SOT117 Search Results
SOT117 Datasheets (21)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SOT117-1 |
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Dip28: Plastic Dual In-line Package 28 Leads (600 Mil) | Original | 10.42KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1172-1 |
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Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad | Original | 221.98KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1172-2 |
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Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad | Original | 222.07KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1172-2_118 |
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HTSSOP28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 | Original | 188.77KB | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1172-3 |
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Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad | Original | 365.82KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1173-1 |
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Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based | Original | 217.68KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1174-1 |
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Plastic, extremely thin quad flat package; no leads 12 terminals | Original | 215.05KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1174-1 |
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Footprint for reflow soldering SOT1174-1 | Original | 219.82KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1174-1 |
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SOT1174 _T1_ packing info 12NC ending 115 | Original | 130.86KB | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1174-1_115 |
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Standard product orientation 12NC ending 115 | Original | 86.33KB | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1175-1 |
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Plastic small outline package; 7 leads; body width 3.9 mm | Original | 218.33KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1176-1 |
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Reflow soldering footprint1176-1 | Original | 324.77KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1176-1 |
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Plastic extremely thin small outline package; no leads; 10 terminals | Original | 211.48KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1177-1 |
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Plastic extremely thin small outline package; no leads; 10 terminals | Original | 211.38KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SOT1178-1 |
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Plastic extremely thin small outline package; no leads; 9 terminals | Original | 211.24KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1178-1 |
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Footprint for reflow soldering SOT1178-1 | Original | 310.99KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1179-1 |
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Footprint for reflow soldering SOT1179-1 | Original | 435.74KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1179-1 |
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Plastic thermal enhanced very thin small outline package; no leads; 12 terminals | Original | 212.01KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1179-1_135 |
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HVSON12; reel pack; standard product orientation; 12NCending 135 | Original | 312.39KB | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOT1179-2 |
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Plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm | Original | 340.11KB | 1 |
SOT117 Price and Stock
Nexperia NXS0104GU12XTranslation - Voltage Levels SOT1174-1 DUAL SUPPLY TRANS |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NXS0104GU12X | Reel | 12,000 | 4,000 |
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Buy Now | |||||
Nexperia PESD4USB3UCTBR-QZESD Protection Diodes / TVS Diodes ESD 3.3V UNI |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PESD4USB3UCTBR-QZ | Reel | 5,000 | 5,000 |
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Buy Now | |||||
Nexperia NXB0104GU12XTranslation - Voltage Levels SOT1174-1 DUAL SUPPLY TRANS |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NXB0104GU12X | Reel | 4,000 | 4,000 |
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Buy Now | |||||
Nexperia PUSB3FR4ZESD Protection Diodes / TVS Diodes ESD 3.3V UNI |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PUSB3FR4Z | Reel | 5,000 |
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Buy Now | ||||||
Nexperia PESD4USB5U-TBSXESD Protection Diodes / TVS Diodes ESD 5V UNI |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PESD4USB5U-TBSX | Reel | 8,000 |
