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DP5Z2MK16PY Datasheets (1)

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DPAC Technologies

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
DP5Z2MK16PY		DPAC Technologies	32 MB Flash EePROM (2mx16)	Original	PDF	4.47MB	21

DP5Z2MK16PY Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
DP5Z2MK16PA3 Abstract: DP5Z2MK16PH3 DP5Z2MK16PI3 DP5Z2MK16PJ3 DP5Z2MK16PY Contextual Info: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2MK16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2MK16n3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing	Original	2mx16 200ns 30a161-02 dp5z2mk16pn3 +9dp5z2mk16n3 50-pin 32-megabits dp5z2mk16py 30a161-32 dp5z2mk16pa3 dp5z2mk16ph3 dp5z2mk16pi3 dp5z2mk16pj3	PDF

Catalog Datasheet

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DP5Z2MK16PA3

Abstract: DP5Z2MK16PH3 DP5Z2MK16PI3 DP5Z2MK16PJ3 DP5Z2MK16PY
Contextual Info: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2MK16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2MK16n3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing

Original

2mx16 200ns 30a161-02 dp5z2mk16pn3 +9

PDF