DPAC Search Results
DPAC Datasheets (500)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| DP322MX16PMBY5-90CI | DPAC Technologies | 32 Mega bit 3.3 Volt CMOS FLASH EEPROM | Original | 385.39KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP322MX16PMTY5-80CI | DPAC Technologies | 32 Mega bit 3.3 Volt CMOS FLASH EEPROM | Original | 385.39KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP322MX16PMTY5-90CI | DPAC Technologies | 32 Mega bit 3.3 Volt CMOS FLASH EEPROM | Original | 385.39KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D16MX8RY5-50C | DPAC Technologies | DRAM Module, FPM DRAM, 16MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D16MX8RY5-60C | DPAC Technologies | DRAM Module, FPM DRAM, 16MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D16MX8RY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 16MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D16X8RY5-60C | DPAC Technologies | 128 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D16X8RY5-70C | DPAC Technologies | 128 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D2MX32PY5-60C | DPAC Technologies | 64 Megabit CMOS DRAM | Original | 634.19KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D2MX32PY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 8MByte Density, 3.3V Supply, TSOP Package | Original | 634.2KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D2MX32PY5-80C | DPAC Technologies | DRAM Module, FPM DRAM, 8MByte Density, 3.3V Supply, TSOP Package | Original | 634.2KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D32MX8RY5-50C | DPAC Technologies | DRAM Module, FPM DRAM, 32MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D32MX8RY5-60C | DPAC Technologies | DRAM Module, FPM DRAM, 32MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D32MX8RY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 32MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D32X8RY5-50C | DPAC Technologies | 256 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D32X8RY5-60C | DPAC Technologies | 256 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D32X8RY5-70C | DPAC Technologies | 256 Megabit CMOS DRAM | Original | 253.43KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D64MX8RY5-50C | DPAC Technologies | DRAM Module, FPM DRAM, 64MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D64MX8RY5-60C | DPAC Technologies | DRAM Module, FPM DRAM, 64MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP3D64MX8RY5-70C | DPAC Technologies | DRAM Module, FPM DRAM, 64MByte Density, 3.3V Supply, TSOP Package | Original | 253.44KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DPAC Price and Stock
STMicroelectronics DPACK-CDROM-71- Virtual or Non-Physical Inventory (Software & Literature) (Alt: DPACK-CDROM-71) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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DPACK-CDROM-71 | No Container | 29 Weeks, 2 Days | 1 |
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Get Quote | |||||
PUI Audio HD-PAC1204- Trays (Alt: HD-PAC1204) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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HD-PAC1204 | Tray | 80 |
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HD-PAC1204 | 1 |
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Buy Now | |||||||
PUI Audio HD-PAC1212-FLEX12MM PIEZO HAP 24KHZ 12G FPC - Trays (Alt: HD-PAC1212-FLEX) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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HD-PAC1212-FLEX | Tray | 14 Weeks, 2 Days | 94 |
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Intel Corporation NBNWDPACKK 853158(Alt: NBNWDPACKK 853158) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NBNWDPACKK 853158 | 1 |
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STMicroelectronics DPA CHARGE- Virtual or Non-Physical Inventory (Software & Literature) (Alt: DPA CHARGE) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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DPA CHARGE | No Container | 1 |
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DPAC Datasheets Context Search
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Contextual Info: DPAC DPAC-3000 Series Distributed Programmable Automation Controller with HSL and Motionnet Buses Intel Atom N270 1.6 GHz CPU Motionnet Bus HSL Bus Dual LAN 10/100 Base-T Battery backup to protect data USB 2.0 x 2 External CompactFlash slot for data storage |
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dpac-3000dpac-3000-1ndpac-3000-11cr2032+1 | |
dp502
Abstract: WLNB-AN-DP101 WLNB-AN-DP102 airborn dp101 wifi diversity web server embedded internet radio WLNB-AN-DP501 WLNB-AN-DP502
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wlnb-an-dp100wlnb-an-dp500wlnb-se-dp100420ma+15 | |
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Contextual Info: ACH2-AT-DP004 DWG. # ACH2-AT-DP004 DPAC TECHNOLOGIES http://www.dpactech.com ACH2-AT-DP004 DWG. # ACH2-AT-DP004 DPAC TECHNOLOGIES http://www.dpactech.com |
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Contextual Info: ACH2-AT-DP003 DWG.# ACH2-AT-DP003 DPAC TECHNOLOGIES CORP. http://www.dpactech.com |
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Contextual Info: Features and Benefits Quatech Wireless Device Servers When you need the ultimate in wireless device server performance, ease of use and flexibility, specify Quatech. Now with WPA support! sensitivity, the embedded DPAC Technologies 802.11b radio provides |
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921kbpsrs-232/422/485 | |
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Contextual Info: Features and Benefits Quatech Wireless Device Servers When you need the ultimate in wireless device server performance, ease of use and flexibility, specify Quatech. Now with WPA support! sensitivity, the embedded DPAC Technologies 802.11b radio provides |
