DPAC Search Results
DPAC Datasheets (500)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DP322MX16PMBY5-90CI | DPAC Technologies | 32 Mega bit 3.3 Volt CMOS FLASH EEPROM | Original | 385.39KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP322MX16PMTY5-80CI | DPAC Technologies | 32 Mega bit 3.3 Volt CMOS FLASH EEPROM | Original | 385.39KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP322MX16PMTY5-90CI | DPAC Technologies | 32 Mega bit 3.3 Volt CMOS FLASH EEPROM | Original | 385.39KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D16MX8RY5-50C | DPAC Technologies | DRAM Module, FPM DRAM, 16MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D16MX8RY5-60C | DPAC Technologies | DRAM Module, FPM DRAM, 16MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D16MX8RY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 16MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D16X8RY5-60C | DPAC Technologies | 128 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D16X8RY5-70C | DPAC Technologies | 128 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D2MX32PY5-60C | DPAC Technologies | 64 Megabit CMOS DRAM | Original | 634.19KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D2MX32PY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 8MByte Density, 3.3V Supply, TSOP Package | Original | 634.2KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D2MX32PY5-80C | DPAC Technologies | DRAM Module, FPM DRAM, 8MByte Density, 3.3V Supply, TSOP Package | Original | 634.2KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D32MX8RY5-50C | DPAC Technologies | DRAM Module, FPM DRAM, 32MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D32MX8RY5-60C | DPAC Technologies | DRAM Module, FPM DRAM, 32MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D32MX8RY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 32MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DP3D32X8RY5-50C | DPAC Technologies | 256 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D32X8RY5-60C | DPAC Technologies | 256 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D32X8RY5-70C | DPAC Technologies | 256 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D64MX8RY5-50C | DPAC Technologies | DRAM Module, FPM DRAM, 64MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D64MX8RY5-60C | DPAC Technologies | DRAM Module, FPM DRAM, 64MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DP3D64MX8RY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 64MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 |
DPAC Price and Stock
PUI Audio HD-PAC1212-FLEXBUZZER ELEMENT STD 50M 90V FPC |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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HD-PAC1212-FLEX | Bulk | 196 | 1 |
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PUI Audio HD-PAC1212BUZ ELEM STD 24KHZ 12MMX12MM |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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HD-PAC1212 | Tray | 73 | 1 |
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HD-PAC1212 | 70 | 1 |
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PUI Audio HD-PAC2102BUZZER ELEMENT STD 14KHZ 21MM |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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HD-PAC2102 | Tray | 51 | 1 |
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HD-PAC2102 | Tray | 16 Weeks, 3 Days | 80 |
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HD-PAC2102 | 80 | 1 |
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EDATEC ED-PAC3020-082-PPAC PI5_8GB/256GB,CODESYS |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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ED-PAC3020-082-P | Box | 5 | 1 |
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EDATEC ED-PAC3020-041-PPAC PI5_4GB/128GB,CODESYS |
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ED-PAC3020-041-P | Box | 5 | 1 |
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DPAC Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: DPAC DPAC-3000 Series Distributed Programmable Automation Controller with HSL and Motionnet Buses Intel Atom N270 1.6 GHz CPU Motionnet Bus HSL Bus Dual LAN 10/100 Base-T Battery backup to protect data USB 2.0 x 2 External CompactFlash slot for data storage |
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DPAC-3000 DPAC-3000-1N DPAC-3000-11 CR2032 500Hz | |
dp502
Abstract: WLNB-AN-DP101 WLNB-AN-DP102 airborn dp101 wifi diversity web server embedded internet radio WLNB-AN-DP501 WLNB-AN-DP502
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WLNB-AN-DP100 WLNB-AN-DP500 WLNB-SE-DP100 420mA 350mA 400KHz 20MHz) RS-232/422/485 WLNB-SE-DP101) 12-36DS-0 dp502 WLNB-AN-DP101 WLNB-AN-DP102 airborn dp101 wifi diversity web server embedded internet radio WLNB-AN-DP501 WLNB-AN-DP502 | |
Contextual Info: ACH2-AT-DP004 DWG. # ACH2-AT-DP004 DPAC TECHNOLOGIES http://www.dpactech.com ACH2-AT-DP004 DWG. # ACH2-AT-DP004 DPAC TECHNOLOGIES http://www.dpactech.com |
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ACH2-AT-DP004 | |
Contextual Info: ACH2-AT-DP003 DWG.# ACH2-AT-DP003 DPAC TECHNOLOGIES CORP. http://www.dpactech.com |
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ACH2-AT-DP003 | |
Contextual Info: Features and Benefits Quatech Wireless Device Servers When you need the ultimate in wireless device server performance, ease of use and flexibility, specify Quatech. Now with WPA support! sensitivity, the embedded DPAC Technologies 802.11b radio provides |
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921kbps RS-232/422/485) | |
