CERAMIC FLATPACK SOCKET Search Results

RadTol Eclipse FPGA

Abstract: SW-DIP JP35 C143 T transistor fpq-352 C143 E S S transistor D 1413 transistor UT8RHEEB-208C H11-201 SN74HC14D
Contextual Info: Standard Products UT8RHEEB-208C RadTol Eclipse FPGA UT6325 Evaluation Board Preliminary Data Sheet September 2008 www.aeroflex.com/FPGA INTRODUCTION FEATURES ‰ User configurable evaluation board for the UT6325 RadTol Eclipse FPGAs ‰ Supports the 208 ceramic quad flatpack

L1A4474

Abstract: L1A4 k1698
Contextual Info: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.

xc68360

Contextual Info: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.

ceramic QFP Package 100 lead

Abstract: 5998a 33.8m AN 7056
Contextual Info: Model 5998A 240 Lead QFP Test Clip with PGA, .50 mm Lead Pitch FEATURES: Test clips provide the user with an easy means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips. The clip mechanically attaches to a surface mounted chip.

5998

Contextual Info: Modl 5998AL, 5998AL-1 240 Lead QFP Locking Test Clip, 0.50 mm Lead Pitch FEATURES: Locking test clips provides easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips. The special locking fingers at each corner attach to the body of the chip and hold the clip firmly against the chip leads.

7C245

Abstract: b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128
Contextual Info: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW

16v8 PLD

Abstract: 48C101 7c63000a 7C128 2061A B1225 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 C = CMOS B = BiCMOS SUFFIX -45 D M B -70 S C -35 P C -15 J C -25 AS C -5 J C FAMILY CMOS SRAM - FAST

CERAMIC QUAD FLATPACK CQFP

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device
Contextual Info: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW

HS-1840ARH

Abstract: 5962F9563002VYC CERAMIC FLATPACK hs-1840RH 5962F9563002QXC 5962F9563002QYC 5962F9563002VXC HS-1840 CDFP3-F28 1840arh
Contextual Info: HS-1840ARH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection July 1997 Description Description • Pin-to-Pin for Harris’ HS-1840RH and HS-1840/883S • MIL-PRF-38535 Screened to DSCC SMD 5962F95630

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

HS9-1840BRH-Q 5962F9563003VYC

Abstract: hs9-1840aeh HS-1840 HS9-1840ARH-Q 5962-95630 cdfp3-f28 5962F9563002VYC smd transistor ea HS-1840BEH 5962F9563003VYC
Contextual Info: Rad-Hard 16 Channel BiCMOS Analog Multiplexer with High-Z Analog Input Protection HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Features The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed

HS-1840ARH

Contextual Info: HS-1840ARH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection July 1997 Description Description • Pin-to-Pin for Harris’ HS-1840RH and HS-1840/883S • MIL-PRF-38535 Screened to DSCC SMD 5962F95630

HS-1840ARH

Contextual Info: Rad-Hard 16 Channel BiCMOS Analog Multiplexer with High-Z Analog Input Protection HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Features The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed

smd marking f2

Abstract: 5962F9563002VYC smd transistor ea HS-1840 hs1840 HS9-1840ARH-Q smd 1n4002 HS-1840ARH
Contextual Info: Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection HS-1840ARH, HS-1840AEH, HS-1840BRH Features TheHS-1840ARH, HS-1840AEH, HS-1840BRH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil RadHard Silicon Gate, bonded wafer, Dielectric Isolation process. They are

HS-1840ARH

Abstract: 5962F9563002VYC HS-1840 hs1840 HS9-1840ARH-Q 5962-95630 5962F9563002QXC 5962F9563002QYC 5962F9563002VXC HS-1840RH
Contextual Info: HS-1840ARH, HS-1840BRH Features The HS-1840ARH, HS-1840BRH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Contextual Info: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the

KD 2107

Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C

TO metal package aluminum kovar

Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
Contextual Info: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

Contextual Info: Radiation Hardened, Low Noise Quad Operational Amplifiers HS-5104ARH, HS-5104AEH Features The HS-5104ARH, HS-5104AEH are radiation hardened, monolithic quad operational amplifiers that provide highly reliable performance in harsh radiation environments. Excellent noise characteristics coupled with a unique array of

HS-1840ARH

Abstract: smd transistor marking F4 63002VXC "top mark" intersil smd transistor marking A3 F5 smd marking transistor SMD T28 5962F9563002QXC 5962F9563002VXC HS-1840RH
Contextual Info: HS-1840ARH Data Sheet July 27, 2009 Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection FN4355.2 Features • Electrically Screened to SMD # 5962-95630 • QML Qualified per MIL-PRF-38535 Requirements The HS-1840ARH is a radiation hardened, monolithic 16

diode databook package outline

Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type – –

TAA710

Contextual Info: /xPB100422 256 X 4-Bit 100K ECL RAM W NEC Electronics Inc. Description Pin Configurations The fiPB100422 is a very high-speed 100K interface ECL RAM organized as 256 words by 4 bits and designed with noninverted, open-emitter outputs and low power con­ sumption. Two versions with fast access times of 7 or

Contextual Info: Í*PB100422 256 X 4-Blt 100K ECL RAM NEC Electronics Inc. Description Pin Configurations The iiPB100422 is a very high-speed 100K interface ECL RAM organized as 256 words by 4 bits and designed with noninverted, open-emitter outputs and low power con­ sumption. Two versions with fast access times of 7 or