FBGA15 Search Results

fBGA package tray

Abstract: JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard
Contextual Info: TRAY CONTAINER 110.1 A A' 7 135°C MAX 15.74 18.35 FBGA15x15ESP 12.90 NEC 135.9 PPE 7×17=119 Unit : mm 15.74 18.10 289.6 12.70 315.0 322.6 SECTION A – A' 15.74 (5.91) 5.62 7.62 15.00 Applied Package Quantity(PCS) Tray FBGA 15×15ESP 176-pin PLASTIC FBGA (15×15)

fBGA package tray

Abstract: fBGA package tray 12
Contextual Info: UNIT : mm 112.5 7x16=112 JAPAN 135°C MAX. 18.75 FBGA15×15×1.46 11.70 15.15 15.15 19.40 12.00 291.0 315.0 322.6 SECTION A – A' 6.32 (6.35) 15.15 7.62 135.9 NEC A' A Applied Package 176-pin Plastic FBGA ( 15) Quantity (pcs) MAX. 112 Tray Material Heat Proof Temp.

TRAY DIMENSIONS

Abstract: NEC a
Contextual Info: UNIT : mm 7x16=112 135°C MAX. 18.75 15.15 15.15 19.40 12.00 291.0 315.0 322.6 SECTION A – A' 6.32 (6.35) 15.15 7.62 135.9 A' FBGA15×15×1.46 Rev2 11.70 112.5 NEC A Applied Package 176-pin • Plastic FBGA ( 15) 208-pin • Plastic FBGA ( 15) Quantity (pcs)

Achronix Semiconductor

Contextual Info: I Speedster22i HD FPGA Family DS004 Rev. 2.6 – May 8, 2014 Preliminary Highlights • • • Advanced highest-density and highest‐bandwidth FPGA • Over 1.7 million effective look‐up‐tables • Abundant embedded hard IP for communica‐

H26M* hynix

Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
Contextual Info: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

1 gb micro sd card

Abstract: THNS512GG8BB FBGA153 SDXC THNS128GG4BB sata ssd controller msata THNSNB062GMSJ FBGA169 THNSNB062GMCJ
Contextual Info: 製品カタログ 2010-3 東芝半導体 製品カタログ メモリ・ストレージデバイス h t t p : / / w w w. s e m i c o n . t o s h i b a . c o . j p / メモリ・ストレージデバイス メモリ・ストレージデバイス 東芝は1984年にフラッシュメモリを世界で初めて開発しその後開発したNAND型フラッシュメモリでは最先端の技術、

eMMC

Abstract: 8GB eMMC SLC emmc controller emmc 4.41 32GB emmc FBGA153 emmc4.41 KE4BT4B6A FBGA169 16GB emmc
Contextual Info: KINGSTON.COM e•MMC — the perfect storage solution for mobile applications Overview Kingston’s current e•MMC product follows the JEDEC e•MMC4.41 standard. It is an ideal universal storage solution for many electronic devices, including smartphones, tablet PCs, PDAs, eBook readers, MIDs, digital cameras and recorders, MP3, MP4

EM47FM3288SBB

Contextual Info: EM47FM3288SBB 16Gb 64Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • JEDEC Standard VDD/VDDQ = 1.5V±0.075V. • All inputs and outputs are compatible with SSTL_15 interface. • Fully differential clock inputs (CK, /CK) operation. • Eight Banks

Contextual Info: PRODUCT BRIEF Speedster 22i HD FPGA Platform SPEEDSTER22i HD HIGHLIGHTS • World’s most advanced FPGAs with up to: –– Half the power and half the cost of competing FPGAs –– 1.1 million programmable LUTs and 1.7 million equivalent 4-input LUTs –– 145 Mb of on-chip RAM

Contextual Info: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 EM47FM3288SBB 16Gb 64Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • JEDEC Standard VDD/VDDQ = 1.5V±0.075V. • All inputs and outputs are compatible with SSTL_15 interface. • Fully differential clock inputs (CK, /CK) operation.