DS087 Search Results

Contextual Info: R DS087 v2.1 March 10, 2003 System ACE MPM Solution Preliminary Product Specification Summary • • • • • • • System-level, high capacity, preconfigured solution for Virtex Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs

Contextual Info: DAICO IND USTRIES INC blE D • SbCmTSD OOOlbflE MtiT ■ DAI FEA TU R ES MODEL NO. DS0874 ■ D C -2000 MHz ■ 16 nSec Transition Time ■ 55 nSec Switching Speed GaAs SP4T ■ 25 mV Transients ■ Ultra Small 14 Pin DIP & ■ Non-Reflective RF2 RF3 4 12

dsq8

Abstract: DSQ850 1RF510 1RF1530 SP16T D8087 d809 DS0860 DS0860/B3 DS0838
Contextual Info: GaAs Switches II & Page: In This Issue: DC-2000 MHz To-5 SP2T s. Model No. D S0850/813 10-1500 MHz To-8 & R at pack SP2T's. Model No. D S0860/812 5-1000 MHz High Isolation Flat pack SP2T. Model No. DS0662 5-1000 MHz 24 PIN DIP SP8T. Model No. DS0838 DC-2000 MHz 14 PIN DIP SP4T, Model No. DS0874

XCV50E

Abstract: SelectMAP A0-A21 CS144 VQ44 xilinx SelectMAP second source flash configuration
Contextual Info: R DS087 v1.2 June 7, 2002 System ACE MPM Solution Advance Product Specification Summary • • • • • • • System level, high capacity, pre-configured solution for Virtex™ Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs

Contextual Info: FEATURES • D C -2 0 0 0 MHz ■ 16 nSec Transition Time ■ 55 nSec Switching Speed S P 4T MODEL NO. DS0874 è GaA* 8P4T ■ 25 mV Transients ■ Ultra Small 14 Pin DIP ■ Non-Reflective R F COM RF1 14 1 ■ TTL Driver oooo3 .XXX Ï CD S CD > -i O 0C V

XC2V80

Abstract: XCV50E
Contextual Info: System ACE MPM Solution R DS087 v2.3 May 21, 2007 Product Specification Summary • • • • • • • - System-level, high capacity, preconfigured solution for Virtex Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs Industry standard Flash memory combined with Xilinx

DS0874

Contextual Info: FEA TU R ES • 16 nSec Transition Time ■ 55 nSec Switching Speed SP4T MODEL NO. DS0874 dr ■ D C -2 0 0 0 MHz GaAs SP4T ■ 25 mV Transients ■ Ultra Small 14 Pin DIP ■ Non-Reflective RF2 ■ TTL Driver 12 RF3 4 C2 C1 „0" ••0“ RF COM +5V C2

XCV50E

Abstract: A0-A21 CS144 VQ44 SelectMAP
Contextual Info: R DS087 v1.0 September 25, 2001 System ACE MPM Solution Advance Product Specification Summary of Features • • • • • • • • System level, high capacity, pre-configured solution for Virtex and Spartan FPGAs Industry standard Flash memory die combined with

ACE FLASH

Abstract: XCV50E Xilinx jtag cable Schematic A0-A21 CS144 VQ44 XC2V80
Contextual Info: R DS087 v2.2 June 13, 2003 System ACE MPM Solution Preliminary Product Specification Summary • • • • • • • System-level, high capacity, preconfigured solution for Virtex Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs

relay 5 volt - SPST

Abstract: DA0035 DA0775 DA0784-1 DA0786 DS0028 DS0052 DS0073 DS0778 P35-4101
Contextual Info: DAICO INDUSTRIES INC blE D • Eb04TEQ OQQlfllb 552 ■ DAI FEATURES ■ 0.5 - 3.5 GHz Frequency Range ■ Self Biased. No Separate Gate Supply Req. ■ +22 dBm Output Power Capability ■ Matched to 50 Q .400 MAX BOND PAD CONFIGURATION — .21 — • .180 SQ

DA0035

Abstract: DA0775 DA0784-1 DA0786 DS0028 DS0052 DS0073 DS0778 P35-4100 P35-4100-0
Contextual Info: D A I C O I N D U S T R I E S INC tl E D DAI E b O ^ E D OQOlfilS bib FEATURES • 0.05 - 3.5 GHz Frequency Range ■ ■ Flat Frequency Response With Direct Gain Control +22 dBm Output Power Capability ■ Matched to 50 Q Æ mm 5% äti'is iS «®sms: .400 MAX

084I

Contextual Info: DIN SOCKET METAL COVER TYPE C1 16 ~ t o jL S pecifications: 72 00 - ^ Insulation Resistance: 100 M n at 500V D.C. Dielectric Strength: 1000V A.C./1 Minute Contact Resistance: 2 0m n MAX. ARRANGEMENT OF -T t5 .q c r f t fid d Q i \ / * I/m liW \ iV V r */

Contextual Info: DAICO I N D U S T R I E S INC tlE D DAI Eti04TEQ OGOlfllb 552 FEATURES • 0.5 - 3.5 GHz Frequency Range Self Biased. No Separate Gate Supply Req. +22 dBm Output Power Capability Matched to 50 Q .400 MAX BOND PAD CONFIGURATION — .21 — - .180 SQ rfr; .0 5 0 |

Contextual Info: GaAs Switches II & Page: In This Issue: DC-2000 MHz To-5 SP2T s. M odel No. DS0850/813 10-1500 MHz To-8 & R a t p a ck SP2T's. M odel No. DS0860/812 5-1000 MHz H igh Iso latio n Flat p a ck SP2T. M odel No. DS0662 5-1000 MHz 24 PIN DIP SP8T. M odel No. DS0838

F300H

Abstract: FC44H BIT137
Contextual Info: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

USB cable AWM 2725 rx tx pinout

Contextual Info: CP3BT26 CP3BT26 Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces Literature Number: SNOSAE5C CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded

F1A4

Abstract: TR-28 national timer switch tb 208
Contextual Info: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

national timer switch tb 179

Contextual Info: CP3BT13 Reprogrammable Connectivity Processor with Bluetooth and CAN Interfaces General Description The CP3BT13 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

Contextual Info: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

CP3BT23

Abstract: CP3BT23G18NEP CP3BT23G18NEPNOPB CR16C LMX5251 LMX5252 LQFP-144 315 receiver module
Contextual Info: MAY 2004 CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

PLA relay

Abstract: ds0097 pla relay 8 pin 9 v dc
Contextual Info: DAICO INDUSTRIES INC blE D • EhD4T5D □□□1S37 537 ■ DAI FEATURES J ■ 10-3000 MHz ■ ■ -30 to -10 dBm Dynamic Range Adjustable Threshold Level ■ ■ Stable Over Temperature See DTD01939 for T0-8 Version MODEL NO. DTD05039 tH r Threshold Detector

4 wire resistive touch screen

Abstract: deutsch dmc CP3UB26 CP3UB26G18NEP CP3UB26G18NEPNOPB CP3UB26G18NEPX CP3UB26G18NEPXNOPB CR16C LQFP-144
Contextual Info: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

EE CORE 70

Abstract: books national semiconductor
Contextual Info: CP3UB26 CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces Literature Number: SNOSAE7D CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

Contextual Info: CP3UB26 www.ti.com SNOSAE7E – APRIL 2005 – REVISED JANUARY 2014 CP3UB26 Reprogrammable Connectivity Processor with USB Interface 1 GENERAL DESCRIPTION The CP3UB26 connectivity processor combines high performance with the massive integration needed for