DPS3232V Search Results

Contextual Info: 1 Megabit CMOS SRAM D EN SE-PA C DPS3232V M I C R O S Y S Ï li M S DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs are

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Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE O DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 3 2 K X8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceram ic substrate w ith m atching thermal

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs

Contextual Info: 1 Megabit CMOS SRAM D EN SEFAC M I C R O S Y S ï If MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

Contextual Info: DPS3232V Dense-Pac Microsystems, Inc. ^ 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceramic LCC packages surface m o u n te d on a co-fired c e ra m ic s u b s tra te w ith m a tc h in g th e rm a l

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

DPS3232V

Contextual Info: 1 Megabit CM O S SRAM D EN SE-PA C M ÍC R O S Y SÏ \r, MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs

Contextual Info: □PM DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE Dense-Pac Microsystems, Inc. ^ DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceram ic LCC packages surface m o u n te d on a co-fired c e r a m ic s u b s tra te w ith m a tc h in g th e rm a l

Contextual Info: 1 Megabit CMOS SRAM DENSE-PAC DPS3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs

Contextual Info: 1 Megabit CMOS SRAM PENSE-PAC MICROSYSTEMS DPS3232V D E SC R IP TIO N : The D PS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic L C C packages surface mounted on a co-fired ceramic substratewith matching thermal coefficients. The LCCs

Contextual Info: □PM •C Dense-Pac Microsystems, Inc ^ DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired c eram ic substrate w ith m atching thermal