CQFP 240 Search Results

TEA 1732

Abstract: A09 N03
Contextual Info: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package

RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Contextual Info: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note

RTAX1000S

Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Contextual Info: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5

Contextual Info: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.

8N07

Abstract: 030 b03 cn/A/U 237 BG
Contextual Info: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.

2 010 073 007

Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Contextual Info: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a

b09 n03

Abstract: B07 P03
Contextual Info: 1. 6 Pow erPC 604e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 604e C4-CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C 4 - C Q F P P a c k a g e Table 10 provides the pinout listing for the 604e C4-CQFP package.

CQFP 240

Contextual Info: a 240-Lead CQFP Package with Heat Slug Down and Formed Leads QS-240A Dimensions shown in inches and (mm) PIN 1 ID 1.441 (36.60) 1.422 (36.13) SQ 1.404 (35.65) 0.837 (21.25) 0.827 (21.00) SQ 0.817 (20.75) 1.270 (32.25) 1.260 (32.00) SQ 1.250 (31.75) 0.758 (19.25)

CQFP 240

Contextual Info: a 240-Lead CQFP Package with Heat Slug Up and Formed Leads QS-240 Dimensions shown in inches and (mm) 1.441 (36.60) 1.422 (36.13) SQ 1.404 (35.65) PIN 1 ID 1.270 (32.25) 1.260 (32.00) SQ 1.250 (31.75) 1.104 (28.05) 1.094 (27.80) SQ 1.085 (27.55) 240 181

5271SC

Abstract: military mcm 1553 military mcm cpu R4400 RM5271
Contextual Info: Standard Products ACT5271SC Multichip Module Microprocessor with 2MB Secondary Cache www.aeroflex.com/Avionics May 5, 2005 FEATURES ❑ Footprint Compatible with Aeroflex-Plainview original ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack CQFP

DSP56116

Abstract: PB10 PB12 PC10 MDB301 DSP56116 users manual "saturation arithmetic" F1359 dsp56001
Contextual Info: Order this document by DSP56116/D MOTOROLA •SEMICONDUCTOR DSP56116 TECHNICAL DATA Advance Information 16-bit General Purpose Digital Signal Processor Pin Grid Array PGA ^ f Available in an 101 pin ceramic through-hole! package package. through- Ceramic Quad Flat Pack (CQFP)

MO-134AD

Contextual Info: MECHANICAL DATA MCFP028B – JANUARY 1995 – REVISED JUNE 1999 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 SQ 43,56 1,55 Dia 1,45 4 Places 5,50 Tie Bar Width 4,50 39,50 BSC 320 1 241 240 DETAIL ”C” 70,00 BSC

MO-134AD

Contextual Info: MECHANICAL DATA MCQF008B – FEBRUARY 1996 – REVISED JUNE 1999 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 4 Places 5,50 4,50 Tie Bar Width 39,50 BSC 320 1 241 240 DETAIL ”C” Heat Sink

DSP96000

Abstract: DSP56000 DSP56100 DSP56166 DSP56166ROM DSP96002 brand tai hen FE60 marking ha02 Nippon capacitors
Contextual Info: Freescale Semiconductor, Inc. Order this document by DSP56166/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package.

AS8F2M32

Contextual Info: AUSTIN SEMICONDUCTOR, INC. Austin Semiconductor, Inc. FLASH AS8F2M32 FIGURE 1: PIN ASSIGNMENT Top View 2M x 32 FLASH 68 Lead CQFP FLASH MEMORY MODULE AVAILABLE AS MILITARY SPECIFICATIONS • Military Processing (MIL-STD-883C para 1.2.2) • Temperature Range -55C to 125C

MO-134

Contextual Info: MECHANICAL DATA MCQF008A – JANUARY 1997 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 (4 Places) 5,50 4,50 39,50 BSC 320 1 241 240 DETAIL “C” Heatsink 70,00 3,60 3,50 161 160 80 81 DETAIL “B”

CQFP 240

Abstract: f320 MO-134AD
Contextual Info: MECHANICAL DATA MCFP028B – JANUARY 1995 – REVISED JUNE 1999 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 SQ 43,56 1,55 Dia 1,45 4 Places 5,50 Tie Bar Width 4,50 39,50 BSC 320 1 241 240 DETAIL ”C” 70,00 BSC

CQFP 240

Contextual Info: a 240-Lead CQFP Package Mount with Heat Slug Up and Unformed Leads QS-240 Dimensions shown in inches and (mm) 0.665 (16.88) 8 ؋ 0.650 (16.50) 0.635 (16.12) 2.953 (75.00) SQ 1.161 (29.50) BSC 61 120 121 60 61 120 60 121 SEAL RING 2؋ 2.594 (65.90) TOP VIEW

Contextual Info: AUSTIN SEMICONDUCTOR, INC. Austin Semiconductor, Inc. FLASH AS8F2M32 FIGURE 1: PIN ASSIGNMENT Top View 2M x 32 FLASH 68 Lead CQFP FLASH MEMORY MODULE AVAILABLE AS MILITARY SPECIFICATIONS • Military Processing (MIL-STD-883C para 1.2.2) • Temperature Range -55C to 125C

AS8F2M32

Abstract: AS8F2M32QT-90
Contextual Info: AUSTIN SEMICONDUCTOR, INC. Austin Semiconductor, Inc. FLASH AS8F2M32 FIGURE 1: PIN ASSIGNMENT Top View 2M x 32 FLASH 68 Lead CQFP FLASH MEMORY MODULE AVAILABLE AS MILITARY SPECIFICATIONS • Military Processing (MIL-STD-883C para 1.2.2) • Temperature Range -55C to 125C

max3200

Contextual Info: MECHANICAL DATA MCFP028A – JANUARY 1997 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 4 Places 5,50 4,50 39,50 BSC 320 1 241 240 “C” 70,00 3,60 3,50 161 160 80 81 2,60 2,50 “B” 2,60

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

schematic impulse sealer

Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Contextual Info: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or