E-LINE PACKAGE DIMENSIONS Search Results

DRAM 44

Abstract: TSOP 54 II
Contextual Info: PACKAGE DIMENSIONS CMOS DRAM PLASTIC DUAL IN-LINE PACKAGE 18 D IP 300 mil U nit : In c h e s m illim e te rs ( 2 0 D IP 300 mil U n it : In ch e s (m illim e te rs ) r r lu ~o ~ 531 ELECTRONICS PACKAGE DIMENSIONS CMOS DRAM PLASTIC ZIGZAG IN-LINE PACKAGE

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP ØP Z5.067 (JEDEC TS-001AA ISSUE A) 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE A E A1 INCHES Q H1 D TERM. 6 45o E1 D1 M L c 60o 1 2 3 4 5 e J1 b e1 NOTES: 1. These dimensions are within allowable dimensions of Issue A of

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP Z3.05 (JEDEC STYLE TO-92 MODIFIED) L 3 LEAD PLASTIC SINGLE-IN-LINE PACKAGE e1 e W INCHES SYMBOL D E-PIN Ø 0.0625 R A b E S1 α (2X) MILLIMETERS MAX MIN MAX NOTES A 0.170 0.195 4.32 4.95 1 b 0.014 0.020

C2073 equivalent

Abstract: transistor c2073 c2073 transistor C2073 st c830 c835 transistor C2073 power circuit c833 C834 transistor transistor c830
Contextual Info: flfi"^F| BfilDlEÛ GENL INSTR-. O P T O E L E K □ D Q 2 C173 MCT26 FEATURES AND APPLICATIONS PACKAGE DIMENSIONS 1S1 1S1 tSi AG line/digital logic isolator Digital logic/digital logic isolator Telephone/telegraph line receiver Tw isted pair line receiver

MO-169AC

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP -A- A Z7.05B 0.006 -B- (0.15) E 7 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT “GULLWING” LEAD FORM C2 INCHES L2 HEATSLUG PLANE D -CL 0.00 - 0.0098 (0.00 - 0.25) L1 PIN #1 c 0o- 8o e b 0.010 (0.25) M B A M

MO-169AB

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP -A- A Z5.067A 0.006 -B- (0.15) E 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT “GULLWING” LEAD FORM C2 INCHES L2 HEATSLUG PLANE D -CL 0.00 - 0.0098 (0.00 - 0.25) L1 PIN #1 c 0o- 8o e b 0.010 (0.25) M B A M

B 503 0024

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP Z5.067B 0.006 (0.15) 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE STAGGERED VERTICAL LEAD FORM A INCHES D -BØP D1 F E2 HEADER BOTTOM E L1 E1 L -A- e B e3 e1 5 PLACES 0.010 (0.25) M e2 A B M ALL LEADS 0.024 (0.61) M

169aa

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP -A- A Z3.1D 0.006 -B- (0.15) E 3 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT “GULLWING” LEAD FORM C2 INCHES L2 HEATSLUG PLANE D -CL 0.00 - 0.0098 (0.00 - 0.25) L1 b1 PIN #1 c 0o- 8o e b 0.010 (0.25) M B A M

B 503 0024

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP Z7.05C 0.006 (0.15) 7 LEAD PLASTIC SINGLE-IN-LINE PACKAGE STAGGERED VERTICAL LEAD FORM A INCHES D -BØP D1 F E2 HEADER BOTTOM E L1 E1 L -A- e B e3 e1 7 PLACES 0.010 (0.25) M e2 A B M ALL LEADS 0.024 (0.61) M

Contextual Info: Plastic Package Single-In-Line Plastic Package SIP Z3.1C (JEDEC TO-220AB ISSUE J) A E ØP 3 LEAD PLASTIC SINGLE-IN-LINE PACKAGE A1 INCHES Q H1 TERM. 4 D 45 E1 o D1 L1 b1 L b c 60o 1 2 e 3 MIN MAX MIN MAX NOTES A 0.170 0.180 4.32 4.57 - A1 0.048 0.052 1.22

stoa

Contextual Info: Package information - E-Line Through hole, 3 pin package Package outline A E * Seating plane b b1 e e DIM Millimeters Inches Min. Max. Min. Max. A 2.16 2.41 0.085 0.095 b 0.41 0.495 0.016 0.0195 b1 0.41 0.495 0.016 0.0195 D 4.37 4.77 0.172 0.188 E 3.61 4.01

