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    FBGA PACKAGE TRAY 12 Search Results

    FBGA PACKAGE TRAY 12 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    XPH2R106NC
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Datasheet

    FBGA PACKAGE TRAY 12 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    FBGA 63

    Abstract: JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS
    Contextual Info: NEC 119.6 8.15 9.20 A' 5.30 8.80 5.30 135° C MAX. FBGA5 x 5A A 299.2 315.0 322.6 7.90 5.30 Section A – A' (5.62) (5.79) 5.00 7.62 135.9 PPE 14 × 35=490 TRAY CONTAINER Applied Package Tray FBGA 5×5A 61-pin Plastic FBGA (5×5) Material Carbon PPE 61-pin Tape FBGA (5×5)


    Original     		61-pin 63-pin 97-pin SSD-A-H7519-2 FBGA 63 JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS PDF

    SSD-A-H7391-2

    Abstract: FBGA 152 JEDEC TRAY DIMENSIONS FBGA
    Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC 135°C MAX. A' 16.15 13.40 16.00 FBGA13×13ESP 13.40 12.15 290.7 315.0 322.6 Section A – A' 13.40 (5.62) (5.82) 12.70 7.62 11.95 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 13×13 ESP 381-pin Plastic FBGA (12.7×12.7)


    Original     		FBGA13 13ESP 381-pin 384-pin 481-pin 509-pin 525-pin SSD-A-H7391-2 SSD-A-H7391-2 FBGA 152 JEDEC TRAY DIMENSIONS FBGA PDF

    JEDEC TRAY DIMENSIONS FBGA

    Abstract: 529-Pin
    Contextual Info: TRAY CONTAINER A' 14.65 7 135°C MAX 18.35 A FBGA14x14ESP 12.90 NEC 110.1 135.9 PPE 7×18=126 UNIT : mm 14.65 17.10 290.7 12.15 315.0 322.6 SECTION A – A' 14.65 (5.85) (5.62) 7.62 14.00 Applied Package Quantity (pcs) FBGA 14×14 ESP Tray 157-pin Plastic FBGA (14×14)


    Original     		FBGA14 14ESP 157-pin 257-pin 321-pin 352-pin 421-pin 529-pin SSD-A-H7103-2 JEDEC TRAY DIMENSIONS FBGA PDF

    JEDEC FBGA

    Abstract: fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray
    Contextual Info: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 12.30 7 135°C MAX. A' 12.30 15.50 10.25 294.5 315.0 322.6 Section A – A' (6.29) 12.30 12.00 (6.35) 7.62 16.40 FBGA12×12ESP-1 10.55 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 12×12 ESP-1 121-pin Plastic FBGA (12×12)


    Original     		FBGA12 12ESP-1 121-pin 144-pin 160-pin 180-pin 204-pin 209-pin 337-pin 397-pin JEDEC FBGA fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray PDF

    FBGA 12x12 TRAY

    Abstract: nec 1230 JEDEC TRAY DIMENSIONS FBGA
    Contextual Info: TRAY CONTAINER UNIT : mm 8x20=160 135°C MAX. 16.40 A' 12.30 114.8 FBGA12×12B 10.55 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.35) (6.29) 12.30 12.00 7.62 135.9 PPE A Applied Package 209-pin Plastic FBGA (12×12) Quantity (pcs) 160 MAX. FBGA 12×12B


    Original     		FBGA12 209-pin SSD-A-H7722-1 FBGA 12x12 TRAY nec 1230 JEDEC TRAY DIMENSIONS FBGA PDF

    JEDEC FBGA

    Abstract: 196-PIN 181-pin
    Contextual Info: TRAY CONTAINER UNIT : mm 11x29=319 NEC 7 8.20 296.8 315.0 322.6 8.20 Section A – A' 8.00 (5.62) 7.62 11.65 135°C MAX. 8.20 10.60 9.10 (6.04) 116.5 A' FBGA8×8ESP 9.70 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA8×8ESP Material Carbon PPE 121-pin PLASTIC FBGA (8×8)


    Original     		121-pin 165-pin 73-pin 169-pin 180-pin 181-pin 196-pin SSD-A-H7193-2 200ONTAINER JEDEC FBGA PDF

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard fBGA package tray 129-pin JEDEC TRAY DIMENSIONS FBGA FBGA FBGA tray JEDEC FBGA fBGA 80 package
    Contextual Info: TRAY CONTAINER UNIT : mm 10x26=260 9.30 12.80 9.30 11.80 295.0 10.00 315.0 322.6 SECTION A – A' 9.30 Applied Package (5.89) (5.62) 9.00 7.62 10.35 135°CMAX. 7 NEC 115.2 FBGA9×9ESP 135.9 PPE A' A Quantity (pcs) 73-pin Plastic FBGA (9×9) 80-pin Plastic FBGA (9×9)


