C04 06 Search Results

Contextual Info: DUAL IN-LINE PACKAGE 16 PIN CERAMIC DIP-16C-C04 EIAJ code : ∗DIP016-G-0300-5 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 16-pin ceramic DIP DIP-16C-C04 16-pin ceramic DIP (DIP-16C-C04) +0.71 19.30 –0.15 +.028 .760 –.006 R0.64(.025) REF

24-Pin Ceramic DIP

Abstract: DIP-24C-C04
Contextual Info: SKINNY DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C04 EIAJ code : ∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100mil Row spacing 400mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP (DIP-24C-C04) 0.69 .027 30.30 +– 0.33 (1.193 +– .013

Contextual Info: DUAL IN-LINE PACKAGE 14 PIN CERAMIC DIP-14C-C04 EIAJ code : ∗DIP014-G-0300-4 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 14-pin ceramic DIP DIP-14C-C04 14-pin ceramic DIP (DIP-14C-C04) +0.71 19.30 –0.15 .760 +.028 –.006 R0.64(.025) REF

DIP-24C-C04

Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C04 EIAJ code :∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP (DIP-24C-C04) 0.69

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN CERAMIC DIP-14C-C04 EIAJ code :∗DIP014-G-0300-4 14-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-14C-C04 14-pin ceramic DIP (DIP-C14-C04) +0.71 19.30 –0.15

compared CMOS TTL Logic Family Specifications

Contextual Info: [ /Title CD54H C04, CD54H CT04, CD74H C04, CD74H CT04 /Subject (High Speed CD54HC04, CD54HCT04, CD74HC04, CD74HCT04 Data sheet acquired from Harris Semiconductor SCHS117A High Speed CMOS Logic Hex Inverter August 1997 - Revised May 2002 Features Description

DIP-24C-C04

Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C04 EIAJ code :∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN CERAMIC To Top / Package Lineup / Package Index DIP-14C-C04 EIAJ code :∗DIP014-G-0300-4 14-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-14C-C04 14-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP

C06BL

Contextual Info: C04 / C06 / C08 Broadband DC Blocks Low loss resonance free performance FUNCTIONAL APPLICATIONS: Fiber Optic Links, High Isolation Decoupling, LAN’s, VCO Frequency Stabilization, Diplexers, RF/Microwave Modules, Instruments and Test Equipment. Mechanical Specification

C04 06

Abstract: C04BLBB2X5
Contextual Info: C04 / C06 / C08 Broadband DC Blocks Low loss resonance free performance FUNCTIONAL APPLICATIONS: Fiber Optic Links, High Isolation Decoupling, LAN’s, VCO Frequency Stabilization, Diplexers, RF/Microwave Modules, Instruments and Test Equipment. Mechanical Specification

CSR Bluetooth

Abstract: MB-C04 TAIWAN
Contextual Info: CSR Bluetooth Modules MB-C04 Specification Version 1.0 15-May-06 Key Modules For Your Success 2 www.modulestek.com 12F, No.866-8, Jhongjheng Rd., Jhonghe City 235, Taipei, Taiwan Key Modules For Your Success 1. Hardware & Technical Information 3 www.modulestek.com

Z86CCP00ZAC

Abstract: ccp protocol Z86CCP00ZEM Z86E40 35 pin zif cable ZILOG MOUSE CONTROLLER
Contextual Info: CUSTOMER PROCUREMENT SPECIFICATION Z86CCP00ZEM 1 Z8 CCP IN-CIRCUIT EMULATOR FEATURES • Supported Products Packages Emulation OTP Programming 18-Pin PDIP Z86C02/03/C04/06/08/16 Z86E02/031/04/061/08 18-Pin SOIC N/A Z86E02/03/04/06/082 28-Pin PDIP, PLCC, SOIC

spring washer

Abstract: D206 coupling D106 D2101 d2 transistor c04 D1 10D210
Contextual Info: Accessories & Service Mounting accessories Mounting accessories Dimensions 7 D1H8 D2H8 ø30 7 22 Part number Z 121.C02 Spring washer coupling D1=06 / D2=06 Z 121.C03 Spring washer coupling D1=10 / D2=10 Z 121.C04 Spring washer coupling D1=10 / D2=16 Technical data

Contextual Info: 15676 DieLabs.qxp 2/10/06 1:47 PM Page 3 Laboratories High Q Multi-Layer and Broadband Blocking Capacitors C04 C06 C08 C11 C17 0.040” x 0.020” 0.1-10pF Ultra Low ESR 200V Max Filters, Synthesizers VCOs 0.060” x 0.030” 0.1-100pF Max WVDC 250V Amplifiers

