DIP400 Search Results

KM611001J

Abstract: KM611001 KM611001-20 KM611001-25 KM611001-35
Contextual Info: KM611001 CMOS SRAM 1M x lB it High-Speed CMOS Static RAM FEATURES GENERAL DESCRIPTION • Fast Access Tim e 20,25,35 ns Max. The KM611001 is a 1,048,576-bit high-speed Static Random Access Memory organized as 1.048,576 words by 1 bits. • Low Power Dissipation

DIP40

Abstract: DIP-40 pc 525
Contextual Info: 2.000" 0.525" 0.025" 0.163" 0.700" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

Contextual Info: Top View 2.000" 1 0.582" 0.700" 0.297" Side View 0.173" 2 0.018" Dia. Typ. 0.300" 3 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. .

Contextual Info: 1 Substrate: 0.0625"±0.007" Fr4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" Gold over 50µ" Nickel min. . 0.300" Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact material- Beryllium copper; contact finish

Contextual Info: _ F U JIT S U _ LTD - T - ^ G 53E j> m 3 7 4 ^ 751, 0Q 033ED bT7 - í 3 ~ 7 ~ ^ • F C A J ^ November 1990 Edition 1.0 FUJITSU DATA SHEET '■ MBM27C4096-12/-15/-20 CMOS 4M-BIT UV EPROM CMOS 4,194,304-BIT UV ERASABLE READ ONLY MEMORY The Fujitsu MBM27C4096 EPROM if * high speed read-only Hatic memory that ¡> UV-«rasable

Contextual Info: Top View 2.000" 1 0.800" Side View 0.297" 0.173" 3 2 0.018" Dia. 0.700" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. .

R50-E2Y2-24

Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Contextual Info: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.

Contextual Info: 0.600" 1 Substrate: 0.0625"±0.007" Fr4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" Gold over 50µ" Nickel min. . 3 Top View Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact material- Beryllium copper; contact finish

FR4 substrate

Abstract: PLCC68
Contextual Info: 1.100" Top View 2.000" dashed perimeter lines indicate potentially required changes. 0.600" Side View 0.250" 0.127" 0.018" Substrate: FR4/G10, 0.0625"±0.007" thick. Pins: Brass Alloy 360, 1/2H ; finish: 10µ" Gold over 100/150µ" Nickel DC-PLCC68/DIP40-01 Drawing

DIP36

Abstract: SO42D
Contextual Info: 0.80mm pitch T X L Y 9.25mm 13.46mm [0.364"] [0.530"] 0.80mm pitch 0.48mm [0.019"] Top View 17.78mm [0.700"] 1 6.35mm [0.250"] 0.46mm dia. [0.018"] 2 Side View 3 15.24mm [0.600"] 3.19mm [0.126"] End View Bottom View 2.54mm [0.100"] SOIC Package Dimensions

DIP36

Abstract: DIP44-02 DIP36-01
Contextual Info: 0.80mm pitch T X L Y 9.25mm 13.46mm [0.364"] [0.530"] 0.80mm pitch 0.48mm [0.019"] Top View 17.78mm [0.700"] 1 6.35mm [0.250"] 0.46mm dia. [0.018"] 2 Side View 3 7.62mm [0.300"] 3.19mm [0.126"] End View 2.54mm [0.100"] Bottom View SOIC Package Dimensions Part Number