    Original     		73-pin 80-pin 129-pin 141-pin SSD-A-H7113-2 JEDEC TRAY DIMENSIONS JEDEC tray standard fBGA package tray JEDEC TRAY DIMENSIONS FBGA FBGA FBGA tray JEDEC FBGA fBGA 80 package PDF

    fBGA package tray

    Contextual Info: TRAY CONTAINER NEC 119.6 7 FBGA8x6ESP 135°C MAX. A' 6.50 9.20 A 8.50 10.60 296.8 9.10 315.0 322.6 8.50 8.00 (5.62) (5.91) Section A – A' 7.62 8.15 135.9 PPE 14×29=406 UNIT : mm Applied Package 48-pin Plastic FBGA (8×6) Quantity (pcs) 406 MAX. Tray


    Original     		48-pin SSD-A-H7792 fBGA package tray PDF

    JEDEC tray standard 13

    Abstract: c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA
    Contextual Info: TRAY CONTAINER UNIT : mm 13 x 32=416 118.2 135° C MAX. NEC FBGA7 × 7ESP 7.35 8.85 9.85 A' 7.35 9.60 297.6 315.0 322.6 8.70 7.35 Section A – A' (5.62) (5.77) 7.00 7.62 135.9 PPE A Applied Package Quantity (pcs) 48-pin Plastic FBGA (7×7) 109-pin Tape FBGA (7×7)


    Original     		144-pin 109-pin 48-pin 129-pin SSD-A-H7655-2 JEDEC tray standard 13 c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA PDF

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12
    Contextual Info: TRAY CONTAINER NEC 119.6 8.80 6.50 299.2 315.0 322.6 7.90 6.50 6.00 (5.62) (6.16) Section A – A' 7.62 6.50 135° CMAX. FBGA6 x 6C A' A 8.15 9.20 135.9 PPE 14 × 35=490 UNIT : mm Applied Package Quantity (pcs) 64-pin Plastic FBGA (6×6) 65-pin Plastic FBGA (6×6)


    Original     		65-pin 490MAX. 64-pin 85-pin 97-pin SSD-A-H7469-3 JEDEC tray standard JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12 PDF

    JEDEC tray standard 490

    Abstract: FLGA
    Contextual Info: TRAY CONTAINER 135°C MAX. NEC 119.6 A' 5.30 9.20 FBGA 5x5ESP A 5.30 8.80 299.2 7.90 315.0 322.6 Section A – A' 5.30 (5.62) (5.79) 5.00 7.62 8.15 135.9 PPE 14×35=490 UNIT : mm Applied Package Quantity (pcs) 49-pin Plastic FLGA (5×5) 52-pin Plastic FLGA (5×5)


    Original     		64-pin 49-pin 52-pin SSD-A-H7179-2 JEDEC tray standard 490 FLGA PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    12B-0608-F19

    Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
    Contextual Info: ‹ Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X


    Original     		0X45M 3466b 26022i 12B-0608-F19 DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A PDF

    K8D3216UBC-pi07

    Abstract: K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm
    Contextual Info: Product Selection Guide Memory and Storage April 2005 MEMORY AND STORAGE SECTION A DRAM DDR2 SDRAM DDR SDRAM SDRAM RDRAM NETWORK DRAM MOBILE SDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND, OneNAND, NOR FLASH NAND FLASH ORDERING INFORMATION SRAM


    Original     		BR-05-ALL-002 K8D3216UBC-pi07 K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm PDF

    SPANSION date code format

    Abstract: spansion solder profile FBGA tray fBGA package tray 12 x 19 TRACE CODE ON BOX PACKING LABEL
    Contextual Info: ‹ Chapter 1 Codes and Carrier Options CHAPTER 1 CODES AND CARRIER OPTIONS Product Carrier Options Package Codes Product Date Codes Packages and Packing Methodologies Handbook 17 Oct 2008 1-1 ‹ Chapter 1 Codes and Carrier Options PRODUCT CARRIER OPTIONS Several packing systems, including product carrier and packing container options, are available for Spansion memory products. The following table lists those systems that are used as a standard, as well as other


