EC042 Search Results

infrared receiving CIRCUIT

Contextual Info: i \ ,> i I PRF.PARED BYi H V jL . x DATE SHARP 'K O iW U U lt^ APPROVED B Y i EC0424 s p e c No. a « FEB. 19B2 DATE ELECTRONIC -COMPONENTS CROUP 2 8 FEB. 1BU2 FIL E N f. is s u e 26 FEB. 1992 PACE REPRESENTATIVE DIVISION SHARP CORPORATION ~foJ?n< /t1. □ IC DIV.

RY5BD01

Abstract: C3-10PF TA425 l-08m
Contextual Info: PREPARED BYI \ I , JXA APPROVED BY I DATE SPEC No. 2 a FED. 1 9 9 2 SHARP ¿ l. DATE ELECTRONIC COMPONENTS CROUP 0. 7óè*A 2 8 FEB. 1 9 9 2 EC04215 R L E No. ISSUE 26 FEB. 1992 PACE REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION O IC DIV. □ SEMICONDUCTOR APPLICATION

Contextual Info: PREPARED BY I f\ DATE SH ARP f t U FEB. 1B92 1 APPROVED BY I / -T * / U • SPEC No. , DATE / ELECTRONIC COMPONENTS CROUP 2 0 FED. 1 9 9 2 EC04213 FILE No. ISSUE 26 FEB. 1992 PACE REPRESENTATIVE DIVISION SHARP CORPORATION S P E C IF IC A T IO N □ □ □

SOC500

Abstract: distance measurement infrared RYSAR01 RY5AR01 RY5AT01 infrared receiving CIRCUIT infrared signal waveform AAY 53
Contextual Info: PREPARED BY t \ ^ DATE /, /« o - K b M '.n v iit APIMIOVED BY I SPEC No. iau 2 SH ARP . DATE ELECTRONIC COMPONENTS CROUP 2 0 FRO. 19U2 IS SU E 26 FEB. 1992 PACE REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION f EC04213 FILE No. □ □ a 8 IC DIV.

TA425

Contextual Info: \ ,> i i I PRF.PARED BYi Ü . VjL x SHARP DATE a « FEB . 1 9 B 2 'K O iW U U lt^ APPRO VED B Y i DATE ELECTRONIC -COMPONENTS CROUP 2 8 FEB . 1BU2 ~ foJ?n< /t1. sp ec EC0424 N o. F IL E N f. is s u e 26 FEB. 1992 PACE RE PR E SEN T A TIV E DIVISION SH A R P CORPORATION

Contextual Info: 21, 27 2, 54 3, 68 8, 89 Material: S h i e l d i n g : brass p l a t i n g n i c k e l a l l o y Insert: T h e r mopl as t i c , UL- 9 4 - VO, bl ack Cont act : -Phosphor Bronze, s e l e c t i v e gol d p l a t i n g 15u" over n i c k e l in cont ac t area

harting F-95972 Paris

Contextual Info: Alle Rechte vorbehalten/ Jill tights reset ted 5 4 2 3 1 Material: Housing and insert material: High Temperature BK UL94V-0 Shield material: Brass C2680 H. Plating Nickel Contact material: Phosphor Bronze t=0.35mm Plating contact: gold plating over nickel

Contextual Info: Alle Rechte vorbehalten/ Jill tights reset ted 3 Mating face according to IEC 603-7 T 1R.75 max i PART NUMBER DATA CODE Material: Housing and insert material: High Temperature BK UL94V-0 Shield material: Brass C2680 H. Plating Nickel Contact material: Phosphor Bronze t=0.35mm

Contextual Info: Recommended configuration of plated through holes for press-in termination DIN signal female connector NFF In addition to the hot-air-level HAL , other PCB surfaces are getting more important. Due to their different properties - such as mechanical strength

OKI C1210

Abstract: ICS9LPR309 ICS9LPR309AKLF AT-45DB011B Wistron Corporation SCD01U16V2KX-3GP EC055 smt parts list SCD1U10V2KX-5GP yonah calistoga ICH7-M UltraBay
Contextual Info: 10 9 8 July 26 '06 7 Intel Yonah NV/LV/ULV Processor 3,4,5 Clock Generator CK-410M 19 H Keyboard Light AGTL+ FSB Thermal Sensor LM26 CRT I/F Bus Switch IC 36 Cardbus + IEEE1394 ATA 66/100 Intel ICH7-M Serial ATA I/F Port 0 SATA CONN L5:Signal 2 L6:GND 27 CRT Port