DUAL IN LINE PACKAGE Search Results

ceramic package

Abstract: CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ
Contextual Info: Ceramic Dual-in-Line Package Cerdip 8 Lead Ceramic Dual-in-Line Package NS Package Number J08A 2000 National Semiconductor Corporation MS101109 www.national.com Ceramic Dual-in-Line Package (Cerdip) August 1999 Ceramic Dual-in-Line Package (Cerdip) 14 Lead Ceramic Dual-in-Line Package

N22B

Abstract: mdip N14A N16A N16E N16G N18A N22A N24A NATIONAL SEMICONDUCTOR N16A
Contextual Info: Molded Dual-in-Line Package MDIP 8 Lead (0.300” Wide) Molded Dual-in-Line Package NS Package Number N08E 14 Lead (0.300” Wide) Molded Dual-in-Line Package NS Package Number N14A 2000 National Semiconductor Corporation MS101164 www.national.com Molded Dual-in-Line Package (MDIP)

PHILIPS OQ 0501

Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Contextual Info: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

SIP 400B

Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
Contextual Info: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)

D24K

Abstract: d28j D14D D24H D08C D16C D18A D20A D20B D24C
Contextual Info: Ceramic Sidebrazed Dual-in-Line Packages SB 8 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D08C 14 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D14D 2000 National Semiconductor Corporation MS101104 www.national.com

CD4093

Abstract: CD4093 applications cd4093 harris cd4093 Data SCHS115B
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package

CD4093

Abstract: CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package

cd4093

Abstract: CD4093B CD4093BE CD4093 CIRCUITS cd4093 Data CD4093 applications CD4093BE harris CD4093 Types cd4093 harris cd4093 application
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package

sot267

Contextual Info: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

CD4067 DATASHEET

Abstract: cd4067 CD4097 ALL CD4067
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic

CD4067BE

Abstract: cd4067 cd4067 harris CD4097be
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic

CD4093 applications

Abstract: CD4093 cd4093 harris CD4093 Types OF CD4093
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS115A – Revised November 1999 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form

CD40106B

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96

cd40106b

Abstract: CD40106BE CD-40106BE
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96

Contextual Info: Nomenclature Guide AD Types ADC0803LC PART NUMBER Converters AD, ADC 1 WM -T PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal Seal (SBDIP) H: TO-52 Can N: Dual-In-Line Plastic (PDIP) WM: Small Outline Plastic (SOIC)

PQL176

Abstract: CD3024 PD3024 PQB132 28-pin quad packages Thin Quad flat package PQT144 Ceramic Dual-In-Line Packages PQJ144 PQR100
Contextual Info: SECTION 4 PHYSICAL DIMENSIONS CD 020 20-Pin Ceramic Dual In Line Package .4-3 CD3024 24-Pin Slim Ceramic Dual In Line Package .4-4

jwd-107-1

Abstract: JWD-171-21 jwd.171.28 6 pin reed relay 12vdc JWD-107-5 jwd-171-10 JWD-171-27 JWD-171-14 jwd-172-7 JWS-117-18
Contextual Info: Catalog 1308242 Issued 3-03 P&B JWD/JWS series Dual In-Line Package & Single In-Line Package Dry Reed Relays Features • • • • • File E29244 JWD has dual in-line package DIP configuration. (14-pin DIP) JWS has single in-line package (SIP) configuration.

JWD-107-1

Abstract: JWD-107-5 JWD-171-21 JWD-172-4 JWS-117-5 JWD-107-3 JWD-171-10 JWD-171-25 JWD-171-5 JWS-117-18
Contextual Info: Catalog 1308242 Issued 3-03 P&B JWD/JWS series Dual In-Line Package & Single In-Line Package Dry Reed Relays Features • • • • • File E29244 JWD has dual in-line package DIP configuration. (14-pin DIP) JWS has single in-line package (SIP) configuration.

HN58C256 Series

Abstract: HN58V1001 hm514270a hm62256a HM628512 HN58C1001 Series DP-32 HN27C4096A HN62442 HM658512
Contextual Info: Package Information Contents Dual-in-line-Plastic Applicable Ics CERDIP Applicable Ics Zigzag-in-line Plastic Applicable Ics Flat Package Applicable Ics Chip Carrier Applicable Ics Package Information Dual-in-line Plastic Unit: mm • DP-18C 22.26 22.86 Max

ECL2530

Abstract: ECL2500 ECL2531 EJB 10
Contextual Info: TYPES ECL2530, ECL2531 DUAL LINE RECEIVER AND DUAL LINE DRIVER ECL INTEGRATED CIRCUITS tD -4 c < r - -a n in m w ECL2500 SERIES EMITTER-COUPLED-LOGIC ECL DUAL LINE RECEIVER AND DUAL LINE DRIVER FOR APPLICATION IN ULTRA-HIGH-SPEED D IG ITAL SYSTEMS -I m i p

DS87 amplifier

Abstract: opamps
Contextual Info: AT&T DATA SHEET LB1029BB/BC DUAL GENERAL-PURPOSE WIDEBAND OP-AMPS DESCRIPTION The LB1029BB and LB1029BC are dual general-purpose wideband op-amps. The LB1029BB is encapsulated in an 8-lead dual­ in-line plastic package and the LB1029BC is encapsulated in a 16-lead dual-in-line plastic package. These devices function as dual

oki cross

Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
Contextual Info: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)

Contextual Info: February 1993 Semiconductor DM54155/DM74155 Dual 2-Line to 4-Line Decoders/Demultiplexers General Description These TTL. circuits feature dual 1-line-to-4-line demultiplex­ ers with Individual strobes and common binary-address in­ puts in a single 16-pin package. When both sections are

54LS155DMQB

Abstract: 54LS155FMQB 54LS155LMQB DM54LS155J DM54LS155W DM74LS155M LS155 LS156
Contextual Info: 54LS155/DM54LS155/DM74LS155, 54LS156/DM54LS156/DM74LS156 Dual 2-Line to 4-Line Decoders/Demultiplexers General Description Features These TTL circuits feature dual 1-line-to-4-line demultiplex­ ers with individual strobes and common binary-address in­ puts in a single 16-pin package. When both sections are