FBGA 896 Search Results

ep2c20

Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Contextual Info: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

EQFP 144 PACKAGE

Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16
Contextual Info: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00

DDR3 pcb layout raw card b so-dimm

Abstract: EBJ81UG8EFU0-GN-F E1922E DDR3 pcb layout raw card f so-dimm EDJ4216EFBG ELPIDA DDR3L
Contextual Info: COVER PRELIMINARY DATA SHEET 8GB DDR3L SDRAM SO-DIMM EBJ81UG8EFU0 1024M words  64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization — 1024M words  64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3L SDRAM sealed in FBGA

Contextual Info: Data Sheet Rev.1.0 25.02.2011 4096MB DDR3 – SDRAM DIMM 240 Pin UDIMM Features: SGU04G64B1BD2MT-xxR • 4GByte in FBGA Technology •      RoHS compliant Options:    Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 Marking

PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array

Contextual Info: COVER PRELIMINARY DATA SHEET 8GB DDR3L SDRAM SO-DIMM EBJ81UG8EFU0 1024M words  64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization — 1024M words  64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3L SDRAM sealed in FBGA

Contextual Info: Data Sheet Rev.1.0 25.02.2011 4096MB DDR3 – SDRAM DIMM 240 Pin UDIMM Features: SGU04G64B1BD2MT-xxR • 4GByte in FBGA Technology •      RoHS compliant Options:    Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 Marking

Contextual Info: Data Sheet Rev.1.2 26.04.2011 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64E1BG2MT-xxRT • 2GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9  module density

Contextual Info: Data Sheet Rev.1.0 31.07.2012 4096MB DDR3 – SDRAM SO-DIMM Features: 204 Pin SO-DIMM • SGN04G64E1BK2MT-xxRT •      4GByte in FBGA Technology RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11  Module Density

Contextual Info: Data Sheet Rev.1.2 11.11.2010 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2MT-CCRT • 4GB PC3-10600 in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7  Module Density

Contextual Info: Data Sheet Rev.1.0 31.07.2012 4096MB DDR3 – SDRAM SO-DIMM Features: 204 Pin SO-DIMM • SGN04G64E1BK2MT-xxRT •      4GByte in FBGA Technology RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11  Module Density

Contextual Info: Data Sheet Rev.1.2 11.11.2010 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2MT-CCRT • 4GB PC3-10600 in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7  Module Density

Contextual Info: Data Sheet Rev.1.1 16.09.2011 4GB DDR2 – SDRAM SO-DIMM Features: • 200 Pin SO-DIMM SEN04G64D2BJ2WI-xx W R •    4GByte in FBGA Technology RoHS compliant Options: Data Rate / Latency DDR2 533 MT/s CL4 DDR2 667 MT/s CL5 Marking -37 -30  Module Density

Contextual Info: COVER DATA SHEET 8GB DDR3L SDRAM SO-DIMM EBJ81UG8EFU0 1024M words  64 bits, 2 Ranks Specifications Features • Density: 8GB • Organization — 1024M words  64 bits, 2 ranks • Mounting 16 pieces of 4G bits DDR3L SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual in-line

896-pin

Abstract: FBGA 896 AA13 E20 L27 AF29 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1
Contextual Info: IGLOOe Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at

FBGA 896

Abstract: AA13 896-Pin AJ26 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Contextual Info: IGLOO e Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at

bd248

Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

A3PE1500

Abstract: A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Contextual Info: ProASIC3E Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .

CYCLONE 3 ep3c25f324* FPGA

Abstract: FBGA-484 datasheet EP3C16F484I7N EPM570T144I5 EP3C10E144I7N EP3C25F324I7N EPM1270F256I5 EPM1270T144I5 EP2C5Q208I8N EP3C120F780I7N
Contextual Info: Technical Brief Extended Temperature Support for Cyclone II, Cyclone III, and MAX II Devices Introduction Semiconductor devices undergo at least two types of testing: device characterization and production testing. Device characterization is used to verify the performance of a semiconductor design and its physical implementation.