DS561 Search Results

DIM400GCM33-A000

Contextual Info: DIM400GCM33-A000 DIM400GCM33-A000 IGBT Chopper Module DS5613-1.1 June 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES VCE sat *

DIM800NSM33-F000

Abstract: DIM800NSM33-F
Contextual Info: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-6 DS5615-7 September 2012 LN29760 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

Contextual Info: DIM400GCM33-A000 DIM400GCM33-A000 IGBT Chopper Module Replaces June 2003, version DS5613-1.1 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability DS5613-2.0 May 2004

DIM400GDM33-F000

Abstract: DIM400GDM33-F
Contextual Info: DIM400GDM33-F000 Dual Switch IGBT Module Replaces DS5616-2.1 DS5616-3 February 2014 LN31315 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

Contextual Info: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-6 DS5615-7 September 2012 LN29760 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

DIM800NSM33-F000

Abstract: chop ds5615
Contextual Info: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-5 DS5615-6 October 2011 LN28810 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

DS5611-1

Contextual Info: DIM200WHS12-H000 DIM200WHS12-H000 Fast Half Bridge IGBT Module Target Infomation DS5611-1.4 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate KEY PARAMETERS VCES

IEEE1394B

Abstract: RCLED 2600C S100 S200 ZL60003
Contextual Info: ZL60003 Plastic Optical Fiber Communications 125 to 250Mbps Data Sheet DS5612 Issue 1 June 2002 Ordering Information ZL60003/TBD TO-46 Package -20 to +700C Description This unique Resonant Cavity Surface-Emitting LED RCLED is designed for optical communications over

DS 561

Abstract: s562 DS561 PHP250
Contextual Info: SENSITRON SEMICONDUCTOR Sensitron Part 2000 CATALOG TVS SELECTOR GUIDE/CROSS REFERENCE LIST Kquivalent Industry Part Nu m be r Stand-Off Voltage 1 1 Ì 1 704-15K36 704-15K36 31.5 Volts Peak Configuration Package Style Power / Data Sheet Dissipation Number

CLC560

Abstract: CLC561
Contextual Info: Wideband, Low Distortion APPLICA TIO NS: output amplification arbitrary waveform generation ATE systems cable/line driving function generators • SAW drivers • flash A /D driving and testing FEATURES: • 150MHz bandwidth at + 24dB m output • low distortion 2nd/3rd:

Contextual Info: 2mm Interconnect TEMPUS C B C 20 M ale Pow er Modules — W ide W all - - Solder or Pressfit Term ination — 4 Row "I Features • Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order • Stackable with other TEMPUS modules, with

SPC-03-XLR-xxCxA

Abstract: DS-5611 SPC-03-XLR SPC-03-XLR-xxCDA 61-XX GR-468 transceiver DFB APD 155 DFB APD 155mbps
Contextual Info: P/N: SPC-03-XLR-xxCxA 155 Mbps CWDM SFP Transceiver Features Single 3.3V supply 42.5dB Minimum Link Budget CWDM DFB Laser APD Receiver Commercial Temperature Available SFP MSA SFF-8074i Compliant Digital Diagnostic SFF-8472 Compliant GR-253/STM G.957 Compliant

DS561

Contextual Info: SENSITRON SEMICONDUCTOR 2000 CATALOG Transient VoltageSuppressor SurfaceMount InlineArrayPackage INLINE-5 Size A TheInline-2 through Inline-10 series can be constructed withanynumber of TVSdie from 2 to10 withcommonanode. Ifa common contact isalsorequired to bebrought out, the

Contextual Info: SENSITRON SEMICONDUCTOR 2000 CATALOG Transient VoltageSuppressor SurfaceMount InlineArrayPackage INLINE-5 Size A TheInline-2 through Inline-10 series can be constructed withanynumber of TVSdie from 2 to10 withcommonanode. Ifa common contact isalsorequired to bebrought out, the

XC6SLX16-CSG324

Abstract: ch7301 DVI VHDL DVI VHDL xilinx ch7301 CHRONTEL 7301 Xilinx XPS Thin Film Transistor(TFT) Controller TFT controller XC4VLX25-FF668-10 a/ch7301 DVI VHDL DS695
Contextual Info: XPS Thin Film Transistor TFT Controller (v2.00a) DS695 September 16, 2009 Product Specification 0 0 Introduction LogiCORE Facts The XPS Thin Film Transistor (TFT) controller is a hardware display controller IP core capable of displaying 256k colors. The XPS TFT controller

uart vhdl

Abstract: XC5VLX50-FF676
Contextual Info: LogiCORE IP XPS SYSMON ADC v3.00.b DS620 October 19, 2011 Product Specification Introduction LogiCORE IP Facts Table The Xilinx Platform Studio (XPS) System Monitor (SYSMON) Analog-to-Digital Converter (ADC) Intellectual Property (IP) core is a 32-bit slave

XC5VLX50-FF676

Abstract: XC4VFX12-FF668-10 xc5vlx50-ff676-1 XC6VLX130TFF1156 XC3S700A VIRTEX-5 DDR2 controller DS570 AT45DB161D M25P16 PLBV46
Contextual Info: XPS Serial Peripheral Interface SPI (v2.01b) DS570 September 16, 2009 Product Specification 0 0 Introduction LogiCORE Facts The XPS Serial Peripheral Interface (SPI) connects to the PLB V4.6 (Processor Local Bus with Xilinx simplifications) and provides a serial interface to SPI