FBGA16
Abstract: 393 NEC
Contextual Info: TRAY CONTAINER UNIT : mm 6x16=96 135°C MAX. 19.20 16.30 7 NEC 107.0 21.40 FBGA16×16ESP A' 14.45 16.30 13.50 288.0 315.0 322.6 Section A – A' 16.30 (5.62) (6.09) 16.00 7.62 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA16×16ESP 224-pin Plastic FBGA (16×16)
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FBGA16
Abstract: JEDEC TRAY DIMENSIONS
Contextual Info: UNIT : mm 6x15=90 JAPAN 97.5 135°C MAX. 19.50 FBGA16×16×1.26 19.20 16.5 21.00 19.50 273.0 315.0 322.6 SECTION A – A' 16.50 6.62 7.62 (6.35) 135.9 NEC 16.5 Applied Package 224-pin Plastic FBGA ( 16) Quantity (pcs) MAX. 90 Tray Material Heat Proof Temp.
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H26M* hynix
Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
Contextual Info: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title
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150ms512kb220ms247ms+11262msh26m* hynixhynix emmc 4.5 controllerhynix emmch26m3100fbga153h26m4fbga169h26m31001fprhynix emmc 5.1 controllerh26m5
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65A2
Contextual Info: P—FBGA160—1515—0.65A2 Uniti nn Nov.2006
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35RAPC
Abstract: Sandisk emmc FBGA169 ADSP-BF518
Contextual Info: ADSP-BF518F EZ-Board Evaluation System Manual TM Revision 1.1, June 2009 Part Number 82-000217-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 Copyright Information 2009 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60wmbg60m/54wbga-810x1510-8x12-a+16la69-00635a48tbga48-tbga-100-8x16-ola69-00267aads119811f1-1717-a19153fbgabga 6x6 trayfbga tray kostattray bga 6x6169fbga-12.0x16.0-8x16-078boc-1178bocepak bga 5x5 tray153fbga-9
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1 gb micro sd card
Abstract: THNS512GG8BB FBGA153 SDXC THNS128GG4BB sata ssd controller msata THNSNB062GMSJ FBGA169 THNSNB062GMCJ
Contextual Info: 製品カタログ 2010-3 東芝半導体 製品カタログ メモリ・ストレージデバイス h t t p : / / w w w. s e m i c o n . t o s h i b a . c o . j p / メモリ・ストレージデバイス メモリ・ストレージデバイス 東芝は1984年にフラッシュメモリを世界で初めて開発しその後開発したNAND型フラッシュメモリでは最先端の技術、
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512mbit4gbitbcj0092a1 gb micro sd cardthns512gg8bb+8fbga153sdxcthns128gg4bbsata ssd controllermsatathnsnb062gmsjfbga169thnsnb062gmcj
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P-FBGA169
Abstract: FBGA169
Contextual Info: P—FBGA169—1515—0.80B3 Uniti m Apr.2001
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eMMC
Abstract: 8GB eMMC SLC emmc controller emmc 4.41 32GB emmc FBGA153 emmc4.41 KE4BT4B6A FBGA169 16GB emmc
Contextual Info: KINGSTON.COM e•MMC — the perfect storage solution for mobile applications Overview Kingston’s current e•MMC product follows the JEDEC e•MMC4.41 standard. It is an ideal universal storage solution for many electronic devices, including smartphones, tablet PCs, PDAs, eBook readers, MIDs, digital cameras and recorders, MP3, MP4
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mkf-428emmc8gb emmc slcemmc controller+7emmc 4.4132gb emmcfbga153emmc4.41ke4bt4b6afbga16916gb emmc
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hynix emmc
Abstract: h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31
Contextual Info: H26M31001EFR This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.3 / Feb. 2011 1 Document Title e-NAND Revision History
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h26m31001efrfig1325mhz52mhz+1064kbytehynix emmch26m31001hynix emmc 4.5 controllerjesd84-a441h26m* hynixemmc 4.51h26m3100manufacturer id emmc hynixh26m31
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fbga 12 x 12 thermal resistance
Abstract: FBGA160-P-1212
Contextual Info: 1C PACKAGES Pin-inserting Type i Surface-mount Type 1C Pack. TCP Tape Carrier Package CSP (Chip Size Package) Stacked Package COB (Chip On Board) Nowadays, the prominence of higher performance, smaller and lighter electronic equipment is increasing. Accordingly, the role played by the
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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lga 1156 pin out diagramqfp11t144-002lga 1156 socket diagram216-lqfp+6wells-cti 36 lead flat packsmd aaaswells-cti lcc socketwells-cti 880 020bga136enplas drawings
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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lga 1155 socket pin diagrammarking code smd fujitsuyamaichi ic354marking code smd semiconductor fujitsu+6pitch 0.4 qfp 256psmd transistor m05yamaichi ic234smd code 38pfpq-144-0.5-03smd p08
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65A2
Contextual Info: raSS3SQSÑüiSSFüCS'OGo>ia>ai*u ooooooooooolooooooooo ooooooooooopoooooooq -oo -oo 'S . o o GO bd oo oo oo oo oo o oo p— m Nov.2006 P—FBGA160—1515—0.65A2 a <s¡ EEMH O, 42±0, 04, 1. 3nax. Uniti m
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HN58C1001FPI-15
Abstract: HN58C1001FPI-15 hitachi M5M5V216ATP-55HI M5M51008DFP-55HI BGA-165 M5M5W817 TSOP 28 SPI memory Package flash BGA165 SRAM 512K*8 BIT SOP32 M5M5256DFP-70LL
Contextual Info: Memory Products Reliable specialty, advanced and mainstream commodity memory devices for digital storage applications Renesas, the #3 semiconductor supplier worldwide, offers an extensive range of memory ICs for temporary and permanent digital storage in all kinds
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0603/5k/jpg/bcd/sp01-1889ahn58c1001fpi-15hn58c1001fpi-15 hitachi+8m5m5v216atp-55him5m51008dfp-55hibga-165m5m5w817tsop 28 spi memory package flashbga165sram 512k*8 bit sop32m5m5256dfp-70ll
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