SOJ2 Search Results

Contextual Info: SOJ26-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.83 TYP. 1/Mar. 21, 2000

SOJ-24

Abstract: SOJ24-P-300-1 HE1324
Contextual Info: 24P0J Plastic 24pin 300mil SOJ EIAJ Package Code SOJ24-P-300-1.27 Weight g 0.68 JEDEC Code – Lead Material Alloy 42 e b2 e1 e1 E HE 13 24 I1 I2 c D Recommended Mount Pad 1 Symbol 12 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters

SOJ28-P-400-1

Contextual Info: 28P0N-A Plastic 28pin 400mil SOJ LOC EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code – Weight(g) Lead Material Alloy 42 e D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e b2 y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters

Contextual Info: 28P0K Plastic 28pin 400mil SOJ EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code MO-061AA Weight g 1.08 Lead Material Alloy 42 e D b2 28 I1 I2 c e1 E HE e1 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2

Contextual Info: 26P0J-B Weight g Lead Material Alloy 42 e b2 14 e1 19 HE 21 E 26 e1 c D Recommended Mount Pad Symbol 1 6 13 8 L A A1 b1 e y I2 JEDEC Code – I1 EIAJ Package Code SOJ26/24-P-300-1.27 Plastic 26pin 300mil SOJ b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2

SOJ28-P

Contextual Info: SOJ28-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.30 TYP. 5/Dec. 5, 1996

SOJ28

Contextual Info: SOJ28/24-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.25 TYP. 5/Dec. 5, 1996

Contextual Info: SOJ28-P-400-1.27 Unit nn Sep.2000

Contextual Info: SOJ26/24-P-300-1.27-3 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5

soj28

Contextual Info: SOJ28/24-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SOJ28-P-300-1

Contextual Info: SOJ28-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 0.80 TYP. 3 版/96.12.5

SOJ28-P

Contextual Info: SOJ28-P-400-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.30 TYP. 5 版/96.12.5

Contextual Info: SOJ28-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SOJ28-P-300-1

Abstract: MAR 749
Contextual Info: 28P0D-A EIAJ Package Code SOJ28-P-300-1.27 Plastic 28pin 300mil SOJ LOC Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 Under Development D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad 14 1 L A A1 b1 e y b SEATING PLANE Symbol A A1 b b1 c D E e e1

PA-SOJ28D-L-V-01

Abstract: PA-SOJ28D-L-V-01W
Contextual Info: 0.198" 0.998" 1 Pin 28 28 0.261" 15 0.400" PA-SOJ28D-L-V-01 Pin 1 0.800" 14 1 0.989" 2 0.187" 0.141" 0.100" typ. Side View 0.050" 0.020"±0.001" dia. 0.165" End View 0.100" 0.193" PA-SOJ28D-L-V-01W 0.507" 28 27 26 24 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5

SOJ28

Contextual Info: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E) 400 mils DESCRIPTION

SOJ26

Contextual Info: SOJ26/20-P-350-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.01 TYP. 5 版/96.12.5

Contextual Info: SOJ26/24-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5

Contextual Info: SOJ26-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数／改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 0.83 TYP. 1 版/00.3.21

Contextual Info: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE DATA BRIEFING 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E)

Contextual Info: SOJ26/20-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5

SOJ28-P-300-1

Contextual Info: SOJ28-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.80 TYP. 3/Dec. 5, 1996

Contextual Info: SOJ26/24-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SOJ28-P-300-1

Contextual Info: 28P0J Plastic 28pin 300mil SOJ EIAJ Package Code SOJ28-P-300-1.27 JEDEC Code – Weight g 0.81 Lead Material Alloy 42 e b2 D e1 28 e1 HE E 15 Recommended Mount Pad Symbol 14 1 L A A1 b1 e I1 I2 c y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters