C01 12 Search Results

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC FPT-100C-C01 100-pin ceramic LQFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip FPT-100C-C01 100-pin ceramic LQFP (FPT-100C-C01) 16.00±0.20 SQ

736 33

Contextual Info: QUAD FLAT TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN CERAMIC To Top / Package Lineup / Package Index MQP-80C-C01 80-pin ceramic MQFP Lead pitch 0.8 mm Lead shape Straight Motherboard material Ceramic MQP-80C-C01 80-pin ceramic MQFP (MQP-80C-C01)

Himax

Abstract: KN20 hx8352
Contextual Info: DOC No. HX8352-C01(T -DS ) HX8352-C01(T) 240RGB x 432 dot, 262K color, with internal GRAM, TFT Mobile Single Chip Driver Version 01 May, 2011 HX8352-C01(T) 240RGB x 432 dot, 262K color, with internal GRAM, TFT Mobile Single Chip Driver List of Contents May, 2011

QFJ-32C-C01

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01)

C1995

Abstract: LQFP "100 pin" PACKAGE
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 100 PIN CERAMIC FPT-100C-C01 Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip 100-pin ceramic LQFP FPT-100C-C01 100-pin ceramic LQFP (FPT-100C-C01) 16.00±0.20 SQ (.630±.008) +0.25 13.60 −0.15 SQ

Contextual Info: QUAD FLAT TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN CERAMIC MQP-80C-C01 80-pin ceramic MQFP Lead pitch 0.8 mm Lead shape Straight Motherboard material Ceramic MQP-80C-C01 80-pin ceramic MQFP (MQP-80C-C01) 18.70(.736)TYP INDEX AREA 16.30±0.33 (.642±.013)

Contextual Info: QUAD FLAT TYPE MODULE 80 PIN CERAMIC MQP-80C-C01 80-pin ceramic MQFP Lead pitch 0.8mm Lead shape Straight Motherboard material Ceramic MQP-80C-C01 80-pin ceramic MQFP (MQP-80C-C01) 18.70(.736)TYP INDEX AREA 16.30±0.33 (.642±.013) 0.40±0.10 (.016±.004)

176pin

Contextual Info: QUAD FLAT L-LEADED PACKAGE 176 PIN CERAMIC FPT-176C-C01 Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina 176-pin ceramic QFP FPT-176C-C01 176-pin ceramic QFP (FPT-176C-C01)

QFJ-32C-C01

Contextual Info: QUAD FLAT J-LEADED PACKAGE 32 PIN CERAMIC QFJ-32C-C01 Lead pitch 50mil Package width x package length 450 × 550mil Lead shape J bend Sealing method Cerdip 32-pin ceramic QFJ QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01) 3.44±0.35 (.135±.014) 2.11(.083)REF

QFJ-44C-C01

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01)

quad flat j-leaded package

Abstract: QFJ-44C-C01
Contextual Info: QUAD FLAT J-LEADED PACKAGE 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50mil Package width x package length 650 × 650mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01) 17.53±0.13SQ (.690±.005) +0.25

assembly instruction c01

Abstract: assembly code sma assembly instruction instruction sma
Contextual Info: Montagecode Montagecode Assembly Instruction Montageanweisung C01 assembly code C01 assembly code solder Datum date 12656 20.07.01 BJ Index index Original original Änderung m odification a ^ a ' Datum date Blatt sheet Name name 1/1 Name name Gez. drawn 12.07.90

Contextual Info: QUAD FLAT L-LEADED PACKAGE 120 PIN CERAMIC FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm Base ceramic material Alumina FPT-120C-C01

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC To Top / Package Lineup / Package Index FPT-100C-C01 100-pin ceramic LQFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip FPT-100C-C01 100-pin ceramic LQFP

Contextual Info: DS2404S-C01 DALLAS SEMICONDUCTOR DS2404S-C01 Dual Port Memory Plus Time FEATURES PIN ASSIGNMENT • Bridge for electronic equipment to the 1-W ire MicroLAN • 4096 bits of nonvolatile dual-port memory including real time ciocK/calendar in binary format, program­

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN CERAMIC FPT-176C-C01 176-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-176C-C01 176-pin ceramic QFP

3D plus memory 16

Contextual Info: DS2404S-C01 DALLAS SEMICONDUCTOR DS2404S-C01 Dual Port Memory Plus Time PIN ASSIGNMENT FEATURES • Bridge for electronic equipment to the 1-W ire MicroLAN vcco: 1 ir q n r 2 • 4096 bits of nonvolatile dual-port memory including real time clock/calendar in binary format, program­

SRT2-ROC16 OMRON MANUAL

Abstract: omron srt2-id16 SRT2-ROC16 SRT2-AD04 omron SRT2-OD16-1 CPM2A-30CDR-D CPM2A-40CDR-D SRT2-ID16 MANUAL CPM2A-60CDR-D CQM1-SRM21-V1
Contextual Info: Cat.No. Q103-E1-6 CompoBus/S DATASHEETS Connections to a Wider Range of Slaves Ensured by Upgraded Models Master Conventional models New models C200HW-SRM21 CQM1-SRM21 SRM1-C01 SRM1-C02 SRM1-C01-V1 SRM1-C02-V1 3G8B3-SRM00 3G8B3-SRM01 C200PC-ISA02-SRM C200PC-ISA12-SRM

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01

Contextual Info: DS2404S-C01 DALLAS SEMICONDUCTOR FEATURES DS2404S-C01 Dual Port Memory Plus Time PIN ASSIGNMENT • Bridge for electronic equipm ent to the 1 -W ire MicroLAN • 4096 bits of nonvolatile d u a l-p o rt m em ory including real time clock/calendar in binary format, program ­

Contextual Info: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Part LG-195-8SEF/WK-DT/T-P-1-C01 DATA SHEET DOC. NO : QW0905-LG-195-8SEF/WK-DT/T-P-1-C01 REV: DATE B : 30 - Apr. - 2012 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Contextual Info: DS2404S-C01 DALLAS DS2404S-C01 Dual Port Memory Plus Time s e m ic o n d u c to r FEATURES PIN ASSIGNMENT • Bridge for electronic equipment to the 1-Wire MicroLAN vcccni 1 ÏR Q C E 2 15 □ D X1 • 4096 bits of nonvolatile dual-port memory Including real time clock/calendar in binary format, program­

D 33030

Contextual Info: SPECIFICATIONS FOR LEDMAN LAMP LED Model Q No. : Document No. : Revision No. : LL3301HCWW1-C01 LML-33-030 03 Description: •Square lamp ■ Lens Color: Water Transparent ■ Emission Color: White ■ Viewing Angle :120° ■ No Stopper Dice Material: InGaN