    Original     		PDF

    circuit diagram of bluetooth headphone

    Abstract: IC Speakerphone philips stereo amplifier 384 CS42L73 JEDEC JESD51-8 JESD51-9 CS42L73-CRZR dac 3440 CS42L73-CWZ
    Contextual Info: CS42L73 Ultra Low Power Mobile Audio and Telephony CODEC Product Overview For the full datasheet, visit System Features  Native no PLL required Support for 6/12/24 www.cirrus.com/codec-datasheets/CS42L73  Stereo ADC  Dual Analog or Digital MIC Support


    Original     		CS42L73 com/codec-datasheets/CS42L73 circuit diagram of bluetooth headphone IC Speakerphone philips stereo amplifier 384 CS42L73 JEDEC JESD51-8 JESD51-9 CS42L73-CRZR dac 3440 CS42L73-CWZ PDF

    K9F2G08U0B-PCB0

    Abstract: samsung K9 flash Toggle DDR NAND flash K9F2G08U0B-PIB0 K9F2G08U0B samsung 128G nand flash movinand DECODER Samsung EOL K9F2G08U0B-PIB00 samsung toggle mode NAND
    Contextual Info: SAMSUNG's Digital World go contents Flash ● ● ● ● ● NAND Flash ❍ Products ❍ EOL Products Toggle DDR NAND Flash ❍ Products Flash SSD NOR Flash ❍ Products ❍ EOL Products Flash Cards ❍ Products ❍ EOL Products Product Search ● ● ●


    Original     		K9F2G08U0B 07-Sep-2010 K9F2G08U0B-PCB0 samsung K9 flash Toggle DDR NAND flash K9F2G08U0B-PIB0 samsung 128G nand flash movinand DECODER Samsung EOL K9F2G08U0B-PIB00 samsung toggle mode NAND PDF

    tray bga

    Abstract: BGA22 JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320
    Contextual Info: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22x22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 322.6 Section A – A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5×12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22×22 ESP 320-pin Plastic BGA (22×22)


    Original     		BGA22 22ESP 320-pin 345-pin 385-pin 389-pin 429-pin SSD-A-H6973-4 tray bga JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320 PDF

    MR0A08BC

    Abstract: MR0A08BCYS35
    Contextual Info: MR0A08B FEATURES 128K x 8 MRAM • 3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Native non-volatility • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • Commercial and industrial temperatures


    Original     		MR0A08B 20-years MR0A08B 576-bit EST183 MR0A08BC MR0A08BCYS35 PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    samsung K9 flash

    Abstract: Samsung EOL 168FBGA samsung nor flash samsung s6 K4X1G163PC-FGC3 k4 MARKING CODE samsung K4 samsung cdram
    Contextual Info: SAMSUNG's Digital World go contents DRAM ● ● ● ● Computing ❍ DDR3 Products ❍ DDR2 Products ❍ DDR Products ❍ SDRAM Products ❍ System Compatibility ❍ EOL Products Consumer ❍ Products Mobile ❍ Products ❍ EOL Products Graphic & Gaming


    Original     		800MHz-40ns i850E K4X1G163PC 07-Sep-2010 D18ns TRP18ns TRCD18ns samsung K9 flash Samsung EOL 168FBGA samsung nor flash samsung s6 K4X1G163PC-FGC3 k4 MARKING CODE samsung K4 samsung cdram PDF

    TSG 3255

    Abstract: ALLOY leadframe C7025 leadframe C7025 tsg 271 C7025 certificate c7025
    Contextual Info: ‹ Index INDEX A alloy 42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10 B boxes intermediate see Q-PACK boxes outer (see outer container boxes) tubes, protection from . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2


    Original     		PDF

    s29cd016j0

    Abstract: S29CD016J AM29BDD160G S29CD016G S29CD016J0PFF
    Contextual Info: Migrating to S29CD016J - Ordering Information Application Note Overview This document outlines the differences in the ordering part numbers OPNs between the AM29BDD160G, S29CD016G and the S29CD016J. It is intended for users that are migrating from either the AM29BDD160G or the


    Original     		S29CD016J AM29BDD160G, S29CD016G S29CD016J. AM29BDD160G S29CD016J s29cd016j0 S29CD016J0PFF PDF

    AMD AM28F010 ca

    Abstract: AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002
    Contextual Info: Flash Memory Quick Reference Guide Summer ’98 Package Migration Low-Voltage Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B 2 Mb 4 Mb 8 Mb 16 Mb Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B Am29LV104B 1 Mb 2 Mb 4 Mb Am29LV200 Am29DL400B Am29LV400


    Original     		Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B AMD AM28F010 ca AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002 PDF