DIODE C04 06

Abstract: c04 06 08 diode ERC04
Contextual Info: ERC04 1.2A (200V to 1000V / 1.2A ) Outline drawings, mm GENERAL USE RECTIFIER DIODE ø 4.0 ø 1.0 7.5 28 MIN. 28 MIN. Features Marking Wide voltage class High reliability Color code : Orange C04 Abridged type name Applications 02 Voltage class General purpose rectifier applications

DIODE C04 06

Abstract: c04 06 08 diode c04 02 diode erc04 C04 06 general purpose diode marking code -06 "RECTIFIER DIODE" DIODE C04 10
Contextual Info: ERC04 1.2A (200V to 1000V / 1.2A ) Outline drawings, mm GENERAL USE RECTIFIER DIODE ø 4.0 ø 1.0 7.5 28 MIN. 28 MIN. Features Marking Wide voltage class High reliability Color code : Orange C04 Abridged type name Applications 02 Voltage class General purpose rectifier applications

DIODE C04 06

Abstract: ERC04
Contextual Info: ERC04 1.2A (200V to 1000V / 1.2A ) Outline drawings, mm GENERAL USE RECTIFIER DIODE ø 4.0 ø 1.0 7.5 28 MIN. 28 MIN. Features Marking Wide voltage class High reliability Color code : Orange C04 Abridged type name Applications 02 Voltage class General purpose rectifier applications

Miscellaneous Rectangular Backshells

Abstract: 527 268 527-268
Contextual Info: Miscellaneous Rectangular Backshells 527-268 EMI-RFI Qwik-Ty Banding Backshell for Radial EPXB Connector 527 268 M A03 B02 C04 T B Product Series B = Band Omit for None Basic Number Qwik-Ty® Option (Omit for None) Finish (Table II) Entry Location A, B or C and Dash No.

EHP-C04

Abstract: LED 1w
Contextual Info: EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet High Power LED -1W EHP-C04/NT01A-P01/TR Features z z z z z z z z z Feature of the device: small package with high efficiency Color coordinates: x=0.31, y=0.32 according to CIE 1931 Typical color temperature: 5700 K.

rc oscillator

Abstract: Comparators 512-byte
Contextual Info: Z8 Microcontrollers Consumer Zilog Superintegration Pr oducts Guide 0.5-1K ROM/OTP 512 ROM/OTP Z8 CPU Block Diagram Z8 CPU 64 RAM WDT WDT Device P2 P3 P3 RAM 2 Counter/Timers WDT WDT 2 Comparators 2 Comparators P0 P2 P3 P0 P2 P3 Z86E08/C08/L08 Z86E04/C04/L04

epxb connector

Abstract: glenair connector
Contextual Info: Miscellaneous Rectangular Backshells 527-268 EMI-RFI Qwik-Ty Banding Backshell for Radial EPXB Connector 527 268 M A03 B02 C04 T B Product Series B = Band Omit for None Basic Number Qwik-Ty® Option (Omit for None) Finish (Table II) Entry Location A, B or C and Dash No.

200H

Abstract: 400H HB28C016C6 HB28C032C6 HB28C048C6 Hitachi DSA00190
Contextual Info: HB28C048C6/HB28C032C6 HB28C016C6 CompactFlash 48 MByte/32 MByte/16 MByte ADJ-203-557 Z ’00. 7. 24 暫定仕様 Rev. 0.0 概要 HB 28 C04 8C6 , HB 28 C03 2C6 , HB 28 C01 6C6 は，Co mpactFl ash ™カ−ドで Co mpactFl ash ™仕様に準拠してい

200H

Abstract: 400H HB28C016C6 HB28C032C6 HB28C048C6 Hitachi DSA00190
Contextual Info: HB28C048C6/HB28C032C6 HB28C016C6 CompactFlash 48 MByte/32 MByte/16 MByte ADJ-203-557A Z ’00. 12. 1 Rev. 1.0 概要 HB 28 C04 8C6 , HB 28 C03 2C6 , HB 28 C01 6C6 は，Co mpactFl ash ™カ−ドで Co mpactFl ash ™仕様に準拠してい ます。小型 PC，携帯型情報機器およびデジタルスティルカメラデ−タストレ−ジメディアとして最適です。