CDFP Search Results

cdfp3-f28

Abstract: dip 28 dimension
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

DG509A

Abstract: CERAMIC FLATPACK 20pin dg509aal
Contextual Info: SCOPE: MONOLITHIC CMOS, ANALOG MULTIPLEXER Device Type 01 02 Generic Number DG508AA x /883B DG509AA(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter K L P Z Mil-Std-1835 GDIP1-T16 or CDIP2-T16 CDFP4-16

Contextual Info: MECHANICAL DATA MCDF001 – JANUARY 1997 HBK R-CDFP-F32 CERAMIC DUAL FLATPACK 0.006 (0,15) 0.004 (0,10) 0.117 (2,97) 0.097 (2,46) 0.033 (0,84) 0.027 (0,69) 0.336 (8,53) 0.324 (8,23) 0.310 (7,87) 0.290 (7,37) 0.415 (10,54) 0.405 (10,29) 16 17 0.755 (19,18)

R-CDFP-F20

Contextual Info: MECHANICAL DATA MHRR001 – MAY 1995 HR R-CDFP-F20 CERAMIC DUAL FLATPACK 0.100 (2,54) MIN 1 20 0.050 (1,27) TYP 0.715 (18,16) 0.685 (17,39) 0.022 (0,56) 0.015 (0,38) 10 11 0.500 (12,70) 0.480 (12,19) 0.370 (9,40) 0.250 (6,35) 0.035 (0,89) 0.025 (0,64) 0.100 (2,54)

dual flatpack

Abstract: 634 transistor
Contextual Info: MECHANICAL DATA MCDF002 – NOVEMBER 1995 HKD R-CDFP-F50 CERAMIC DUAL FLATPACK 0.665 (16,90) 0.634 (16,10) 1 50 0.031 (0,80) 0.843 (21,40) 0.811 (20,60) 0.766 (19,45) 0.746 (18,95) 0.020 (0,50) 0.012 (0,30) 25 26 0.370 (9,40) 0.250 (6,35) 0.015 (0,38) MIN

78 hkc

Contextual Info: MECHANICAL DATA MCFP011A – JANUARY 1995 – REVISED JANUARY 1997 HKC R-CDFP-F64 CERAMIC DUAL FLATPACK WITH NCTB 41,14 SQ 40,13 25,91 24,89 19,43 18,54 0,66 MIN 3,81 2,54 1,78 1,40 33 64 11,30 10,67 1 32 8,13 7,49 4,70 3,68 0,25 0,15 0,20 0,11 1,02 0,76

CDFP4-F24

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

CDFP3-F14

Abstract: K14.A Package
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

5962-8750401XA

Abstract: qml-38535 5962-8750401EA CDFP4-F16 GDFP2-F16 GDIP1-T16 AS10H504F16
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R029-92. thn 91-11-22 Mionica L. Poelking B Changes according to NOR 5962-R130-93. tvn 93-04-12 Thomas M. Hess C Add package CDFP4-F16. Change document to current electronic format.

cdfp4-f16

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

Contextual Info: MECHANICAL DATA MCDF003A – JANUARY 1998 HKE R-CDFP-F36 CERAMIC DUAL FLATPACK 0.125 (3,18) 0.096 (2,44) 0.009 (0,23) 0.003 (0,08) 0.045 (1,14) 0.026 (0,66) 0.397 (10,08) 0.385 (9,78) 0.515 (13,81) 0.505 (12,83) 18 0.310 (7,87) 0.250 (6,35) 19 0.850 (21,59)

cdfp4-f16

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

Contextual Info: MECHANICAL DATA MCFP011A – JANUARY 1997 HKC R-CDFP-F64 CERAMIC DUAL FLATPACK WITH NCTB 41,14 SQ 40,13 25,91 24,89 19,43 18,54 0,66 MIN 3,81 2,54 1,78 1,40 33 64 11,30 10,67 1 32 8,13 7,49 4,70 3,68 0,25 0,15 0,20 0,11 1,02 0,76 0,50 4073160/C 09/96 NOTES: A.

10H524

Abstract: 5962-8756001ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 "5962-8756001FA"
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes in Table I. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs

qml-38535

Abstract: CDFP4-F16 GDFP2-F16 GDIP1-T16 10h576
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R106-93. - ltg 93-03-29 Monica L. Poelking B Add package CDFP4-F16. Change document to current electronic format. Editorial changes throughout. - les 98-02-04 Raymond Monnin

Contextual Info: SPP-10E-LR-CDFP Features  Support 10GBASE-LR/LW and Data Center application  Up to 1.4km transmission on SMF  1310nm FP laser and PIN receiver  SFI high speed electrical interface  2-wire interface with integrated Digital Diagnostic monitoring

Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes to Table I. Figure 4 added. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs

Contextual Info: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16

Contextual Info: MECHANICAL DATA MCFP008 – OCTOBER 1994 HKA R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.200 (5,08) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places 0.370 (9,40) 0.250 (6,35)

CDFP

Contextual Info: MECHANICAL DATA MCFP009B– JANUARY 1995 – REVISED JUNE 1999 HKB R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.350 (8,89) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places

MCFP008

Abstract: R-CDFP-F28
Contextual Info: MECHANICAL DATA MCFP008 – OCTOBER 1994 HKA R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.200 (5,08) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places 0.370 (9,40) 0.250 (6,35)

CDFP3-F10

Abstract: k10a
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B) 10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE e A INCHES A -A- D -BPIN NO. 1 ID AREA b E1 0.004 M H A-B S Q D S S1

Contextual Info: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16

R-CDFP-F50

Contextual Info: MECHANICAL DATA MCDF002 – NOVEMBER 1995 HKD R-CDFP-F50 CERAMIC DUAL FLATPACK 0.665 (16,90) 0.634 (16,10) 1 50 0.031 (0,80) 0.843 (21,40) 0.811 (20,60) 0.766 (19,45) 0.746 (18,95) 0.020 (0,50) 0.012 (0,30) 25 26 0.370 (9,40) 0.250 (6,35) 0.015 (0,38) MIN