D 437

Contextual Info: Package information - E-Line reverse Through hole, 3 pin package Package outline A b b1 e e DIM Millimeters Inches Min. Max. Min. Max. A 2.16 2.41 0.085 0.095 b 0.41 0.495 0.016 0.0195 b1 0.41 0.495 0.016 0.0195 D 4.37 4.77 0.172 0.188 E 3.61 4.01 0.142

H11B

Abstract: H11B1 H11B2 H11B3 H11B1-H11B2 ST1734 switch H11B transistor c-133
Contextual Info: PHOTODARLINGTON OPTOCOUPLERS B m E u tm M c s H11B1 H11B2 H11B3 PACKAGE DIMENSIONS E&] DESCRIPTION Si [ft The H11B series consists of a gallium arsenide infrared emitting diode, coupled with a silicon photodariington transistor in a dual in-line package.

switch H11B

Abstract: optocouplers H11B1 ST1736 H11B2 H11B ST1723
Contextual Info: PHOTODARLINGTON OPTOCOUPLERS B m E u tm M c s H11B1 H11B2 H11B3 PACKAGE DIMENSIONS E&] DESCRIPTION Si [ft The H11B series consists of a gallium arsenide infrared emitting diode, coupled with a silicon photodariington transistor in a dual in-line package.

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388A U A y D U1 E L1 L b Z e c w M e1 e 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A b c D e e1 E L L1

to126

Abstract: 0195
Contextual Info: TO92 Package Dimensions Package Outline Dimensions D A Page E-Line TO92 Style 4-3 TO92 4-4 TO126 4-5 W e1 b e (2X)*° S1 E DIM R 4-4 Millimeters Inches Min Max Min Max A 4.32 4.95 0.170 0.195 b 0.36 0.51 0.014 0.020 E 3.30 3.94 0.130 0.155 e 2.41 2.67 0.095

Contextual Info: T1/E1/CEPT/ISDN-Pri TRANSFORMER MODULE E & E Magnetic Products Limited Quad Port, with TVS protection at line side, SOIC, Extended Temperature Range Four transmit transformers, four receive transformers SCHEMATICS and line side protection circuit in a single SMT package

lxt384le

Abstract: eltek m0524 ELEC ELTEK
Contextual Info: T1/E1/CEPT/ISDN-Pri TRANSFORMER MODULE E & E Magnetic Products Limited Quad Port, with TVS protection at line side, SOIC, Extended Temperature Range Four transmit transformers, four receive transformers and line side protection circuit in a single SMT package

Contextual Info: T1/E1/CEPT/ISDN-Pri TRANSFORMER MODULE E & E Magnetic Products Limited Quad Port, with TVS protection at line side, SOIC, Extended Temperature Range Four transmit transformers, four receive transformers SCHEMATICS and line side protection circuit in a single SMT package

te019

Abstract: eltek 821-M0864 ic of 4543 elec & eltek Elec Eltek QuadFALC eltek 821
Contextual Info: T1/E1/CEPT/ISDN-Pri TRANSFORMER MODULE E & E Magnetic Products Limited Quad Port, with TVS protection at line side, SOIC, Extended Temperature Range Four transmit transformers, four receive transformers and line side protection circuit in a single SMT package

26LS30

Abstract: 26LS33 equivalent 26LS32 26LS33 AM26LS29 RS-423 TTL AM26LS32
Contextual Info: Advanced Micro Devices Am26LS29 Quad Three-State Single Ended RS-423 Line Driver DISTINCTIVE CHARACTERISTICS • Four single ended line drivers in one package for maximum package density ■ Output short-circuit protection ■ Individual rise tim e control for each output

26ls29

Contextual Info: Advanced Micro Devices Am26LS29 Quad Three-State Single Ended RS-423 Line Driver DISTINCTIVE CHARACTERISTICS • Four single ended line drivers in one package for maxim um package density ■ Output short-circuit protection ■ Individual rise tim e control for each output

T7275C-EE

Abstract: 26LS31 26LS32 41LG T7275C-PE T7275C-PL T7275C-EL 26LS31 receiver
Contextual Info: m i c r o e l e c t r o n i c s group Data Sheet December 1991 Lucent Technologies Bell Labs Innovations T7275C Quad Differential Line Receiver Features Description • Four line receivers per package The T7275C Quad Differential Line Receiver integrated circuit is a quad differential input to

Diode B60

Contextual Info: ?'J y V V - K * - K Bridge Diode SQ I P B E # » ! ! Square In-line Package (Inpul/Output In-line Package) • fl-Ä N -äsH OUTLINE DIMENSIONS S10WBD 600V10A 45 £1 ■ Æ f é il RATINGS Absolute Maximum Ratings (fêSw&vvH-û- Tc=25‘C ) m s Item Storage Temperature