorch fc 201 rf
Contextual Info: VERNITRON/ LORCH ELEK 33E » • TMSflbbB 0000476 3 ■ L O R C GENERAL PURPOSE DOUBLE BALANCED MIXERS PC, FLATPACK AND CONNECTOR VERSIONS 10 KHz to 225 MHz FC-200YL FC-200Y FC-200YF LO POWER +7dBm FC-200 FC-200F PC VERSION MODEL FLATPACK VERSION FIG. NOTE

48 Lead Ceramic Quad Flatpack

Abstract: CERAMIC QUAD FLATPACK CQFP 96 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R48.A D S 48 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S INCHES D S D SYMBOL D1 A PIN NO. 1 L e A A -AE1 E e2 -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS

Vernitron

Abstract: Lorch FC-201YL atos FC-200Y FC-200 FC-201 lorch fc 201 r lorch fc 201 rf
Contextual Info: VERNITRON/ LORCH E L E K 33E » • TMSÔbbB D000M7Û 3 «LORC GENERAL PURPOSE DOUBLE BALANCED MIXERS PC, FLATPACK AND CONNECTOR VERSIONS 10 KHz to 225 MHz FC-200YL FC-200Y FC-200YF LO POWER +7dBm FC-200 FC-200F PC VERSION MODEL FLATPACK VERSION FIG. NOTE

CERAMIC QUAD FLATPACK CQFP

Abstract: CERAMIC QUAD FLATPACK CQFP 96
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R68.A D S 68 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S D INCHES D S SYMBOL D1 A PIN NO. 1 L e A A -AE1 e2 E -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS

vernitron

Abstract: FC-194Y
Contextual Info: VERNITRON/ LORCH ELEK 33E T> WÈ TMSflbb3 Q000M7b T « L O R C LOW LEVEL DOUBLE BALANCED MIXERS PC, TO-5, TO-8, FLATPACK AND CONNECTOR VERSIONS 50 KHz to 1000 MHz LO POWER OdBm PC VERSION FC-193Y FC-193R FC-193Z FLATPACK VERSION MODEL FIG. NOTE MODEL 1 FIG.

HC 4093

Contextual Info: SENSITRON SEMICONDUCTOR SMC6G30-60 SMC6G30-60-1 TECHNICAL DATA DATASHEET 4093, REV. - Brushless DC Motor Driver Module in a Power Flatpack 600V, 30 Amp DESCRIPTION: The SMC6G30-60 is an, integrated three-phase brushless DC motor controller/driver subsystem housed in a 43 pin power flatpack. The SMC6G30-60 is best used as a twoquadrant speed controller for controlling/driving fans, pumps, and motors in applications

pin diagram ic 4093

Abstract: DIODE ZENER ea1 4093 pwm IC 4093 pin block diagram HC 4093 4093 oscillator speed control of motor Motor Driver Circuit schematic 10 ampere
Contextual Info: SENSITRON SEMICONDUCTOR SMC6G30-60 SMC6G30-60-1 TECHNICAL DATA DATASHEET 4093, REV. - Brushless DC Motor Driver Module in a Power Flatpack 600V, 30 Amp DESCRIPTION: The SMC6G30-60 is an, integrated three-phase brushless DC motor controller/driver subsystem housed in a 43 pin power flatpack. The SMC6G30-60 is best used as a twoquadrant speed controller for controlling/driving fans, pumps, and motors in applications