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Buy Now |
SOT117 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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HVSON12Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-1 Gx D 0.105 P C SPx nSPx SPy Hy Gy SLy nSPy By Ay SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit |
Original |
HVSON12 OT1179-1 sot1179-1 | |
Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU 11x 0.32 CU (1×) 0.45 (1×) 2.55 1 CU 2.05 2.3 CU 0.4 (7×) 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper |
Original |
XQFN12 OT1174-1 sot1174-1 | |
Contextual Info: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w |
Original |
HTSSOP28: OT1172-2 MO-153 sot1172-2 | |
Contextual Info: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.0 x 1.7 x 0.5 mm SOT1177-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L1 k L 10 5 1 Dimensions Unit 1 |
Original |
XSON10: OT1177-1 sot1177-1 | |
Contextual Info: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-2 X A B D A E A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L K Eh 12 |
Original |
HVSON12: OT1179-2 MO-229 sot1179-2 | |
Contextual Info: SOT1174-1 Standard product orientation 12NC ending 115 Rev. 01 — 18 Oct 2010 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1174 115 180 x 8 |
Original |
OT1174-1 OT1174 OT1174 | |
Contextual Info: Package outline XQFN12: plastic, extremely thin quad flat package; no leads; 12 terminals; body 1.70 x 2.00 x 0.50 mm SOT1174-1 X B D A terminal 1 index area E A A1 A3 detail X ∅v ∅w b 5 C C A B C y1 C y 7 e1 e 1 11 terminal 1 index area L1 L 1 2 mm scale |
Original |
XQFN12: OT1174-1 MO-288 sot1174-1 | |
DIP28
Abstract: dip-28 DIP28- 600 sot117 600MIL
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Original |
DIP28: OT117-1 DIP28 dip-28 DIP28- 600 sot117 600MIL | |
sot117Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) |
Original |
DIP28: OT117-2 OT117-2 MS-011AB sot117 | |
MS-011
Abstract: DIP28
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Original |
DIP28: OT117-2 051G06 MS-011 SC-510-28 MS-011 DIP28 | |
DIP28 package
Abstract: SC-510-28 DIP28
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Original |
DIP28: OT117-1 051G05 MO-015 SC-510-28 DIP28 package SC-510-28 DIP28 | |
sot1178Contextual Info: Package outline Footprint information for reflow soldering of XSON9 package SOT1178-1 Hx C Hy Ay By 0.025 D P 0.025 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
OT1178-1 sot1178-1 sot1178 | |
sot1176
Abstract: 02K1
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Original |
XSON10: OT1176-1 OT1176-1 sot1176-1 sot1176 02K1 | |
051G05
Abstract: DIP28
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Original |
DIP28: OT117-1 051G05 MO-015 SC-510-28 051G05 DIP28 | |
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HTSSOP28Contextual Info: SOT1172-2 HTSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 12 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal |
Original |
OT1172-2 HTSSOP28; 001aak603 OT1172 HTSSOP28 | |
Contextual Info: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-1 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w |
Original |
HTSSOP28: OT1172-1 MO-153 sot1172-1 | |
stencil
Abstract: XSON10
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Original |
XSON10 OT1176-1 sot1176-1 stencil | |
DIP28
Abstract: DIP28- 600
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Original |
DIP28: OT117-2 DIP28 DIP28- 600 | |
Contextual Info: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-1 X A B D E A A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L Eh 12 7 |
Original |
HVSON12: OT1179-1 MO-229 sot1179-1 | |
Contextual Info: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-3 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 e bp 14 |
Original |
HTSSOP28: OT1172-3 MO-153 sot1172-3 | |
Contextual Info: Package outline SO7: plastic small outline package; 7 leads; body width 3.9 mm SOT1175-1 D A E X c HE y v A Z 7 5 Q A2 A A1 A3 θ pin 1 index Lp L 1 4 e detail X w bp 2.5 5 mm scale Dimensions Unit mm A A1 A2 A3 bp c max 1.75 0.250 1.45 0.49 0.25 nom 0.175 1.35 0.25 0.40 0.20 |
Original |
OT1175-1 sot1175-1 | |
sot1178Contextual Info: Package outline XSON9: plastic extremely thin small outline package; no leads 9 terminals; body 1 x 2.1 x 0.5 mm SOT1178-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 3 5 C C A B C v w b y1 C y L k 9 6 0.5 Dimensions Unit 1 |
Original |
OT1178-1 OT1178-1 sot1178-1 sot1178 | |
Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-2 Gx D 0.105 P C nSPx SPx nSPy Hy Gy SLy SPy By Ay SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By |
Original |
HVSON12 OT1179-2 sot1179-2 | |
Contextual Info: Package outline HVQFN64R: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 0.8 mm A B D SOT1173-1 terminal 1 index area E A detail X e1 e L1 L 1/2 e 17 32 C C A B C v w b y y1 C 33 16 e e2 Eh 1/2 e 1 terminal 1 |
Original |
HVQFN64R: OT1173-1 sot1173-1 |