CAD 8004 Search Results

software of pcb design

Contextual Info: System-Level Design Capabilities Using Active-CAD From Aldec B 20 y complementing the Xilinx Foundation Series software with a new configuration of Aldec’s Active-CADTM product, you get system-level design capabilities. The “Active-CAD for Xilinx” promotion

2Y194

Abstract: 81-8004B cad 8004 s000 MRU 030 060
Contextual Info: NOTES: UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE ± .010” [.254mm], EDD CAD#81-8004B-* DRAWING NO.: REV. 81-8004B-* A .060 [1.52mm] .015 [0.38mm] SB .121 [3.06mm] MATER|ALS: 2X .020 J [0.51 mm] SUBSTRATE: ALUMINA

Contextual Info: Custom Interconnect Solutions Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Custom Interconnect Solutions P.C. CAD Design Automated Solder Stencilling and Laser Inspection Advanced Interconnections In-House

Applied Microsystems codetest

Abstract: superTAP
Contextual Info: SuperTAP Advanced Development Tool for AMD AM 186/188™ Architectures For Am 186/188™ ED, EM, ER, ES with CAD-UL XDB Debugger HIGHLIGHTS Compact and feature-rich, SuperTAP is the best development tool in the industry. SuperTAP™—Price and Performance

Contextual Info: Custom Interconnect Solutions 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Custom Interconnect Solutions P.C. CAD Design Automated Solder Stencilling and Laser Inspection

1N5B19

Abstract: D1N5818 lN5819 Diode 1n5b19 1n5819 melf 1N5B18 LLS819 1N5818 LL5B19 Diode 1n581
Contextual Info: B K C INTERNATIONAL 1 1 7 = ^ 0 3 3DE D 1N5818,1N5819, LL5818, LL5819 G O O D B tb S • Téléphoné <506 681-0392 • TeleFax 508) 681-9135 CaD Of write fora catalog of «11our fine products. 1 Amp Schottky Power Rectifiers Features: - Low Forward Voltage Drop

250-36-UNS-2A

Abstract: C17300 250-36UNS
Contextual Info: REV .575 14.6mm .375 (9.5mm) .065 (1.7mm) REVISIONS DESCRIPTION DATE 01 7 REDRAWN AND UPDATED PER GEN ECN 80-0492 REDRAWN IN CAD PER ECN 88-0678 .500 SQ' (12.7mm) «3 APPROVED JB 12/29/86 EFH 12/10/90 BB 12/17/90 .340 TYP (8.6mm) H h .031 DIA (0.8mm) 05M

Contextual Info: cat15 5/22/01 9:42 AM Page 84 Peel-A-Way Dual In-Line Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Peel-A-Way® DIP Socket Terminal Carriers

ls324

Abstract: hls socket
Contextual Info: cat15 5/22/01 9:42 AM Page 82 Open Frame Dual In-Line Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Standard & High Temperature Open Frame DIP Sockets

Contextual Info: B ADVANCED . INTERCONNECTIONS Custom Interconnect Solutions 5 Energy Way, P.O, Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 •Email advintcorp@aol.com ■Internet http://www.advintcorp.com C u s to m In te rc o n n e c t S o lu tio n s

ADED 432

Abstract: TY 6004
Contextual Info: 13 12 11 10 43223 NOTES: O PTIONAL FLAN G E [FOR F LU S H MOUNT 1) M ATERIAL: HOUSING: G LA S S F ILLED NYLON, UL94V-0, COLOR: BLACK • UNSHIELDED GANGED JACK A SSEM B LY SEE SH EETS 5 INSULATOR: G LA S S F ILLED NYLON, UL94V-0, COLOR: BLACK TERM INALS: PHOSPHOR BRONZE: .012/ 0.30) THICK

Contextual Info: 10 B 5.08 io.0 5 REF. NON-ACCUMALATIVE ( 1.45- 1.57 ) TYP. .057-.062 N o OF CCTS. 2 3 R E C O M M E N D E D PCB HOLE DIMENSIONS 4 5 TIPS O N L Y 6 7 8 9 10 11 12 13 14 15 16 17 18 19 WAFER MATERIAL NYLON 6 /6 , 94V-2. TERMINAL PIN, (1 .1 4 )/.0 4 5 DIA.-BRASS

Clarostat Sensors

Abstract: opto-switch Clarostat Sensors and Controls 800-448-2900 optoswitch
Contextual Info: CUSTOM CAPABILITIES THE OPTOSWITCH GOAL IS TO PROVIDE THE QUALITY, SERVICE, AND TECHNOLOGY REQUIRED BY OUR CUSTOMERS WHICH ALLOWS THEM TO COMPETE IN A DYNAMIC MARKETPLACE. OptoSwitch provides its customers sensing solutions from the chip level to fully tested hybrid

