DIP 7 Search Results

Contextual Info: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

LA7520

Abstract: LA7520N 7520N
Contextual Info: IC S FOR TV USE • ICs fo r V IF /S IF Use : Suitable @ : Most suitable Functions Type No. Package VIF VIF Amp LA7509 DET SIF Video Amp DIP-16 • LA7520 DIP-30S LA7520N LA7530N DIP-20S LA7533 LA7535 DIP-20S LA7545 DIP-16 LA7555 DIP-24S LA7570 DIP-24S •«LA7575

SPST Rocker DIP Switches

Abstract: 76RSB04ST rocker switch diagram 76PSB
Contextual Info: Thru-Hole DIP Switch SERIES 76 FEATURES • Raised and Recessed, Rocker and PIANO-DIP Styles • Sealed Base Standard • Spring and Ball Contact • Top Tape Seal Option SPST Rocker DIP Switches 76 Th DIMENSIONS In inches and millimeters PIANO-DIP® Rocker and Recessed Rocker

EIA-364-56A

Abstract: 436860-7 Shunts 435704-7
Contextual Info: DIP Shunts DIP Shunts A DIP shunts are available in 4- through 12-position configurations. All shunts can be supplied either unprogrammed or preprogrammed. DIP Shunts Alcoswitch DIP Shunts are a highly reliable, low cost means of manually programming various types

Contextual Info: Thru-Hole DIP Switches SERIES 76 FEATURES Raised and Recessed, Rocker and PIANO-DIP Styles Sealed Base Standard Spring and Ball Contact Top Tape Seal Option SPST Rocker DIMENSIONS In inches and millimeters Side Actuated PIANO-DIP1'1 PIANO-DIP- B = .156 ±.010

la7123

Abstract: LA7124 LB1645 LB1806 capstan driver fdd motor driver LB1684
Contextual Info: s A m Supply Voltage V Functions Use D rum FG amp, Capstan FG amp, C TL amp D rum PG amp, OP amp x 2 LA7116 DIP-24S Servo interface LA7123 DIP-30S Servo interface LA7124 DIP-30S Servo interface LC7412 DIP-30S Servo digital control LC7413 DIP-42S Servo digital control

Contextual Info: Contents: Surface Mount and Thru-Hole DIP Switches OPEN CLOSED SURFACE MOUNT SWITCHES • Standard DIP Package Outline Includes PIANO-DIP •Tactile Feedback, Board Mount Switches THRU-HOLE DIP SWITCHES • Consistent High Contact Pressure With Spring and Ball

d flip flop

Abstract: DIP packaged quad nor flip flop flip flop counter multiplexer comparator quad video line driver 74ACT00 74ACT02 74ACT04 74ACT08
Contextual Info: Logic Products by Family FACT ACT Products Logic Product Function Product Description Package Voltage Node 74ACT00 Gate Quad 2-Input NAND Gate DIP SOIC SOP TSSOP 5 74ACT02 Gate Quad 2-Input NOR Gate DIP SOIC TSSOP 5 74ACT04 Inverter Hex Inverter DIP SOIC

DIP-42P-M02

Abstract: SDIP042-P-0600-1 Fujitsu 42 pin fujitsu DIP-42
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 42 PIN PLASTIC To Top / Package Lineup / Package Index DIP-42P-M02 EIAJ code : SDIP042-P-0600-1 42-pin plastic SH-DIP Lead pitch 70 mil Row spacing 600 mil Sealing method Plastic mold DIP-42P-M02

2 pin dip switch

Abstract: DIP12 X131C
Contextual Info: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS FEATURES • High resistance option available

Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 40 PIN PLASTIC To Top / Package Lineup / Package Index DIP-40P-M03 EIAJ code :∗SDIP040-P-0600-1 40-pin plastic SH-DIP Lead pitch 70 mil Row spacing 600 mil Sealing method Plastic mold DIP-40P-M03

48-pin

Abstract: fujitsu d480
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index DIP-48P-M01 EIAJ code : SDIP048-P-0600-1 48-pin plastic SH-DIP Lead pitch 70 mil Row spacing 600 mil Sealing method Plastic mold DIP-48P-M01

SDIP064-C-0750-1

Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index DIP-64C-A02 EIAJ code : SDIP064-C-0750-1 64-pin ceramic SH-DIP Lead pitch 70 mil Row spacing 750 mil Sealing method Metal seal DIP-64C-A02

CTS 206 124

Abstract: CTS 206 SPST mechanical switch 206-124 206 transistor specification sheet top marking 293 204D 213B 206-122ST
Contextual Info: Series 206/208 DIP Multifunctional through hole DIP switches Features Optimized Mechanical Features • Series 206 SPST, SPDT, DPST, DPDT, 3PST or 4PST circuitry choices • Series 206 and Series 208 SPST available in 2 through 10 and 12 positions • Standard 2.54mm .100" x 7.62mm (.300") DIP

smd reed relay

Abstract: DIP12
Contextual Info: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configurations

28-pin SOJ SRAM

Abstract: clcc 32 socket TSOP dip adapter 28-pin SOJ SRAM 512k AK28D300-QSOP AK28D300-SOJ AK28D300-TSOP AK28D-LLP DA10 DIP600
Contextual Info: Accutek Microcircuit Corporation 28 Pin to 32 Pin DIP Adapters DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

fujitsu

Abstract: 20p 2.54 DIP-20P-M01
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M01 EIAJ code :∗DIP020-P-0300-1 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M01 20-pin plastic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN CERAMIC To Top / Package Lineup / Package Index DIP-14C-C04 EIAJ code :∗DIP014-G-0300-4 14-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-14C-C04 14-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN PLASTIC To Top / Package Lineup / Package Index DIP-14P-M02 EIAJ code :∗DIP014-P-0300-1 14-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-14P-M02 14-pin plastic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP

fujitsu

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M04 EIAJ code :∗DIP018-P-0300-3 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M04 18-pin plastic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN PLASTIC To Top / Package Lineup / Package Index DIP-16P-M03 EIAJ code :∗DIP016-P-0300-1 16-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-16P-M03 16-pin plastic DIP

18-Pin

Abstract: d1801 DUAL transistor M03 DIP-18P-M03 D18011
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M03 EIAJ code :∗DIP018-P-0300-2 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M03 18-pin plastic DIP

18-Pin

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN CERAMIC To Top / Package Lineup / Package Index DIP-18C-C01 EIAJ code :∗DIP018-G-0300-2 18-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-18C-C01 18-pin ceramic DIP