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Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA
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dm941226aadm941230agds2502 |
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dallas date code ds1230
Abstract: 25091 e8 sot223 24446
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC
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ds1621ds1869dk815282aabdj824247aba+9dm846764aads2502ds87c520dn901118aabdk935356aabdallas date code ds123025091e8 sot22324446
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TI date code
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG
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dm941230agdm941226aads2502ti date code |
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DALLAS DS80C320
Abstract: 25863
Contextual Info: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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ds1232lds1232dk933191aajhrs87c520+6ds87c520de013425aadj-std-02030c/60dallas ds80c32025863
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DS-1000
Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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ds1000m-100ds1000dh927108ajcj-std-020+530c/60ds-1000ds1302 die revisiondh02025409
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dallas date code ds1230
Abstract: dallas ds1230 25919 DS1230
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:
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ds1621de940040aacds5002ds87c520+9dm925587aafdk935356aabdk933191aajde952427aadde014522adbdallas date code ds1230dallas ds123025919ds1230
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dallas date code ds1230
Abstract: dallas date code dallas ds1230 code 25807
Contextual Info: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K
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ds5002ds87c520dm925587aafdn901118aab+9dk935356aabj-std-020dm929359abds1232ds1233dallas date code ds1230dallas date codedallas ds1230code 25807
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74 HTC 00
Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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ds1000m-100ds1000dh927108ajcdk935356aab+6j-std-02030c/6074 htc 0074 htc 08ds1302 die revisionhyundai 9944
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