DIP28- 600 Search Results
DIP28- 600 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
dip28pContextual Info: DIP28-P-600-2.54 Unit nn Jul.2000 |
OCR Scan |
dip28-p-600-2dip28p | |
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Contextual Info: DIP28-P-600-2.54 Unit: m Jul,2000 |
OCR Scan |
dip28-p-600-2 | |
DIP28
Abstract: dip-28 DIP28- 600 sot117 600MIL
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Original |
dip28ot117-1dip-28dip28- 600+2 | |
DIP28
Abstract: DIP28- 600
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Original |
dip28ot117-2dip28- 600 | |
DIP28
Abstract: dip-28
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Original |
dip28ot117-2dip-28 | |
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Contextual Info: DIP28-C-600-2.54 15 1 14 15.11±0.25 28 INDEX MARK 1.27TYP. 15.24 5.10MAX. 2.80±0.40 35.96MAX. 5 2.54 0.50±0.10 0.25 M 2.54MIN. 1.27TYP. 0.51MIN. SEATING PLANE +0.15 0.25-0.05 |
Original |
dip28-c-600-296max27typ10max+2 | |
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Contextual Info: DIP28-G-600-2.54 15 1 14 14.90MAX. 28 15.24 38.00MAX. 5 0.25 M 5.10MAX. 0.50 0.10 2.54MIN. 2.54 4.10 0.40 1.90TYP. 0.51MIN. 1.30 0.10 SEATING PLANE +0 0.25- .15 0.05 15 0~ |
Original |
dip28-g-600-290max00max10max+3 | |
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Contextual Info: DIP28-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.30 TYP. 2/Dec. 11, 1996 |
Original |
dip28-p-600-2 | |
600mil
Abstract: DIP28
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Original |
28pindip28600miled-7303a+1 | |
IS2473
Abstract: Isolation Timing Circuits
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OCR Scan |
ba7107ba7107fba7107sdip28+2 | |
DIP28 packageContextual Info: DIP28-P-600-2.54 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook. |
Original |
dip28-p-600-2dip28 package | |
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Contextual Info: Package outline DIP28: plastic dual in-line package; 28 leads 600 mil SOT117-1 ME seating plane D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions) UNIT A max. |
Original |
dip28ot117-1051g05mo-015+1 | |
28P4
Abstract: JEDEC 600Mil dip "lead material" DIP
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Original |
dip28-p-600-228pin600mil28p4+2 | |
sot117Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) |
Original |
dip28ot117-2ms-011absot117 | |
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DIP28 package
Abstract: SC-510-28 DIP28
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Original |
dip28ot117-1051g05mo-015+2 | |
DIP28
Abstract: MS-011
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Original |
dip28ot117-2051g06ms-011+1 | |
28P4Contextual Info: 28P4 Plastic 28pin 600mil DIP Lead Material Alloy 42 28 15 1 14 c Weight g 3.8 e1 JEDEC Code – E EIAJ Package Code DIP28-P-600-2.54 D A A2 Symbol L A1 SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51 – |
Original |
28pin600mildip28-p-600-228p4 | |
015AH
Abstract: 015-AH
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Original |
dip28ot117-1051g05mo-015ah+2 | |
051G05
Abstract: DIP28
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Original |
dip28ot117-1051g05mo-015+1 | |
dip28pContextual Info: DIP28-P-600-2.54 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 4.30 TYP. 2 版/96.12.11 |
Original |
dip28-p-600-2dip28p | |
DIP28
Abstract: DIP-28 dip28 600mil package
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Original |
28pindip28600miled-7303a+3 | |
TEA7605SP
Abstract: TEA7105 TEA5170 display driver dip16 M5450B7 TEA2164 BATWING dual npn 500ma M5480 EF9369
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OCR Scan |
2st2000tda4601/btea2018atea2019+13 | |
LC35256DM-70 equivalent
Abstract: SOP28D DIP28 DIP28- 600 LC35256DM-70 LC3564B-70 LC3564S-10 SOP32 Package LC3564B-10 sanyo lc35256fm-70u
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Original |
enn6511alc3564s-10dip28lc3564b-70+10 | |
64X16 led matrix
Abstract: TDA8172A 12v 400W AUDIO AMPLIFIER TEA2037 tda2824s TDA8214A CQFP-100 12v 40w tda2040 amplifier circuit tda2030 CQFP100
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OCR Scan |
et9400ef6801/04/05cb12000isb12000+15 | |