EF957 Search Results
EF957 Price and Stock
TE Connectivity EF9574-000Banding Backshell |
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EF9574-000 |
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EF9574-000 |
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EF9574-000 |
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TE Connectivity EF9576-000Circular MIL Spec Backshells BNX40SC90-1208AX-CS9062 |
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EF9576-000 |
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TE Connectivity EF9573-000Circular MIL Spec Backshells BNX40AB90-1208AX-CS9062 |
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EF9573-000 |
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AMD Xilinx XQ2V6000-5EF957IField Programmable Gate Array, 8448 CLBs, 6000000 Gates, 650MHz, 76032-Cell, CMOS |
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XQ2V6000-5EF957I | 3,622 |
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EF957 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
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ug112ug072ug075xapp427+10 | |
xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
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ug112ug072ug075xapp427+10 | |
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Contextual Info: 123456777 123245663 123456789ABC DEF289BCBA 992424EF93953622F3675E727 !7"92#75F$9#%& '5E!239 F3E4429 9*9+AA92#75F$9*923#E7, - ) 2#E58957F23.6EF5673"2#E22#75F$B 29*942%89B"2#E22#75F$B 2 |
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Contextual Info: — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — 187 QPro Virtex-II 1.5V Platform FPGAs DS122 v3.0 April 7, 2014 Product Specification Summary of QPro Virtex™-II Features • High-performance clock management circuitry • Industry’s first military-grade platform FPGA solution |
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ds122mil-prf-38535 | |
XQ2V1000-4FG456
Abstract: XQ2V1000-4FG456N AF271 transistor xq2v30004cg717m CG717 AE193 matrix m21 XC2V1000-FG456 BG728 XQ2V3000
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ds122mil-prf-38535xq2v1000-4fg456xq2v1000-4fg456n+8 | |
ULVDS25
Abstract: QPro Virtex-II EF957 IO-L93N
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ds122mil-prf-38535bg575xq2v6000-5ef957i+8 | |
BFG95Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL |
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