DIP PACKAGE Search Results

footprint 24PIN DIP

Abstract: 1400E AF 239 TQFP 100 PACKAGE footprint dip Package dimension 100L J-10 J-12 J-13 TQFP 80 PACKAGE footprint
Contextual Info: DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information. J-4 DIP Packages

DIP-14A

Abstract: DIP-16B
Contextual Info: MITSUMI Packages Packages Units : mm DIP-14A DIP-16A DIP-16B

DIP-8C

Abstract: DIP16B Package DIP-8B mitsumi DIP-28C DIP16A Package
Contextual Info: Package MITSUMI Packages DIP Series Units : mm DIP-8B DIP-8C DIP-14A 0.25 +0.1 -0.05 DIP-8A 9.3±0.3 5 0~15° 1 7.85 6.35±0.2 8 4 (3.3) 1.03 +0.3 -0.1 0.48±0.1 7.1±0.5 3.9±0.3 2.54 0.25 1.58 +0.3 -0.1 1.14 max. DIP-16A DIP-16B Package MITSUMI Packages (DIP Series)

DIP-18A

Abstract: DIP-28A 18-A
Contextual Info: MITSUMI Packages Packages Units : mm DIP-18A DIP-28A DIP-28B

LA7520

Abstract: LA7520N 7520N
Contextual Info: IC S FOR TV USE • ICs fo r V IF /S IF Use : Suitable @ : Most suitable Functions Type No. Package VIF VIF Amp LA7509 DET SIF Video Amp DIP-16 • LA7520 DIP-30S LA7520N LA7530N DIP-20S LA7533 LA7535 DIP-20S LA7545 DIP-16 LA7555 DIP-24S LA7570 DIP-24S •«LA7575

TQFP 100 PACKAGE footprint

Abstract: footprint 24PIN DIP 100L J-10 J-12 J-13 footprint dip 16 AD #0953
Contextual Info: ICS Standard Package Dimensions J-1 DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information.

DS1425L-F5

Abstract: ds1480s F5 sot223 DS1868 DS75U ds1642-150 DS1669SN-10 DS1220Y-200IND ds1386-8-150 DS1251W-120
Contextual Info: DEVICE DS0621 DS1000 DS1000-IND DS1004 DS1005 DS1007 DS1010 DS1013 DS1020 PACKAGE TYPE OPERATING TEMPERATURORDERING RANGE CELSIUS NUMBER Software 8-Pin DIP 8-Pin SOIC 8-Pin SOIC T&R 8-Pin DIP 8-Pin SOIC 8-Pin SOIC T&R 8-Pin DIP 8-Pin DIP 8-Pin DIP 8-Pin DIP

P41 transistor

Abstract: 300MIL P29 Package 600-MIL P15 PACKAGE DIAGRAM P15 Package transistor p11 22-LEAD
Contextual Info: Package Diagram Plastic Dual-In-Line Packages 16-Lead 300-Mil Molded DIP P1 18-Lead (300-Mil) Molded DIP P3 20-Lead (300-Mil) Molded DIP P5 1 Package Diagram 22-Lead (400-Mil) Molded DIP P7 22-Lead (300-Mil) Molded DIP P9 24-Lead (600-Mil) Molded DIP P11

MC7524L

Abstract: MC7525L MC5524 MC5524L MC5525 MC5525L MC7524 MC7524P MC7525 MC7525P
Contextual Info: ORDERING INFORMATION Device Temperature Range Package -5 5°C to + 1 25°C —55°C to + 1 25°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C Ceramic DIP Ceramic DIP Ceramic DIP Plastic DIP Ceramic DIP Plastic DIP MC5524L MC5525L MC7524L MC7524P

LT 5252

Abstract: C5525 MC7524P C7525 mc5524 C7524 MC7524
Contextual Info: ORDERING INFORMATION Device Temperature Range Package -5 5°C to +125°C -5 5°C to + 1 25°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C Ceramic DIP Ceramic DIP Ceramic DIP Plastic DIP Ceramic DIP Plastic DIP MC5524L MC5525L MC7524L MC7524P

SMA4032

Abstract: UDx2559 sma4033 darlington UDx2543 18A700 234c WR-234 UDN2540
Contextual Info: A Sanken Company Comparison of Quad Power Drivers Basic Part Number ULN2065 Avail. Packages DIP, SOIC Avail. Temp. °C -20 to +85 ULN2068 DIP, SOIC -20 to +85 Darlington UDN2540 A2540 UDx2543 DIP SOIC DIP, PLCC -20 to +85 Darlington saturated UDx2547 DIP, PLCC

