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    EF957 Search Results

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    TE Connectivity EF9574-000

    Banding Backshell
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    Onlinecomponents.com EF9574-000
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    Master Electronics EF9574-000
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    • 100 $116.79
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    TE Connectivity EF9576-000

    Circular MIL Spec Backshells BNX40SC90-1208AX-CS9062
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    TE Connectivity EF9573-000

    Circular MIL Spec Backshells BNX40AB90-1208AX-CS9062
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    AMD Xilinx XQ2V6000-5EF957I

    Field Programmable Gate Array, 8448 CLBs, 6000000 Gates, 650MHz, 76032-Cell, CMOS
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    Vyrian XQ2V6000-5EF957I 3,622
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    EF957 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    ug112ug072ug075xapp427+10qfn 3x3 tray dimensionxcdaisybfg95xc5vlx330t-1ff1738ipcb footprint fs48, and fsg48ws609jedec so8 wire bond gapxc3s400an-4fg400iffg676xc4vlx25 cmos 668 fcbga PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    ug112ug072ug075xapp427+10xilinx topside markingxilinx part markingpcb footprint fs48, and fsg48smd code v36cf1752reballingrecommended layout csg324bga reflow guidexc2vp7 reflow profilesmd marking code c1g PDF

    Contextual Info: 123456777 123245663 123456789ABC DEF289BCBA 992424EF93953622F3675E727 !7"92#75F$9#%& '5E!239 F3E4429 9*9+AA92#75F$9*923#E7, - ) 2#E58957F23.6EF5673"2#E22#75F$B 29*942%89B"2#E22#75F$B 2


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    123456789abcdef289f3675f3e4429+6e189/08957f23ef5673189a2bbb123456777768949abc52bd6e4f PDF

    Contextual Info: — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — 187 QPro Virtex-II 1.5V Platform FPGAs DS122 v3.0 April 7, 2014 Product Specification Summary of QPro Virtex™-II Features • High-performance clock management circuitry • Industry’s first military-grade platform FPGA solution


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    ds122mil-prf-38535 PDF

    XQ2V1000-4FG456

    Abstract: XQ2V1000-4FG456N AF271 transistor xq2v30004cg717m CG717 AE193 matrix m21 XC2V1000-FG456 BG728 XQ2V3000
    Contextual Info: R DS122 v2.0 December 21, 2007 QPro Virtex-II 1.5V Platform FPGAs Product Specification Summary of QPro Virtex™-II Features • • Industry’s first military-grade platform FPGA solution • Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)


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    ds122mil-prf-38535xq2v1000-4fg456xq2v1000-4fg456n+8af271 transistorxq2v30004cg717mcg717ae193matrix m21xc2v1000-fg456bg728xq2v3000 PDF

    ULVDS25

    Abstract: QPro Virtex-II EF957 IO-L93N
    Contextual Info: R DS122 v2.0 December 12, 2007 QPro Virtex-II 1.5V Platform FPGAs Product Specification Summary of QPro Virtex™-II Features • • Industry’s first military-grade platform FPGA solution • Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)


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    ds122mil-prf-38535bg575xq2v6000-5ef957i+8xq2v6000-4ef1152ixq2v6000-5ef1152icg717cf1144ulvds25qpro virtex-iief957io-l93n PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


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    ug112ug072ug075xapp427+1bfg95 PDF