DELAMINATION Search Results

Contextual Info: application brief AB13 Soldering SuperFlux LEDs SuperFlux LEDs HPWx xxxx Standard Part Numbers Caution is recommended with the preheat conditions to ensure that the LED lamps are not damaged due to prestressing. Prestress damage can result in cracks and/or delamination of structures within the device.

CSDA1BA

Abstract: Honeywell CSDA1BC CSDB1CC
Contextual Info: Installation Instructions for CS Series Digital Current Detectors PK 87893 SOLDERING INSTRUCTIONS CLEANING Hand Soldering - Use 60/40 rosin core solder, employing a 399°C 750°F controlled temperature, 1/8" chisel tip soldering iron. To avoid delamination of

Contextual Info: F -2 0 2 -1 m sarnle c GFZ— 2 0 -0 1 -G -1 0 -A D c SOLDERLESS INTERFACES Board Stacking Modular-to-Board LGA Interfaces Solderless Interconnects No solder pad delamination Minimizes Coefficient of Thermal Expansion CTE issues No solder joint reliability

JEDEC J-STD-033b.1

Abstract: ipc-JEDEC J-STD-033 JEDEC J-STD-033b J-STD-020D J-STD-033 Drypacked Devices AN-2029
Contextual Info: National Semiconductor Application Note 2029 Martin Schnepf June 18, 2010 Introduction inside the package can create excessive internal pressure resulting in delamination or even cracked package popcorn effect . NSC’s components that are considered moisture sensitive

Contextual Info: TRUNKING FIXED STATION A N TEN N AS Yägl 'Il I *1 T 872-960 MHz 4-Element Economy Antenna M odels ARA-764 • ASA-767 Typical Patterns Low Cost — innovative laminated construction Durable — RTV sealed with perimeter bonding, edged with neoprene U-channel, resists delamination

TRILITHIC

Abstract: P-TO263-15-1 BTS 7740 G 7741 7740 windscreen wiper P-TO-263-15-1 7741G
Contextual Info: Powe r Key Features: • No bond damage, wire necking, bond lifting, die lifting, delamination after MSL1 at 260°C ■ Green materials - no antimony III Robust Package for OptiMOS BTS 7741G & BTS 7751G Join the TrilithIC Family As a result of recent environmental concerns regarding the use of lead, the

Contextual Info: 4. Reliability and Handling Precautions for Device 1. Maximum Rating To guarantee IC ’s Life time and reliability, maximum rating the rating mentioned in this document means the 'absolute maximum rating' should never be exceeded. The maximum rating value of an IC is determined by structural material and

sdc 603

Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
Contextual Info: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems

Contextual Info: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166I April 2001 – Revised January 2006 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not

Contextual Info: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166H April 2001 – Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not

CD17

Contextual Info: Types CD17, CD18 & CDV18, High-Frequency, Mica Capacitors High-Frequency Capacitors for CATV and RF Applications Types CD17 and CD18 assure controlled, resonancefree performance through 1 GHz. Insertion loss data is typically flat within ±0.1 dB over the entire

ERA monolithic amplifier

Abstract: M109959
Contextual Info: Surface Mount Monolithic Amplifier DC-2 GHz Product Features • DC-2 GHz • Single Voltage Supply • Internally Matched to 50 Ohm • Unconditionally Stable • Low Performance Variation Over Temperature • Transient Protected • Aqueous washable • Protected By US Patent 6,943,629

mcl 49

Abstract: mcl m1 PL-252 body marking MCL MCL49
Contextual Info: Surface Mount Monolithic Amplifier DC-5 GHz Product Features • DC-5 GHz • Output power, 15.8 dBm typ. • Excellent package for heat dissipation, exposed metal bottom • Flat output power to 10 GHz • Aqueous washable • Protected by US Patent 6,943,629

Contextual Info: Surface Mount Monolithic Amplifier DC-4 GHz Product Features • InGaP HBT microwave amplifier • Miniature SOT-89 package • Frequency range, DC to 4 GHz • Output power, 15.8 dBm typ. • Excellent package for heat dissipation, exposed metal bottom

MARKING 4F DBM

Abstract: SOT-89 marking YB
Contextual Info: Surface Mount Monolithic Amplifier DC-4 GHz Product Features • InGaP HBT microwave amplifier • Miniature SOT-89 package • Frequency range, DC to 4 GHz • Output power, 15.3 dBm typ. • Excellent package for heat dissipation, exposed metal bottom

ERA-2

Abstract: MMIC Amplifier Micro-X marking 11
Contextual Info: Drop-In Monolithic Amplifier DC-6 GHz Product Features • DC-6 GHz • Single voltage supply • Internally matched to 50 ohms • Unconditionally stable • Low performance variation over temperature • Transient protected • Protected By US Patent 6,943,629

TMS320

Abstract: TMS320C5000 TMS320VC5501 TMS320VC5502 XDS510 Analog devices catalog 5502 mcbsp
Contextual Info: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
Contextual Info: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1

TMS320VC5501PGF300

Contextual Info: TMS320VC5501 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS206H December 2002 − Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments

Contextual Info: PCS FIXED STATION ANTENNAS Dipole Array Antenna M o d el ASPKM986 Typical Patterns Precision Engineered — solid state feed and cable are laminated between expanded PVC radomes Aesthetically Pleasing — thin profile provides unobtrusive appearance Broadband Perform ance — covers 280 MHz at

Contextual Info: TRUNKING FIXED STATION ANTENNAS 872-960 MHz 4-Element Economy Antenna Models ARA-764 • ASA-767 Typical Patterns: !5 '' 1 •'0 ; ' ‘ / ' - - • ■ / ,/•. 3" "• ARA-764 H-Plane Low Cost — innovative laminated construction D urable — RTV sealed with perimeter bonding, edged

Contextual Info: HLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615, HLMP-C623 T-1¾ Super Ultra-Bright LED Lamps Data Sheet Description Features These non-diffused lamps are designed to produce a bright

Contextual Info: HLMP-DS25/DM25/NS30/NM31 T-1¾ 5 mm , T-1 (3 mm) InGaN LED Lamps Data Sheet Description Features The blue HLMP-DS25 and HLMP-NS30, and green HLMP-DM25 and HLMP-NM31 LEDs are designed in an industry standard T-1¾ and T-1 pack-ages with clear and nondiffused optics.

201203

Abstract: mains isolators
Contextual Info: Finisar Semi-double Stage Isolator Finisar free space isolators offer excellent performance with low insertion loss and high isolation. Our proprietary bonding process, and years of volume manufacturing experience, results in a high reliability record. Bare isolator chips