DPS32 Search Results

Contextual Info: □PM . Dense-Pac Microsystems Inc. DPS32M8A ^ HICH SPEED 32K X 8 CMOS SRAM MONOLITHIC ADVANCED INFORMATION DESCRIPTION: The DPS32M8A is a 32K X 8 CMOS Static Random Access Memory SRAM . The memory utilizes asynchronous circuitry and may be maintained in any

Contextual Info: 1 Megabit CMOS SRAM D EN SE-PA C DPS3232V M I C R O S Y S Ï li M S DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs are

Contextual Info: □PM DPS32M8A Dense-Pac Microsystems, Inc. O H IG H SPEED 32K X 8 C M O S S R A M M O N O L IT H IC ADVANCED INFORMATION D ESCRIPTIO N: The D P S 3 2 M 8 A is a 32K X 8 C M O S Static Random A c ce ss M e m o ry SR A M . The m em ory utilizes asynchronous circuitry and may be maintained in any

DPD72PG1

Abstract: 23L206 AA2876A 34n20 DPD72 AA2876 DPS32PG1 270AN Anaheim Automation
Contextual Info: DPD72PG1 DPS32PG1 DPL Anaheim Automation Driver Packs with pulse generator incorporate a bilevel driver, matching power supply and pulse generator. The AA2876 Pulse Generator is used in the DPS32PG1 and DPD72PG1 units while the DPL has its Pulse Generator built into its circuitry. There are

Contextual Info: T Dense-Pac Microsystems, Inc. DPS32M8A H IG H SP E E D 3 2 K X 8 C M O S S R A M M O N O L IT H IC O ADVANCED INFORMATION DESCRIPTION: The D P S 3 2 M 8 A is a 3 2 K X 8 C M O S Static Random A c c e s s M e m o r y S R A M . T h e m e m o ry utilizes

Contextual Info: / □PM Dense-Pac Microsystems, Inc. DPS32X16A r o H I G H S P E E D 3 2 K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY D E S C R IP T IO N : The D P S 3 2 X 1 6 A is a 40-pin Pin Grid Array P G A consisting of two 3 2 K X 8 S R A M devices in ceramic

twilight

Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE O DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 3 2 K X8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceram ic substrate w ith m atching thermal

Contextual Info: DPS32X16A □PM Dense-Pac Microsystems, Inc. O H IG H SPEED 3 2 K X 16 C M O S S R A M P G A M O D U L E PRELIM INARY DESCRIPTIO N: The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 S R A M devices in ceramic LCC packages surface mounted on a co-fired ceramic

Contextual Info: □PM DPS32M8A Dense-Pac Microsystems. Inc. HIGH SPEED 32K X 8 CM OS SRAM MONOLITHIC ADVANCED INFORMATION DESCRIPTION: The DPS32M8A is a 32K X 8 CM OS Static Random Access Memory SRAM . The memory utilizes asynchronous circuitry and may be maintained in any

Contextual Info: D FN SF-P A C m,rc li o s y s r Jr: .vi 3 /k -D & u u s High Density Memory Device 1 Megabit High Speed SRAM DPS32KX32Y5 PRELIMINARY D ESCR IPTIO N : The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of

"32K x 32" SRAM

Abstract: DPS32KX32Y5
Contextual Info: DENSE-PAC 1 Megabit High Speed SRAM /H - ~ D c n S tiS H/gft Density Memory Device m icrosystem s dps32KX32Y5 PRELIMINARY DESCRIPTION: The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of

Contextual Info: D E N S E -P A C M 1 C R O S Y S T e Ms /H - T c n S k S ¡-j¡gh Density Memory Device 1 Megabit High Speed SRAM dps32KX32Y5 PRELIMINARY DESCRIPTION: The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs

32Kx4

Contextual Info: □P M DPS32X16A Dense-Pac Microsystems, Inc. O H IG H SPEED 32K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY DESCRIPTION: The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 SR A M devices in ceramic LCC packages surface mounted on a co-fired ceramic

Contextual Info: 1 Megabit CMOS SRAM D EN SEFAC M I C R O S Y S ï If MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

Contextual Info: DPS3232V Dense-Pac Microsystems, Inc. ^ 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceramic LCC packages surface m o u n te d on a co-fired c e ra m ic s u b s tra te w ith m a tc h in g th e rm a l

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

DP645

Abstract: vlt 2800 AJJ 610 Dense-Pac Microsystems DPS41288-120M DPS41288-70I vlt 2800 application dps41288-150m C18045 E148
Contextual Info: Q Ì %C3 DPS32KX 8 BASED CMOS SRAM FAMILY DESCRIPTION: The DPS32K X 8 fam ily consists of asynchronous Static Random A ccess Memories SRAMs , com plete with memory interface logic and on-board capacitors, available in the organizations and packages described

DPS3232V

Contextual Info: 1 Megabit CM O S SRAM D EN SE-PA C M ÍC R O S Y SÏ \r, MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs

Contextual Info: □PM D P S 3 2 X 16A Dense-Pac Microsystems, Inc. ^ H IG H S PEED 32K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY D ESC R IPT IO N : The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 SR A M devices in ceramic LCC packages surface mounted on a co-fired ceramic

S32M8

Contextual Info: T Dense-Pac Microsystems, Inc. ^ DPS32M8A H IG H SPEED 32K X 8 C M O S SRAM M O N O LIT H IC ADVANCED INFORMATION D ES C R IP T IO N : The D PS32M 8A is a 32K X 8 C M O S Static Random A c c e ss M em ory SRA M . The m em ory utilizes asynchronous circuitry and may be maintained in any

Contextual Info: □PM DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE Dense-Pac Microsystems, Inc. ^ DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceram ic LCC packages surface m o u n te d on a co-fired c e r a m ic s u b s tra te w ith m a tc h in g th e rm a l

Contextual Info: 1 Megabit CMOS SRAM DENSE-PAC DPS3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs

Contextual Info: 1 Megabit CMOS SRAM PENSE-PAC MICROSYSTEMS DPS3232V D E SC R IP TIO N : The D PS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic L C C packages surface mounted on a co-fired ceramic substratewith matching thermal coefficients. The LCCs