Contextual Info: Features and Benefits Quatech Wireless Device Servers When you need the ultimate in wireless device server performance, ease of use and flexibility, specify Quatech. Now with WPA support! sensitivity, the embedded DPAC Technologies 802.11b radio provides |
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921kbps RS-232/422/485) | |
Contextual Info: Part Number: XRP1LVG103M RIGHT ANGLE LED INDICATOR PRELIMINARY SPEC Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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XRP1LVG103M 500PCS XDSA8979 | |
Contextual Info: Part Number: XRP1LMG103W RIGHT ANGLE LED INDICATOR Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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XRP1LMG103W 500PCS XDSA8974 | |
Contextual Info: XZVG50W-1 Part Number: www.SunLED.com 3.0x2.0mm SMD CHIP LED LAMP Features D3.0mmx2.0mm SMT LED,1.3mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DVARIOUS COLORS AND LENS TYPES AVAILABLE. DPACKAGE : 2000PCS / REEL. |
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XZVG50W-1 2000PCS 1/10Duty XDSA7481 | |
FAH 32Contextual Info: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a memory subsystem using DPAC Technologies’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 Megabits of |
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DP5Z1MW32PV3 DP5Z1MW32PV3 MX29F1610AHC) MX29F1610HC) 30A180-11 FAH 32 | |
Contextual Info: Part Number: XRP1LMG103M RIGHT ANGLE LED INDICATOR PRELIMINARY SPEC Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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XRP1LMG103M 500PCS XDSA8978 | |
Contextual Info: DPAC TECHNOLOGIES DPAC TECHNOLOGIES ACH2-AT-DP007 http://www.dpactech.com DPAC TECHNOLOGIES http://www.dpactech.com |
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ACH2-AT-DP007 | |
Contextual Info: XZMOK54W-1 part number: www.SunLED.com 2.0x1.25mm SMD CHIP LED LAMP Features D2.0mmx1.25mm SMT LED,0.75mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DVARIOUS COLORS AND LENS TYPES AVAILABLE. DPACKAGE : 2000PCS / REEL. |
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XZMOK54W-1 2000PCS 1/10Duty XDSA1278 | |
Contextual Info: XZBBA67W Part Number: 4.0x4.0mm RIGHT ANGLED SURFACE MOUNT LED LAMP PRELIMINARY SPEC Features DSINGLE COLOR. DSUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. DAVAILABLE ON TAPE AND REEL. DIDEAL FOR BACKLIGHTING. DPACKAGE : 500PCS / REEL. DMOISTURE SENSITIVITY LEVEL : LEVEL 4. |
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XZBBA67W 500PCS XDSA9814 XDSA9814 | |
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DPDD64MX16XCY8Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 1 Gigabit CMOS DDR SDRAM DPDD64MX16XCY8 DESCRIPTION: DuraStack uses DPAC's innovative technology patent pending to stack memory devices with a direct lead-on-lead, creating a metallurgical bond. As no substrate interface material is required, the length and width of the stack is comparable to a TSOP type-II |
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DPDD64MX16XCY8 MO-238 30A263-00 DPDD64MX16XCY8 | |
54LVTH62245Contextual Info: 54LVTH162245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS DPACI General Description Features • Mixed-mode signal operation. 5V input/output with 3.3V supply . Total dose hardness:Typical 100 krad (Si), depending upon space environment A-port outputs have equivalent 22 ohm series |
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54LVTH162245 16-BIT 54LVTH162d 54LVTH62245 54LVTH62245 | |
Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM |
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DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 53A001-00 30A222-00 | |
DPAC TechnologiesContextual Info: DPAC TECHNOLOGIES DPAC TECHNOLOGIES ACH2-AT-DP010 http://www.dpactech.com DPAC TECHNOLOGIES http://www.dpactech.com |
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ACH2-AT-DP010 DPAC Technologies | |
DP006Contextual Info: ACH2-AT-DP006 DWG. # ACH2-AT-DP006 DPAC TECHNOLOGIES http://www.dpactech.com |
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ACH2-AT-DP006 DP006 | |
Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM |
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DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 53A001-00 30A222-00 | |
Contextual Info: Part Number: XRP1LUR103M RIGHT ANGLE LED INDICATOR PRELIMINARY SPEC Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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XRP1LUR103M 500PCS XDSA9015 | |
Contextual Info: XZMOK55W-3 part number: www.SunLED.com 3.2x1.6mm SMD CHIP LED LAMP Features D3.2mmx1.6mm SMT LED,1.8mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DPACKAGE : 2000PCS / REEL. Notes: 1. All dimensions are in millimeters inches . |
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XZMOK55W-3 2000PCS 1/10Duty XDSA1362 | |
Contextual Info: XZUB50W-1 part number: www.SunLED.com 3.0x2.0mm SMD CHIP LED LAMP Features D3.0mmx2.0mm SMT LED,1.3mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DVARIOUS COLORS AND LENS TYPES AVAILABLE. DPACKAGE : 2000PCS / REEL. |
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XZUB50W-1 2000PCS 1/10Duty XDSA1500 | |
Contextual Info: 54LVTH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS DPACI General Description Features • • • • • • • • • • Mixed-mode signal operation. 5V input/output with 3.3V supply . Total dose hardness:Typical 100 krad (Si), depending upon space environment |
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54LVTH162244 16-BIT |