CL5861 Search Results

Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

BPW22A

Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8
Contextual Info: Contents Page Page New product index Combined index and status codes viii x Mullard approved components BS9000, CECC, and D3007 lists CV list Integrated circuits Section index xliii 1 5 Standard functions LOGIC FAMILIES CMOS HE4000B family specifications CMOS HE4000B family survey

senju M705 solder paste

Abstract: Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification
Contextual Info: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

OT239

Abstract: BT100a 02 CQX82A TRIO TA 80W CV7351 ZP1481 CV2154 ZP1430 triac mw 151 500r PL5727
Contextual Info: Milliard quick reference guide 1978/79 — discrete semiconductors — passive components — valves and tubes This guide gives quick reference data on Mullard electronic components. The information is deliberately abbreviated to give a rapid appreciation of salient characteristics, and to

CL586

Abstract: DC100V FH12 2FPC FH28H 50S05SH FH28-68S K2432 CL586-1810-3
Contextual Info: 掲載している製品の特性及び仕様は参考値です。製品のご使用に当たっては、最新の納入仕様書／参考図にてご確認下さい。 RoHS非適合製品については生産中止予定です。RoHS対応製品につきましては、RoHS対応品検索して頂くか、弊社営業担当へご相談下さい。

senju m705 solder paste

Abstract: Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
Contextual Info: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

FH28-80S-DC

Abstract: FH28-55S-0
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

fpc 0,5 mm pitch

Abstract: FH1940S05SH
Contextual Info: NEW 0.5 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit Connectors FH19 Series ●0.9 mm Height incorporates the Flip-Lock Actuator System 30 pos. Shown 0.9mm 17m 3m m m ●Enclosed construction FPC FPC FPC FPC Completely enclosed bottom surface

FH12

Abstract: CL586 FH28D-20S-0 FH28E FH28H 40S05S CL586-1803-8-05
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

FH28_series

Abstract: FH28 series FH12 IEC61249-2-21 FH28-15S-0 FH28E FH28-10S-0 30S05
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.5 mm Pitch, 2.55 mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors

senju m705 solder paste

Abstract: senju solder paste Senju M705 Senju metal solder paste Senju M705-221CM5 SENJU 221CM5 senju M705 solder paste data sheet M705 solder paste stiffener
Contextual Info: 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

D 13007 K

Abstract: 201C CL586 DC100V M705 T 13007
Contextual Info: 掲載している製品の特性及び仕様は参考値です。製品のご使用に当たっては、最新の納入仕様書／参考図にてご確認下さい。 RoHS非適合製品については生産中止予定です。RoHS対応製品につきましては、RoHS対応品検索して頂くか、弊社営業担当へご相談下さい。

SEC E 13007 - 2

Abstract: sec 13007 sec E 13007 E 13007 0
Contextual Info: NEW 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors FH 23 Series ●Staggered termination configuration. Only 1.25 mm above the board. Leadless type Completely enclosed bottom surface Lead type 1.25mm •Features 1. FPC low insertion force and high holding force