EIAJ-RRM 08 B Search Results

ESAC63-004

Abstract: A478
Contextual Info: ESAC63-004 2 oa : O utline Drawings >a - y h * - '< V 7 m — F SCHOTTKY BARRIER DIODE 03.6 *o ? 4.5 ’Ü I .32 5 08 : Features •1 & V F Low Vp JEDEC T0-220AB EIAJ SC-46 • T.'tvT's'fae-K^nti-asi' Super high speed switching. m m & m Connection Diagram

ET-7200B

Contextual Info: Chip Attenuators  type RCN02 Features 1) Compare with single type 2) Guarantee the attenuation (0.3db, 0.5db) 3) Mounting area 50% less 4) Big reduction for mounting cost (3 times  Once) ISO9001- / ISO/TS 16949-approved Rating Item Rated power

Contextual Info: ESAC63-004 2 oa : O utline D raw ings >a - y h * - ' < V 7 m — F SCHOTTKY BARRIER DIODE 03.6 *o ? 4.5 ’Ü I .32 5 08 : Features JEDEC T0-220AB Low Vp EIAJ SC-46 T.'tvT's'f a e - K ^ n t i - a s i ' Super high speed switching. m m &m •1 & V F • Connection Diagram

d400 e

Abstract: power Diode 800V 5A
Contextual Info: ERC20 5A ( 200V to 800V / 5A ) FAST RECOVERY DIODE Outline drawings, mm 4.5±0.2 Ø3.6+0.2 -0.1 1.32 1 15.0±0.2 6.4 2.7 10.0+0.5 -0 3.7 2 14.0+0-0.5 1.2 0.8±0.2 5.08 0.4+0.2 -0 2.7 Features High voltage by mesa design High reliability JEDEC TO-220AB EIAJ

Contextual Info: Compact Chip Resistor Networks MNR02 1005  2 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 1616 (MNR12), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than two 1005 chips (MCR01). Also, the cost of mounting has been reduced.

Contextual Info: Compact Chip Resistor Networks MNR04 1005  4 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 3216 (MNR14), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than four 1005 chips (MCR01), and mounting costs are lower.

MAX-50M

Contextual Info: Compact Chip Resistor Networks MNR02 1005  2 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 1616 (MNR12), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than two 1005 chips (MCR01). Also, the cost of mounting has been reduced.

sc802

Contextual Info: I' SC802-06 i < ' 7 Ÿ 4 *-\r • W i» : Outline Drawings S C H O T T K Y B A R R IE R D IO D E * iS a Ü 135la* Z HW. => (as J~Ï35* 135’ m J 12" 5.1-OJ : Features JEDEC Surface mount device EIAJ • <ftVF Low V F : Marking Super high speed switching.

JIS B 0401 tolerance

Abstract: JIS B 0401 mnr14
Contextual Info: Compact Chip Resistor Networks MNR04 1005  4 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 3216 (MNR14), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than four 1005 chips (MCR01), and mounting costs are lower.

mnr14

Abstract: Rohm MNR14
Contextual Info: Compact Chip Resistor Networks MNR14 06034 size Features 1) Convex electrodes Easy to check the fillet after soldering is finished. 2) Small, light, rectangular 4-chip network Area ratio is 65% smaller than that of MNR34, while weight ratio has been cut 75%.

Contextual Info: Compact 8-element Chip Resistor Networks MNR15 06035 size Features 1) Suitable for pull-up and pull-down resistors. 2) No direction to be mounted by placing common electrode with symmetry. 3) Convex electrodes Easy to check the fillet after soldering is finished.

Contextual Info: Compact 8-element Chip Resistor Networks MNR15 06035 size Features 1) Suitable for pull-up and pull-down resistors. 2) No direction to be mounted by placing common electrode with symmetry. 3) Convex electrodes Easy to check the fillet after soldering is finished.

ESAC82-004

Abstract: T151 T930 P8-10
Contextual Info: ESAC82-004< ioa *>3 ' y h+— K SCHOTTKY BARRIER E • : Outline Drawings *3 6 • o-i Features • 1£Vf JEDEC TO-22QAB EIAJ SC-46 Low V f Super high speed sw itch in g . • TV— iWC ttftrC iS Jiif !Si£ Connection Diagram High reliability by planer design.

181T2

Abstract: 103 chip resistor Rohm chip network resistor
Contextual Info: Compact Chip Resistor Networks MNR12 06032 size Features 1) Convex electrodes Easy to check the fillet after soldering is finished. 2) Small, light, rectangular 2-chip network Area ratio is 65% smaller than that of MNR32, while weight ratio has been cut 75%.

ROHM resistor 03015

Abstract: mnr14
Contextual Info: MNR32J0ABJ Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.

mnr14

Contextual Info: MNR35J5RJ Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.

ROHM resistor 03015

Abstract: ROHM 03015 mnr14
Contextual Info: MNR34J5ABJ Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.

Contextual Info: Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering. 4) ROHM resistors have obtained ISO9001 / ISO / TS16949 certification.

Contextual Info: Chip Resistor Networks MNR Series Datasheet Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering. 4) ROHM resistors have obtained ISO9001 / ISO / TS16949 certification.

tlp508

Abstract: JIS-C-5020 JIS C7021 B10 TLP645 JIS-C-5003 JISC5700 TLP573 TLP546G SCR 7704
Contextual Info: 9. Reliability 9.1 General In recent years, as the application fields for photo couplers expand, more discussions are being made on reliability. For reliability improvement, it is insufficient to perform strinct process management and to have reliability tests such as life test and environmental tests. It is necessary to

BAV23S l31

Abstract: diode 1407
Contextual Info: DISCRETE SEMICONDUCTORS BAV23S General purpose double diode Product specification Supersedes data of 1998 Jan 08 Philips Semiconductors 1999 May 05 PHILIPS PHILIPS Philips Semiconductors Product specification General purpose double diode BAV23S FEATURES DESCRIPTION

Contextual Info: MNR14ERAPJ Chip Resistor Networks MNR Series < General Purpose > Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.

mnr14

Contextual Info: MNR12E0APJ Chip Resistor Networks MNR Series < Automotive > Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.

MNR18ERAPJ

Abstract: mnr14
Contextual Info: MNR18ERAPJ Chip Resistor Networks MNR Series < General Purpose > Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.