CALCHIP Search Results

63A02

Contextual Info: Metal Film Milli-Ohm Chip Resistor CRM Document No. CRM Issued Date 2009/01/09 Page 1 / 10 Metal film milli-ohm (10~300mΩ) chip resistors (CRM) are made in chip size from 0201 to 2512 for Calchip. These resistors apply as current detecting resistor for

Resistor R010

Abstract: CRM25 11 lot no 05710 JIS-C5202 R010 R015 RESISTOR 0201 land MARKING OF CHIP RESISTOR CT tape resistors 0201
Contextual Info: Metal Film Milli-Ohm Chip Resistor CRM Document No. CRM Issued Date 2009/01/09 Page 1 / 10 Metal film milli-ohm (10~300mΩ) chip resistors (CRM) are made in chip size from 0201 to 2512 for Calchip. These resistors apply as current detecting resistor for

TCF Series

Contextual Info: TCF Series Thin Film Chip Inductor Thin Film Chip Inductor ▓Scope －Calchip’s 0201 and 0402 series inductor is a photo lithographically etched single layer ceramic chip. Calchip’s design provides high SRF, excellent Q, and superior temperature stability. This highly stable inductor family is specifically

JIS 5102

Abstract: Cal-Chip Electronics JIS C 5140 C0121 3528 ic voltage Cal-Chip c0141 100 mfd tantalum capacitor b0076 d0327
Contextual Info: Cal-Chip Electronics, Incorporated TC SERIES TC Series Tantalum Solid Electrolytic Capacitors - Resin Molded Chip Type, Standard Type TC SERIES: The TC Series is designed for hybrid circuit and low profile printed circuit board applications where inductance is to be minimized, or where substrate space is

DS1304

Abstract: aem r10k SMP3316-103M ds1303 renco 4r7 SMTDR54-120M smtdr75 SMTDR75-680K SMTDR75-221K MLF1608A1R0KT
Contextual Info: Bourns P/N CI100505-1N0D CI100505-1N2D CI100505-1N5D CI100505-1N8D CI100505-2N2D CI100505-2N7D CI100505-3N3D CI100505-3N9D CI100505-4N7D CI100505-5N6D CI100505-6N8J CI100505-8N2J CI100505-10NJ CI100505-12NJ CI100505-15NJ CI100505-18NJ CI100505-22NJ CI100505-27NJ

Contextual Info: TOP LED, 4014, White, 60mA Feature ◆ ◆ ◆ ◆ CC-*MI4014DS-DF-N Viewing angle:120 deg The materials of the LED dice is InGaN 4.0mmx1.4mm×0.7mm RoHS compliant lead-free soldering compatible Package Outline 1 2 2 1 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING

Contextual Info: AH312-S8G 2 Watt, High Linearity InGaP HBT Amplifier Applications •    Final stage amplifiers for Repeaters Mobile Infrastructure Driver stage for High Power Amplifier LTE / WCDMA / EDGE / CDMA SOIC-8 Package Product Features     

Contextual Info: Cal-Chip Electronics, Incorporated GHF SERIES Multilayer Chip Inductors For High Frequency FEATURES • Multilayer inductor made of advanced ceramics with low-resistivity silver used as internal conductors provides excellent Q and SRF characteristics. • Designed to address surface mount inductor needs for applications above 100MHz.

Contextual Info: Cal-Chip Electronics, Incorporated Aluminum Electrolytic Capacitors CV2 CE32 Type Features ΘʳVertical chip type miniaturized for 5.5mm, high capacitors SPECIFICATIONS Performance Items Operating Temperature Range Capacitance Tolerance -40к ~ +85к ̈́ 2 0%

Contextual Info: Cal-Chip Electronics, Incorporated Aluminum Electrolytic Capacitors CV CE32 Type Features Θʳ85к, 2000 hours assured ΘʳChip type large capacitance capacitors SPECIFICATIONS Performance Items Operating Temperature Range Capacitance Tolerance -40к ~ +85к

eeprom programmer schematic 24c08

Abstract: motorola TP230 eeprom programmer schematic 24c02 transistor C458 C458 datasheet GMC21X7R104K50NT philips c399 RM10F1000CT IC 24c08 transistor c331
Contextual Info: Preliminary ThunderSWITCH 8/3 Schematics Description and Schematics Reference Guide: SPWA023 Networking Business Unit Revision 0.2 April 1998 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or

