CHOMERICS T710 Search Results

T443

Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Contextual Info: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs

D1065

Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet
Contextual Info: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21

E7221

Abstract: 865g Motherboard 775 motherboard BGA reflow guide Chomerics T710 6700PXH 6702PXH chipset reflow profile FOXCONN 865gv foxconn MOTHERBOARD
Contextual Info: R Intel E7221 Memory Controller Hub MCH Thermal/Mechanical Design Guide September 2004 Document Number: 303632-001 R Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice.

amd Power and Thermal

Abstract: k5 amd Chomerics T710 amd catalog "electrical connector"
Contextual Info: THERMAL MANAGEMENT SOLUTIONS FOR AMD K5 and K6 Active heat sinks for high performance microprocessors PASSIVE Wakefield Engineering heat sinks are available for AMD’s K5 and K6 microprocessors. These processors are used in personal and networked computers

Chomerics T710

Abstract: A13494
Contextual Info: COLUSA 860 CHIP SET COOLING SOLUTIONS Part # 23408 Part # 23409 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 860 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available

Chomerics T710

Abstract: A13494 a1349
Contextual Info: TEHAMA 850 CHIP SET COOLING SOLUTIONS Part # 23410 Part # 23411 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 850 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available

Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

Intel reflow soldering profile BGA

Abstract: Intel reflow soldering profile BGA ich7 ich7 bga ICH7 C92237-001 Intel reflow soldering profile BGA intel intel package drawings 6702PXH BGA OUTLINE DRAWING T-710
Contextual Info: Intel 3000 and 3010 Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide August 2006 Reference Number: 313955 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

MIL-C-47113

Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

T405R

Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Contextual Info: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide

retention mechanisms

Abstract: AAVID Thermal Products
Contextual Info: HEAT SINKS FOR INTEL’S CELERON MICROPROCESSOR OPTIMIZED FOR OEM INSTALLATION An array of Low Cost Solutions for the Pentium® II in the Single Edge Processor Package S.E.P.P. ASSEMBLY VIEW FEATURES: • Scalable passive solutions • Optimized for cost performance with

Chomerics T710

Abstract: PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2
Contextual Info: R Intel 845 Chipset Thermal and Mechanical Design Guidelines Design Guide September 2001 Document Number: 298586-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

Contextual Info: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm

855GM

Abstract: 82801DB intel chipset g 41 motherboard no display intel 845gv MOTHERBOARD CIRCUIT 852GME foxconn motherboard T411 845G 855GME T-710
Contextual Info: Intel 855GME and Intel® 852GME Chipset Memory Controller Hub MCH Thermal Design Guide for Embedded Applications October 2003 Revision 1.0 Order Number: 273838-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

845GL

Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
Contextual Info: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

CEBF0145451601

Abstract: EBF45001-20B CEBF0145451601-00 heatsink Chomerics T710
Contextual Info: Model : CEBF0145451601-00 For 45 x 45 mm Chip Set BGA Cooler EBF45001-20B SPECIFICATION COOLER FAN Total dimension 45*45*20 h mm Weight 35g Rth 1.3 ° C/W HEATSINK Dimension 40*40*10(h)mm. Bearing Vapo Voltage 5V.DC Current 0.07Amp Speed 7000 R.P.M. Material of fin

Chomerics T710

Abstract: CEBF0135351602-00 heatsink plastic ul94v0 air cooler fan 5V cooler EBF35001-16BK
Contextual Info: Model : CEBF0135351602-00 For 35 x 35mm Chip Set BGA Cooler EBF35001-16BK SPECIFICATION COOLER FAN Total dimension 35*35*16 h mm Weight 18g Rth 2.32 ° C/W HEATSINK Dimension 30*30*6(h)mm. Bearing Vapo Voltage 5V.DC Current 0.13Amp Speed 9500 R.P.M. Material

intel 845

Abstract: MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard
Contextual Info: R Intel 845 Chipset Thermal and Mechanical Design Guidelines for SDR Design Guide January 2002 Document Number: 298586-002 R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual

extrusion

Abstract: heatsink CEBF0142421601-00 Chomerics T710 VAPO
Contextual Info: Model : BGA Cooler CEBF0142421601-00 For 42.5 x 42.5 mm Chip Set EBF42.5001-20BK SPECIFICATION COOLER FAN Total dimension 42.5*42.5*16 h mm Weight 30g Rth 1.5 ° C/W HEATSINK Dimension 40*40*10(h)mm. Bearing Vapo Voltage 5V.DC Current 0.07Amp Speed 7000 R.P.M.

Chomerics T710

Abstract: heatsink 27X27MM
Contextual Info: Model : CEBF0127271803-00 For 27 x 27mm Chip Set BGA Cooler EBF27005-18BK SPECIFICATION COOLER FAN Total dimension 27*27*18 h mm Weight 13g Rth 3.62 °C/W HEATSINK Dimension 20*20*8(h)mm. Bearing Vapo Voltage 5V.DC Current 0.17Amp Speed 15000 R.P.M. Material

Radian Heatsinks

Abstract: Chomerics T710 heatsink CS2290 IXF1110 Intricast Company
Contextual Info: 25mm Round Pin BGA Heatsink / 5-Pack home > shop > additional heatsinks > cs2290 Submit Query 25mm Round Pin BGA Heatsink / 5-Pack CS2290 Thermal Resistance °C/W Heatsink Size Weight (W x L x H) oz. 200 lfm 400 lfm 600 lfm 25.0 mm x 25.0 mm x 9.8 mm (0.2)

Contextual Info: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: HI-TEMP FAN HEAT SINK – FEX Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprint 35x35 mm and 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: HI-TEMP FAN HEAT SINKS – FHE SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 45.0