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921kbpsrs-232/422/485 | |
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Contextual Info: Part Number: XRP1LVG103M RIGHT ANGLE LED INDICATOR PRELIMINARY SPEC Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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xrp1lvg103m500pcsxdsa8979 | |
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Contextual Info: Part Number: XRP1LMG103W RIGHT ANGLE LED INDICATOR Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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xrp1lmg103w500pcsxdsa8974 | |
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Contextual Info: XZVG50W-1 Part Number: www.SunLED.com 3.0x2.0mm SMD CHIP LED LAMP Features D3.0mmx2.0mm SMT LED,1.3mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DVARIOUS COLORS AND LENS TYPES AVAILABLE. DPACKAGE : 2000PCS / REEL. |
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xzvg50w-12000pcs1/10dutyxdsa7481 | |
FAH 32Contextual Info: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a memory subsystem using DPAC Technologies’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 Megabits of |
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dp5z1mw32pv3mx29f1610ahcmx29f1610hc30a180-11+1 | |
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Contextual Info: Part Number: XRP1LMG103M RIGHT ANGLE LED INDICATOR PRELIMINARY SPEC Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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xrp1lmg103m500pcsxdsa8978 | |
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Contextual Info: DPAC TECHNOLOGIES DPAC TECHNOLOGIES ACH2-AT-DP007 http://www.dpactech.com DPAC TECHNOLOGIES http://www.dpactech.com |
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Contextual Info: XZMOK54W-1 part number: www.SunLED.com 2.0x1.25mm SMD CHIP LED LAMP Features D2.0mmx1.25mm SMT LED,0.75mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DVARIOUS COLORS AND LENS TYPES AVAILABLE. DPACKAGE : 2000PCS / REEL. |
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xzmok54w-12000pcs1/10dutyxdsa1278 | |
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Contextual Info: XZBBA67W Part Number: 4.0x4.0mm RIGHT ANGLED SURFACE MOUNT LED LAMP PRELIMINARY SPEC Features DSINGLE COLOR. DSUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. DAVAILABLE ON TAPE AND REEL. DIDEAL FOR BACKLIGHTING. DPACKAGE : 500PCS / REEL. DMOISTURE SENSITIVITY LEVEL : LEVEL 4. |
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DPDD64MX16XCY8Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 1 Gigabit CMOS DDR SDRAM DPDD64MX16XCY8 DESCRIPTION: DuraStack uses DPAC's innovative technology patent pending to stack memory devices with a direct lead-on-lead, creating a metallurgical bond. As no substrate interface material is required, the length and width of the stack is comparable to a TSOP type-II |
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dpdd64mx16xcy8mo-23830a263-00 | |
54LVTH62245Contextual Info: 54LVTH162245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS DPACI General Description Features • Mixed-mode signal operation. 5V input/output with 3.3V supply . Total dose hardness:Typical 100 krad (Si), depending upon space environment A-port outputs have equivalent 22 ohm series |
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54lvth16224516-bit54lvth162d54lvth62245 | |
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Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM |
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dpdd32mx4rsay5128mb53a001-0030a222-00 | |
DPAC TechnologiesContextual Info: DPAC TECHNOLOGIES DPAC TECHNOLOGIES ACH2-AT-DP010 http://www.dpactech.com DPAC TECHNOLOGIES http://www.dpactech.com |
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ach2-at-dp010dpac technologies | |
DP006Contextual Info: ACH2-AT-DP006 DWG. # ACH2-AT-DP006 DPAC TECHNOLOGIES http://www.dpactech.com |
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Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM |
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dpdd32mx4rsay5128mb53a001-0030a222-00 | |
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Contextual Info: Part Number: XRP1LUR103M RIGHT ANGLE LED INDICATOR PRELIMINARY SPEC Features DI.C. COMPATIBLE DBLACK CASE ENHANCES CONTRAST RATIO DHOUSING MATERIAL:PPA DHIGH TEMPERATURE RESISTANT HOUSING DPACKAGE: 500PCS / REEL . DRoHS COMPLIANT. Notes: 1. All dimensions are in millimeters inches . |
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xrp1lur103m500pcsxdsa9015 | |
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Contextual Info: XZMOK55W-3 part number: www.SunLED.com 3.2x1.6mm SMD CHIP LED LAMP Features D3.2mmx1.6mm SMT LED,1.8mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DPACKAGE : 2000PCS / REEL. Notes: 1. All dimensions are in millimeters inches . |
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xzmok55w-32000pcs1/10dutyxdsa1362 | |
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Contextual Info: XZUB50W-1 part number: www.SunLED.com 3.0x2.0mm SMD CHIP LED LAMP Features D3.0mmx2.0mm SMT LED,1.3mm THICKNESS. DLOW POWER CONSUMPTION. DWIDE VIEWING ANGLE. DIDEAL FOR BACKLIGHT AND INDICATOR. DVARIOUS COLORS AND LENS TYPES AVAILABLE. DPACKAGE : 2000PCS / REEL. |
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xzub50w-12000pcs1/10dutyxdsa1500 | |
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Contextual Info: 54LVTH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS DPACI General Description Features • • • • • • • • • • Mixed-mode signal operation. 5V input/output with 3.3V supply . Total dose hardness:Typical 100 krad (Si), depending upon space environment |
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54lvth16224416-bit | |