Cross Reference Guide

Abstract: lytic cross reference CV Series sanyo Rubycon CE data sheet REV RUBYCON nichicon MVK Sanyo CV Sanyo cv-bs diode cross reference rubycon ce
Contextual Info: CV Series Aluminum Electrolytic Cross Reference Guide Cal-Chip Series NIC CROSS NICHICON CROSS PANASONIC CROSS RUBYCON CROSS CV2 NACE UUR, UWX ECE-V A CV3 NACE UUR, UWX ECE-V(A) CVC NACL NACEN CVB UWP ECE-V(N), EEV-HP EEV-HA, EEV-HB UCC CROSS SANYO CROSS

HALO TG110

Abstract: cih10 MURATA LQW18A MURATA BLM MURATA LQW15A MLF1608A CIH03T Toroids Epcos LK3216 ferrite sheet panasonic
Contextual Info: COMPETITOR CROSS REFERENCE GUIDE 2008 *Check our website for detailed dimensions → www.abracon.com/magnetics.htm Abracon Competitor Cross Reference Guide-I Category Thin Film Inductor Abracon Series L or Z Range Idc (A) Competitor 1 Cross Series Competitor

NL Series

Abstract: NL3225 NL4532 NL3225T2R2 NL4532T100 NL-Series NL3225T221 nl2520
Contextual Info: Cal-Chip Electronics, Incorporated NL SERIES Molded Chip Wirewound Inductors OUTLINE • These revolutionary, high reliability winding type leadless wound chip inductors for automatic mounting have been developed in response to the trend toward higher density of parts in

8P4R 0805

Abstract: CN34J an 17820 1001 f resistor 8P4R CN24
Contextual Info: Cal-Chip Electronics, Incorporated CN SERIES Thick Film Chip Resistor Arrays CONSTRUCTION FEATURES • High Density • Automatic Placement • Convex CONVEX TERMINATION DIMENSIONS IN MM Unit: mm TYPE L W t P a b c CN34 3.2±0.1 1.6±0.15 0.55±0.1 0.8±0.5

RM Series Thick Film Chip Resistors

Abstract: RM04 RM06 rm14 RM10 RM12 RM20 RM25 976 JRC RM-02
Contextual Info: Cal-Chip Electronics, Incorporated RM SERIES Thick Film Chip Resistors - RM Series “Fixed Chip Resistors” manufactured for more compact electronic components and automatic mounting system. These Chip Resistors have electrical stability and mechanical stress

Contextual Info: Cal-Chip Electronics, Incorporated Aluminum Electrolytic Capacitors 1. Carrier Tape Fig. 1-1 Fig. 1-2 Unit: mm ӽDxL A B ӽd F P P1 P2 t1 t2 W W1 Fig. No. 4×5.3 5.0 5.0 1.5 5.5 8 2.0 4.0 0.4 5.8 12.0 1.75 1-1 4×5.7 5.0 5.0 1.5 5.5 8 2.0 4.0 0.4 6.2 12.0

CR14

Abstract: XRT71D00 XRT73L00 XRT73L02 Jaro Components
Contextual Info: TAN-042 Designing the XRT71D00 and the XRT73L00 Devices to operate in the Host Mode, and to be accessed via a single Chip Select pin. Preliminary July 19, 2001 Revision 1.03 DESIGNING THE XRT71D00 AND THE XRT73L00 DEVICES TO OPERATE IN THE HOST MODE, AND TO

Contextual Info: MULTILAYER CERAMIC CAPACITORS High Q/Low ESR Series GHQ 1. INTRODUCTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. CCE's GHQ series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,

RC-2609A

Contextual Info: Cal-Chip Electronics, Incorporated RN SERIES Thin Film Chip Resistors FEATURES • Surface Mount Devices SMD • Precision Tolerances of ±0.5% to ±0.1% • Temperature Coefficients of ±50ppm/°C and ±25ppm°C • Precision Performance • Space Saving Construction

Contextual Info: Cal-Chip Electronics, Incorporated Multilayer Ceramic Chip Capacitors GMC SERIES Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of

RM Series Thick Film Chip Resistors

Contextual Info: Cal-Chip Electronics, Incorporated RM SERIES Thick Film Chip Resistors - RM Series “Fixed Chip Resistors” manufactured for more compact electronic components and automatic mounting system. These Chip Resistors have electrical stability and mechanical stress

CS1608

Contextual Info: Shielded SMD Power Inductor－CS EPOXY 680 D F I J H E •Dimensions ■Features －With magnetically shielded against radiation －CS1608 can help to achieve longer battery life significantly in handheld communication devices. －CS3316 / 5022 designed for the higher current

Contextual Info: Thin Film Precision Chip Resistor－RN Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 871 7 8 9 2 Resistor Layer (NiCr)