CS004 Search Results

CS004520

Contextual Info: PRODUCT P/N BY APPD DATE 01 Initial Release ER23486 SC CONNECTOR DESCRIPTION 7005-000-00701Z SC UPC NON-ANGLED SINGLEMODE FUSECONNECT 3MM BLUE CS004518 7005-000-00702Z SC APC ANGLED SINGLEMODE FUSECONNECT 3MM GREEN CS004515 7005-000-00703Z SC UPC NON-ANGLED SINGLEMODE FUSECONNECT 2MM BLUE CS004519

UC3843 spice model

Abstract: UC3843 power supply atx pC817 Spice smps with tl431 and pc817 with UC3843 uc3843 boost pC817* Spice atx power supply schematic uc3843 uc3843 boost current mode control NCP1203 PC817 spice model
Contextual Info: DO NOT PRINT - TRIM AREA Power Conversion Solutions from ON Semiconductor ON Your Way to Designing Efficient Power Supplies. . . Designing world-class power supplies is getting harder. Every year, your customers demand more power from a smaller space at a lower cost. In addition, new regulations are imposing increasingly stringent requirements

MS-029

Abstract: JEDEC Matrix Tray outlines MS-022 copper heatsink prime power 1230 JEDEC standard 033 MS029
Contextual Info: LEADFRAME data sheet MQFP PowerQuad 2 Features: MQFP PowerQuad® 2 Packages: The MQFP PowerQuad® 2 PQ2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through

MO-112

Abstract: MS-022 MS-029 DS250G JEDEC standard 033
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,

MS-029

Abstract: 144 QFP body size amkor
Contextual Info: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit

MO-112

Abstract: MS-029 MATRIX TRAY MS-022 LD240
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced

outline of the heat slug for JEDEC

Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
Contextual Info: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit

LD 337

Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Contextual Info: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material

redux 204

Abstract: V54C365164VCT8PC LTXD e3 mii to hdlc RS-120 DC-DS-0120 MA10 rs120a DC-AN-0120-004 MD1811
Contextual Info: RS-120 Data Sheet Features • 100 Mbps full duplex protocol conversion and bridging • up to100 Mbps MII; 100 Mbps HDLC • MII - HDLC Operating Mode • MII - MII Operating Mode • “drop-in” solution • no external CPU required • no software development required

Contextual Info: FLEXIBLE CONDUIT & FITTINGS FCA200 Flexible Conduit Fittings D1 L1 L2 L3 D3 D2 Lock Nut Specifications: s -ATERIAL5,6 .YLON s #OLOR'REY s 4EMP2ANGE  &TO &  #TO # Mounting Hole D1 Body Claw Nut Features: s #ONNECTSPLASTICCONVOLUTEDCONDUITTOCONTROL