DPS12 Search Results

Contextual Info: □PM DPS128X16BH3 Dense-Pac Microsystems. Inc. ^ 128K X 16 CMOS SRAM J-LEADED STACKS ADVANCED INFORMATION DESCRIPTION: The DPS128X16BH3 "S T A C K " m odule is a r e v o lu tio n a ry n e w h ig h sp e e d m e m o ry subsystem using D ense-Pac M icro syste m s'

Contextual Info: 3 0A 0 3 7-01 B DENSE-PAC 1 Megabit High Speed CMOS SRAM DPS128M8En MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPS128M8En is a very high speed 128K x 8 Static Random Access Memory SRAM fabricated with a CMOS silicon gate process. The memory utilizes asynchronouscircuitryand may be maintained in any

Contextual Info: • DPS128M8 I V i Pense-Pac Microsystems, Inc. 128K X 8 CMOS SRAM MONOLITHIC PRELIMINARY DESCRIPTION: The DPS128M8-70, -85, -10, -12, -15 is a 128k X 8 Static Random Access Memory SRAM fabricated on a monolithic CMOS chip. It is designed for use in high density, high speed, low power applications. All

Contextual Info: DPS128X32AV3 HIG H SPEED 128K X 32 CMOS SRAM VERSA-STACK ADVANCED INFORMATION DESCRIPTION: The DPS128X32AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC m ounted on a co-fired

Contextual Info: 3 Megabit CMOS SRAM DENSE-PAC DPS128X24XP/XHP MICROSYSTEMS DESCRIPTION: The DPS128X24XP/XHP is a 68-pin surface mount module consisting of three 128K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with either "J"-Leads or

Contextual Info: DPS128X24V3 Dense-Pac Microsystems, Inc. CERAMIC 128K X 24 C M O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: T he D P S 1 2 8 X 2 4 V 3 " V E R S A - S T A C K " m odule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s t e m u s in g Dense-Pac M icrosyste m s' ceram ic Stackable Leadless

Contextual Info: Dense-Pac Microsystems, Inc. ^ D P S 1 2 8 X 1 6 A 3 CERAM IC 128K X ¡ 6 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a

Contextual Info: 1 Megabit High Speed CMOS SRAM DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

DPS128X32BV3

Abstract: DPS128X32CV3
Contextual Info: 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC

256kx8 sram 5v

Abstract: 50-PIN
Contextual Info: DENSE-PAC 2 Megabit High Speed CM OS SRAM MICROSYSTEMS DPS128X16Cn3/DPSl 28X16Bn3 D E S C R IP T IO N : The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "S T A C K " modules area revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC .

DPS128C32BV3

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: T he D P S 128C 32B V 3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic

lem HA

Abstract: 50-PIN dps128m8bny
Contextual Info: DENSE-PAC 1 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 H igh Speed SRAM devices are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC .

DPS128X32CV3

Abstract: 2CV3
Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ

OL80m

Abstract: DPS128X32BV3 DPS128X32CV3
Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 M I C R O S Y S T E M S D ESCRIPTIO N : The D PS128X32CV 3/D PS128X32EV3 "V ER S A - S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC

Contextual Info: DENSE-PAC MICROSYSTEMS MegabiJ High Speed CMOS SRAM DPS128X24Bn3 D ESCRIPTIO N : The DPS128X24Bn3 High Speed SRAM "STACK" modules are a re vo lu tio n a ry new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC MICROSYSTEMS 3 Megabit High Speed CMOS SRAM DPS128X24Bn3 DESCRIPTION: The DPST28X24Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded

DPS128X16A

Contextual Info: CERAMIC 128KX 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a re vo lu tio n ary n ew m e m o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC m ounted on a co-fired ceram ic substrate. The module packs

DPS128X16A

Contextual Info: □PM D P S 1 2 8 X 1 6 A 3 Dense-Pac Microsystems. Inc. ^ CERAMIC 128KX 16 CM OS SRAM MODULE PRELIMINARY D ESC R IP T IO N : The DPS128X16A3 "DENSE-STACK" module is a revolutionary new m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit High Speed CMOS SRAM DPS128M8En PRELIM INARY DESCRIPTION: The DPS128M8En is a very high speed 128K x 8 Static Random Access Memory SRAM fabricated with a CMOS silicon gate process. The memory utilizes asynchronous circuitry and may be maintained in any

Contextual Info: z DPS128X24AV3^ Dense-Pac Microsystems. Inc. H IG H SPEED 128K X 24 C M O S SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPS128X24AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry n e w high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: □PM V<" P - M icrosvstem s In I~-c D ense-Pac - - - -C - DPS128M8A h i g jn h s ed rA am c n ik a prce c u c L etK M iiL ¿ - -O 128K X 8 C M O S SRAM M O N O LITH IC ADVANCED INFORMATION D ESC R IP TIO N : T h e D P S 1 2 8 M 8 A is a high speed m o no lithic

128depth

Contextual Info: D E N S E -P A C 2 Megabit CMOS SRAM M I C R O S Y S T E M S D PS128X16n3 DESCRIPTION: The DPS128X16n3 SRAM "STACK" modules area revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCQ. Available in straight leaded, "J" leaded

DPS128X16A

Contextual Info: DPS128X16AA3 □PM Dense-Pac Microsystems, Inc. H IG H SPEED dhRAM IC 128K X 16 CM OS SRAM M ODULE O ADVANCED INFORMATION DESCRIPTION: The DPS128X16AA3 "DENSE-STACK" m odule is a revolutionary new high speed m e m o ry subsystem using Dense-Pac M icro syste m s'

Contextual Info: 1 Megabit CMOS SRAM DPS128M8n3/DPS128X8A3 DESCRIPTION: The DPS128M8nY & DPS128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a 50-pin PGA