EPOXY THINNER Search Results
EPOXY THINNER Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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TC-2707
Abstract: DP190 5589H Outgassing
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TC-2707 TC-2707 DP-460 225-3S-06 DP190 5589H Outgassing | |
DP460
Abstract: D1876 epoxy thinner Outgassing 5589H Outgass DP-460 ADHESIVE GAP PAD TC2810+37ML
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TC-2810 TC-2810 DP-460 225-3S-06 DP460 D1876 epoxy thinner Outgassing 5589H Outgass ADHESIVE GAP PAD TC2810+37ML | |
10P8-11
Abstract: alodine 1200 MIL-PRF-23377 EC-286 CMFS035 msds paint BS22455 akzonobel painting curing PS84
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10P8-11 MIL-PRF-23377, EC-286 TR-115 CMFS035 BS22455 MIL-PRF-23377 alodine 1200 EC-286 CMFS035 msds paint BS22455 akzonobel painting curing PS84 | |
mjg-2
Abstract: EPY-500 vishay m-line rosin solvent strain gage M-prep neutralizer mjg 2 Strain Gage adhesive paper GT-14 unbonded strain gage degreaser
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B-172 EPY-500 27-Jan-05 mjg-2 vishay m-line rosin solvent strain gage M-prep neutralizer mjg 2 Strain Gage adhesive paper GT-14 unbonded strain gage degreaser | |
Contextual Info: Metallized Polycarbonate Capacitor MPC MPC are non-inductively wound with metallized Polycarbonate dielectric/electrode with copper-clad steel leads and epoxy resin coating. They are suitable for applications at high frequencies requiring long term stability. Its thinner body is ideal for critical spacing requirements. |
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14P10
Abstract: MPC CAPACITOR
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100VDC, 250VDC, 400VDC 14P10 MPC CAPACITOR | |
LEAD FRAME SURFACE MOUNT
Abstract: 100PPM epoxy thinner NTC-T
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100PPM LEAD FRAME SURFACE MOUNT epoxy thinner NTC-T | |
h25b
Abstract: MKA Series MFZ Series
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90B50B0 40sec 30sec 50sec 60sec 50smmended E1001A h25b MKA Series MFZ Series | |
Contextual Info: RECOMMENDED REFLOW CONDITION CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXA/PXseries onto a glass epoxy circuit board of 90B50B0.8mm |
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90B50B0 40sec 30sec) 30sec 60sec 50sec) E1001C | |
Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXC/PXA series onto a glass epoxy circuit board of 90B50B0.8mm |
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90B50B0 40sec 30sec) 30mmended E1001D | |
thermal camera
Abstract: IPC-4101 Sn60Pb40 solder Sn60Pb40 JESD22-B102D J-STD-002B 106G 208H 210F Res 2512
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CFA2512E50R0JS Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0JS-T10) thermal camera IPC-4101 Sn60Pb40 solder JESD22-B102D J-STD-002B 106G 208H 210F Res 2512 | |
JESD22-B102-DContextual Info: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features: |
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CPA1206* Sn100, 25ppm/ Sn60Pb40 CR1206 MIL-STD-1285D) CPA1206E39R0FS-T10) JESD22-B102-D | |
IPC-4101Contextual Info: Product Family: RF Chip Power Resistor Part Number Series: CFA1206E50R0FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features: |
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CFA1206E50R0FS Sn100, 25ppm/ Sn60Pb40 CR1206 MIL-STD-1285D) CFA1206E50R0FS-T10) IPC-4101 | |
IPC-4101
Abstract: 39R0 106G 208H 210F JESD22-B102D J-STD-002B IPC4101
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CPA1206* Sn100, 25ppm/ Sn60Pb40 effecti00 MIL-STD-1285D) CPA1206E39R0FS-T10) IPC-4101 39R0 106G 208H 210F JESD22-B102D J-STD-002B IPC4101 | |
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Contextual Info: Product Family: 7 Watt RF Chip Power Resistor Part Number Series: CFA1206 Series Construction: Features: • • • • • • High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Pre-tinned Sn100, matte terminations |
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CFA1206 Sn100, | |
sprague VITAMINContextual Info: INTRODUCTION DEARBORN INTRODUCTION TO DEARBORN FILM CAPACITORS Capacitor housings include drawn and fabricated metal shells in standard, rectangular, and special shapes, glass and ceramic tubes, plastic-film tubes and plastic-film wraps with epoxy and resin end fills. Special mounting |
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Contextual Info: Standard Product Reference Sheet FKA1112H-TR Features Package 2125(t=0.8mm)type, Milky white epoxy Product features ・Outer dimension 2.0 x 1.25 x 0.8mm L x W x H ・Lead-free soldering compatible ・RoHS compliant Recommended Applications |
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FKA1112H-TR | |
Contextual Info: Standard Product Specifications TAN1111R-TR Features Package 3216 Reverse Mount type, Water clear epoxy Lens Out Dimension 3.2 x 1.6 x 1.1mm L x W x H Product features ・Infra-Red emitting LED ・Lead–free soldering compatible ・RoHS compliant Recommended Applications |
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TAN1111R-TR | |
sprague capacitor
Abstract: sprague VITAMIN
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120Hz) sprague capacitor sprague VITAMIN | |
Contextual Info: Standard Product Reference Sheet FKR1112H-TR Features Package 2125(t=0.8mm)type, Milky white epoxy Product features ・Outer dimension 2.0 x 1.25 x 0.8mm L x W x H ・Lead-free soldering compatible ・RoHS compliant Recommended Applications |
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FKR1112H-TR | |
Contextual Info: Standard Product Reference Sheet FKY1112H-TR Features Package 2125(t=0.8mm)type, Milky white epoxy Product features ・Outer dimension 2.0 x 1.25 x 0.8mm L x W x H ・Lead-free soldering compatible ・RoHS compliant Recommended Applications |
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FKY1112H-TR | |
DSA0090625.txtContextual Info: 5.0 mm DIA LED LAMP 599R2GYW-CC REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange |
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599R2GYW-CC DS-35-07-0235 HD-R/RD013 DSA0090625.txt | |
k2950
Abstract: IR 16713
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540R2GY-CC DS-35-07-0235 HD-R/RD013 k2950 IR 16713 | |
Contextual Info: CP02M581.01 Rev D – Page 1 of 3 Product Family: Chip Power Resistor Part Number Series: CPA2512*####FS Construction: • High Purity Alumina ceramic Nickel alloy thin-film resistive element Epoxy-resin overcoat Pre-tinned Sn100, matte terminations over |
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CP02M581 CPA2512* Sn100, 25ppm/Â Sn60Pb40 CPA2512E27R0FS-T10) |