Contextual Info: DUAL IN-LINE PACKAGE 22 PIN CERAMIC DIP-22C-C02 EIAJ code : ∗DIP022-G-0400-1 22-pin ceramic DIP Lead pitch 100mil Row spacing 400mil Sealing method Cerdip DIP-22C-C02 22-pin ceramic DIP (DIP-22C-C02) +0.61 27.18 –0.20 +.024 1.070 –.008 R0.64(.025)

D1604

Contextual Info: DUAL IN-LINE PACKAGE 16 PIN PLASTIC DIP-16P-M05 EIAJ code : ∗DIP016-P-0300-3 Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold Package width 283mil 16-pin plastic DIP DIP-16P-M05 16-pin plastic DIP (DIP-16P-M05) +0.20 19.45 –0.30 +.008

Polyvaricon

Abstract: fm variable capacitor mw-osc SNY-074-2001 HW-6215 IC LA1810 FM stereo MPX Decoder YT-30224 LA4525 T5Y7
Contextual Info: S AN Y O SEMICONDUCTOR r a P ü S Z Î S a ’I C New P ro d u ct t yoe No * Under Developm ent • Package LA1805 LA1806 DIP-24S DIP-24S LA1810 LA1811 DIP-24S DIP-24S LA1816 DIP-24S MFP-24S LA1816M CORP F NC • • MPXj DIP-24S LA1831 ©LA1831M LA1851N

Fujitsu DIP 48-pin

Abstract: D4800 48 pin d480
Contextual Info: DUAL IN-LINE PACKAGE 48 PIN CERAMIC DIP-48C-A01 EIAJ code : ∗DIP048-C-0600-1 48-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-48C-A01 48-pin ceramic DIP (DIP-48C-A01) 60.96±0.64 (2.400±.025) R1.27(.050) REF 15.11±0.25

DIP028-P-0300-1

Contextual Info: SKINNY DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M04 EIAJ code : ∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-28P-M04 28-pin plastic SK-DIP (DIP-28P-M04) +0.20 35.36 –0.30 1.392 +.008 –.012

d5200

Abstract: 52-PIN
Contextual Info: SHRINK DUAL IN-LINE PACKAGE 52 PIN PLASTIC DIP-52P-M01 EIAJ code : SDIP052-P-0600-1 52-pin plastic SH-DIP Lead pitch 70mil Row spacing 600mil Sealing method Plastic mold DIP-52P-M01 52-pin plastic SH-DIP (DIP-52P-M01) +0.20 47.25 –0.30 +.008 1.860 –.012

Contextual Info: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A07 EIAJ code : ∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP (DIP-24C-A07) 30.48±0.36 (1.200±.014) R1.27(.050) REF +0.25

Contextual Info: DUAL IN-LINE PACKAGE 14 PIN CERAMIC DIP-14C-C04 EIAJ code : ∗DIP014-G-0300-4 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 14-pin ceramic DIP DIP-14C-C04 14-pin ceramic DIP (DIP-14C-C04) +0.71 19.30 –0.15 .760 +.028 –.006 R0.64(.025) REF

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A07 EIAJ code : ∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP (DIP-28C-A07) 35.36±0.36 (1.400±.014) 1.27(.050) REF 15.11±0.25

DIP032-P-0600-1

Contextual Info: DUAL IN-LINE PACKAGE 32 PIN PLASTIC DIP-32P-M01 EIAJ code : ∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP (DIP-32P-M01) +0.20 40.44 –0.30 +.008 1.592 –.012 INDEX-1

Contextual Info: DUAL IN-LINE PACKAGE 18 PIN CERAMIC DIP-18C-C01 EIAJ code : ∗DIP018-G-0300-2 18-pin ceramic DIP Lead pitch 100mil Row spacing 300mil Sealing method Cerdip DIP-18C-C01 18-pin ceramic DIP (DIP-18C-C01) +0.56 22.61–0.20 +.022 .890 –.008 R0.64(.025) REF

D1801

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC DIP-18P-M04 EIAJ code :∗DIP018-P-0300-3 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M04 18-pin plastic DIP (DIP-18P-M04) +0.20 22.05 –0.30

DIP-18P-M03

Abstract: D18011
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC DIP-18P-M03 EIAJ code :∗DIP018-P-0300-2 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M03 18-pin plastic DIP (DIP-18P-M03) +0.20 22.05 –0.30