9LPR310BGLF

Abstract: CLEVO samsung led tv ue service manual samsung lcd tv power supply schematic rqa130 PCI7412 2sd 588 IT8510TE CMS PJ 86 LV C8738
Contextual Info: Preface Notebook Computer M540/M545N/M550/M555N Service Manual Preface I Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are

ul e35586

Abstract: VG95343 ul e35586 shrink sleeve raychem heat shrinkable sleeve Heat Shrinkable Tubing and Caps raychem M23053/8-004-C E35586 raychem heat shrink terminations NASA SP-R-0022A M23053
Contextual Info: Part Details for P/N: RW-175-1/8-X-STK Products | Catalog | Brands | Industries | Commerce | Supplier | Contact Us | About | Home Home Heat Shrinkable Products Heat Shrinkable Tubing and Caps RW-175-1/8-X-STK M23053/8-004-C Part Number Search Active Not Reviewed for ELV/RoHS Compliance

Contextual Info: 10 6 NOTES : I - 0 - I 0 0 . 1 B lA (g > lB l 1. MATERIAL i HOUSING : (a) HIGH TEMP. NYLON .GLASS FIBER F IL L E D .U L 9 4 V -0 , COLOR: BLACK, (b) POLYESTER , GLASS FIBER F IL L E D ,U L 9 4V -0, COLOR: WHITE, 0 0 .9 2 * 0 .0 8 TYP TERMINAL : PHOSPHOR BRONZE

siemens ha 8000

Abstract: LA 42071 electronic components ltd SIEMENS K 30 SIEMENS DRIVE
Contextual Info: Top Tech Semiconductors - Worldwide D K Siemens AG Österreich Postfach 326 1031 Wien (01) 71711-5661 Usi 1372-10 FAX (01) 71711-5973 (*us) Siemens Ltd., Head Office 544 Church Street Richmond (Melbourne), Vic. 3121 © (03) 42071 11,1x130425 FAX (03) 4207275

PK1001

Contextual Info: Global PartnerChip for System s on Silicon Siem ens A G Österreich Erdberger Lände 26 1030 Wien S t +43 -1-1707-35611 Fax (+43)1-1707-55973 Email: elisabeth.schwarz@siemens.at (AUS) Siem ens Ltd., Head Office 544 Church Street Richmond (Melbourne), Vic. 3121

Anaren Microwave

Abstract: Anaren rfp Anaren C16A50Z4
Contextual Info: RFP-2 brochure.qxd 11/9/06 1:17 PM Page 1 Does your plan call for an extraordinary resistive component? 800-411-6596 > www.anaren.com RFP-2 brochure.qxd 11/9/06 1:17 PM Page 2 Introducing the new, ‘powerready’ resistive component line from Anaren. Make it your new

Contextual Info: EPCOS Standard Components Service Our Local Representatives Passive components straight from the producer - you are right in touch with the source through our global sales network. Online links with our production plants plus allround component consulting are just a few examples of the

UL2493

Abstract: UL2919 UL2464 6251-10 70005701 78414
Contextual Info: 524-2012:QuarkCatalogTempNew 8/23/12 10:51 AM Page 524 TEST & MEASUREMENT 3 Multipair Computer Cables Low Capacitance Cables for EIA RS-232 and EIA RS-422 Applications RoHS Stranded Tinned Copper TC conductors, polypropylene insulated, twisted pairs. Overall 100% Beldfoil + 90% TC braid shield. 28 AWG stranded TC drain wire.

Contextual Info: TopTech Semiconductors. Siemens DK> Siemens AG Österreich Postfach 326 1031 Wien 8 (01 71711-5661 El 1372-10 Fax (01) 71711-5973 Siemens Ltd., Head Office 544 Church Street Richmond (Melbourne), Vie. 3121 S (03) 4207111 02 30425 Fax (03) 4 2072 75 Siemens AG

BSM254F

Abstract: BSM 204-A siemens bsm 284 f BSM 214 A siemens bsm 181 AR BSM101AR siemens bsm 101 AR BB 3656 BSM181 BSM204A
Contextual Info: SIEMENS SIMOPAC Modules Features Applications • • • • • • • • • • Fully insulated Easy to parallel High switching speed capability FREDFET-modules UL-listed Motor controls UPS Switch mode power supplies Welding systems Induction heating

plc siemens

Abstract: ding dong siemens modules GR 70 4x4Mx16 componentes eletronicos 333
Contextual Info: Chip On Board Innovation in Memory Module Technology Initiative for you. Siemens Semiconductors. CHIP ON BOARD CHIP ON BOARD Innovation in memory module technology. Shorter response cycles, more flexibility and logistical challenges lead to new product concepts